A Hybrid Decision Model for Improving Warehouse Efficiency in a Process-oriented View

published_fina

Vocational education in engineering in the information age

Learning new skills or acquiring new knowledge is becoming part of life for most adults. Indeed, the paradigm of life-long learning has found advocates not only in individuals but also policy-makers. In the information age, life-long learning will be increasingly dependent on the successful application of information and communication technology. This paper outlines recent curriculum developments of this department, highlighting information technology applications for course delivery and management. In catering for the changing needs of local industry, the department seeks to establish partnership with local companies, aiming to expand the department’s scope on life-long learning provision at the same time

An SGBM-XVA demonstrator: A scalable Python tool for pricing XVA

In this work, we developed a Python demonstrator for pricing total valuation adjustment (XVA) based on the stochastic grid bundling method (SGBM). XVA is an advanced risk management concept which became relevant after the recent financial crisis. This work is a follow-up work on Chau and Oosterlee in (Int J Comput Math 96(11):2272–2301, 2019), in which we extended SGBM to numerically solving backward stochastic differential equations (BSDEs). The motivation for this work is basically two-fold. On the application side, by focusing on a particular financial application of BSDEs, we can show the potential of using SGBM on a real-world risk management problem. On the implementation side, we explore the potential of developing a simple yet highly efficient code with SGBM by incorporating CUDA Python into our program

A generic framework for context-sensitive analysis of modular programs

Context-sensitive analysis provides information which is potentially more accurate than that provided by context-free analysis. Such information can then be applied in order to validate/debug the program and/or to specialize the program obtaining important improvements. Unfortunately, context-sensitive analysis of modular programs poses important theoretical and practical problems. One solution, used in several proposals, is to resort to context-free analysis. Other proposals do address context-sensitive analysis, but are only applicable when the description domain used satisfies rather restrictive properties. In this paper, we argüe that a general framework for context-sensitive analysis of modular programs, Le., one that allows using all the domains which have proved useful in practice in the non-modular setting, is indeed feasible and very useful. Driven by our experience in the design and implementation of analysis and specialization techniques in the context of CiaoPP, the Ciao system preprocessor, in this paper we discuss a number of design goals for context-sensitive analysis of modular programs as well as the problems which arise in trying to meet these goals. We also provide a high-level description of a framework for analysis of modular programs which does substantially meet these objectives. This framework is generic in that it can be instantiated in different ways in order to adapt to different contexts. Finally, the behavior of the different instantiations w.r.t. the design goals that motivate our work is also discussed

Parental Influence on Child and Adolescent Physical Activity Level: A Meta-Analysis

Parents are often regarded as one of the significant social agents who are important to the participation of physical activity (PA) among children and adolescents. However, within the literature, the relationships between parental influences and child and adolescent PA have been inconclusive and discordant. The purpose of this meta-analysis was to quantify and synthesize the associations between parental social influences (positive parental influence, punishment, and discouragement) and the PA level of children and adolescents. Through a systematic literature search using PsycINFO, Web of Science, PubMed, ProQuest, and SPORTDiscus databases, we identified 112 eligible studies and subsequently extracted 741 effect sizes for our analysis. Multilevel meta-analysis showed that the corrected zero-order correlation of positive parental influence was positive and statistically significant, r = 0.202, SE = 0.014, t = 14.975, p \u3c 0.001, 95% confidence interval (CI) = [0.176, 0.228]. Further moderation analysis also found that this was significantly moderated by parental gender (maternal vs. paternal), respondent of influence measure (parent-reported vs. child-reported), and type of PA measure (subjective vs. objective). The corrected zero-order correlations of negative parental influences (i.e., punishment and discouragement) were not statistically significant, and no significant moderation effects were observed. The findings of our meta-analysis showed that children and adolescents had higher PA levels when their parents supported PA participation by exerting positive social influence. Punishment and discouragement against PA by parents did not appear to be significantly associated with the PA level of children and adolescents. The findings of negative parental social influence were mixed and required further investigations

The Synthesis and Characterization of LiFeAs and NaFeAs

The newest homologous series of superconducting As-pnictides, LiFeAs (Li111) and NaFeAs (Na111) have been synthesized and investigated. Both crystallize with the layered tetragonal anti-PbFCl-type structure in P4/nmm space group. Polycrystalline samples and single-crystals of Li111 and Na111 display superconducting transitions at ~ 18 K and 12-25 K, respectively. No magnetic order has been found in either compound, although a weak magnetic background is clearly in evidence. The origin of the carriers and the stoichiometric compositions of Li111 and Na111 were explored.Comment: submitted for publication in Physica C special issue on Fe-pnictide

Potential benefits and impacts on the CRWMS transportation system of filling spent fuel shipping casks with depleted uranium silicate glass

A new technology, the Depleted Uranium Silicate COntainer Fill System (DUSCOFS), is proposed to improve the performance and reduce the uncertainties of geological disposal of spent nuclear fuel (SNF), thus reducing both radionuclide release rates from the waste package and the potential for repository nuclear criticality events. DUSCOFS may also provide benefits for SNF storage and transport if it is loaded into the container early in the waste management cycle. Assessments have been made of the benefits to be derived by placing depleted uranium silicate (DUS) glass into SNF containers for enhancing repository performance assessment and controlling criticality over geologic times in the repository. Also, the performance, benefits, and impacts which can be derived if the SNF is loaded into a multi-purpose canister with DUS glass at a reactor site have been assessed. The DUSCOFS concept and the benefits to the waste management cycle of implementing DUSCOFS early in the cycle are discussed in this paper

Scanning acoustic microscopy investigation of engineered flip-chip delamination

The rapid uptake of flip-chip technology within the electronics industry, is placing the reliability of such assemblies under increasing scrutiny. A key feature of the assembly process is the application of underfill to reinforce the attachment of the die to the printed circuit board. This has been identified in numerous studies as one of the major ways in which the reliability of the devices can be improved, by mitigating the coefficient of thermal expansion mismatch between chip and board. However, in order for the underfill to be effective in coupling the die to the circuit board, its adhesion to the passivation layer of the die and the solder mask layer on the PCB must be maximised. There is a growing body of literature that indicates that poor adhesion at either interface (delamination) as a result of contamination can result in premature failure of the assembly through stress fracture of the solder joints. In order to investigate further the effect of delamination on the reliability of flip-chip assemblies, surface chemistry has been used to control the adhesion of the underfill to the die passivation. This paper reports how modification of the die surface by the application of a low surface energy coating, which prevents the strong adhesion of the underfill, has enabled the selective delamination of the device at the chip-to-underfill interface. Using scanning acoustic microscopy (SAM) the effectiveness of this treatment in creating controlled delamination before and after thermal cycling has been monitored. The ability to engineer delamination, can enable experimental studies of the mechanics of flip chip assembly failure, which complement current finite element modelling work