Nonlocal damage based failure models, extraction of crack opening and transition to fracture

International audienceDamage models are capable to represent initiation and somehow crack propagation in a continuum framework. Thus crack openings are not explicitly described. However for concrete structures durability analysis, crack opening through transfer properties is a key issue. Therefore, in this contribution we present a new approach that is able from a continuum modelling to locate a crack from internal variable field and then to estimate crack opening along its path. Results compared to experimental measures for a three point bending test are in a good agreement with an error lower than 10% for widely opened crack (40μm)

Online monitoring of the curing of adhesives with a miniaturised interdigital sensor using impedance spectroscopy

Monitoring adhesives during manufacturing and their lifetime has become increasingly important due to the variety of materials and applications. Impedance spectroscopy is a suitable method for online monitoring of the curing process. We present a miniaturised interdigital structure to monitor the curing process of the adhesives using impedance spectroscopy. Compared to other sensors, our sensor is ultrathin, so that it disappears in the adhesive joint. Therefore, it can remain in the joint and be used for lifetime monitoring. In addition it is suitable for thin adhesive layers due to its fine grid. We demonstrate that the impedance of the sensor embedded in the adhesive gives insight into the curing mechanisms. Therefore monitoring of a dispersion and an epoxy is shown. In addition, the curing cycles can be reliably controlled using this monitoring method. The permittivity of the adhesives is extracted from the impedance measurements, applying analytical models of the electrical field of the interdigital structure