Hardening effects on formability limit prediction based on gurson-type damage models and bifurcation analysis

In this work, ductility limits of metallic materials, associated with the occurrence of strain localization, are predicted using the GTN damage model coupled with bifurcation theory. The resulting approach is implemented into the finite element code ABAQUS within the framework of large plastic strains and a fully three-dimensional formulation. A parametric study with respect to damage and hardening parameters is conducted in order to identify the most influential material parameters on strain localization. The analysis shows that the damage parameters have a significant impact on the predicted ductility limits, while the effect of hardening parameters on strain localization depends on the choice of void nucleation mechanism

A Study of The Density Property in Module Theory

In this paper, there are two main objectives. The first objective is to study the relationship between the density property and some modules in detail, for instance; semisimple and divisible modules. The Addition complement has a good relationship with the density property of the modules as this importance is highlighted by any submodule N of M has an addition complement with Rad(M)=0. The second objective is to clarify the relationship between the density property and the essential submodules with some examples. As an example of this relationship, we studied the torsion-free module and its relationship with the essential submodules in module M

Near-optimal Asymmetric Binary Matrix Partitions

We study the asymmetric binary matrix partition problem that was recently introduced by Alon et al. (WINE 2013) to model the impact of asymmetric information on the revenue of the seller in take-it-or-leave-it sales. Instances of the problem consist of an $n \times m$ binary matrix $A$ and a probability distribution over its columns. A partition scheme $B=(B_1,...,B_n)$ consists of a partition $B_i$ for each row $i$ of $A$. The partition $B_i$ acts as a smoothing operator on row $i$ that distributes the expected value of each partition subset proportionally to all its entries. Given a scheme $B$ that induces a smooth matrix $A^B$, the partition value is the expected maximum column entry of $A^B$. The objective is to find a partition scheme such that the resulting partition value is maximized. We present a $9/10$-approximation algorithm for the case where the probability distribution is uniform and a $(1-1/e)$-approximation algorithm for non-uniform distributions, significantly improving results of Alon et al. Although our first algorithm is combinatorial (and very simple), the analysis is based on linear programming and duality arguments. In our second result we exploit a nice relation of the problem to submodular welfare maximization

Optimal Parameters for Nonlinear Hirota-Satsuma Coupled KdV System by Using Hybrid Firefly Algorithm with Modified Adomian Decomposition

In this paper, several parameters of the non-linear Hirota-Satsuma coupled KdV system were estimated using a hybrid between the Firefly Algorithm (FFA) and the Modified Adomian decomposition method (MADM). It turns out that optimal parameters can significantly improve the solutions when using a suitably selected fitness function for this problem. The results obtained show that the approximate solutions are highly compatible with the exact solutions and that the hybrid method FFA_MADM gives higher efficiency and accuracy compared to the classic MADM method

Elastic-plastic analyses using the solid-shell finite element SHB8PS and evaluation on sheet forming applications - COMPLAS XI

In this contribution, the formulation of the SHB8PS continuum shell finite element is extended to anisotropic elastic–plastic behavior models with combined isotropic-kinematic hardening at large deformations. The resulting element is then implemented into the commercial implicit finite element code Abaqus/Standard via the UEL subroutine. The SHB8PS element is an eight-node, three-dimensional brick with displacements as the only degrees of freedom and a preferential direction called the thickness. A reduced integration scheme is adopted using an arbitrary number of integration points along the thickness direction and only one integration point in the other directions. The hourglass modes due to this reduced integration are controlled using a physical stabilization technique together with an assumed strain method for the elimination of locking. Therefore, the element can be used to model thin structures while providing an accurate description of the various throughthickness phenomena. Its performance is assessed through several applications involving different types of non-linearities: geometric, material and that induced by contact. Particular attention is given to springback prediction for a Numisheet benchmark problem

Prediction of strain localization during sheet metal forming using bifurcation analysis and Gurson- type damage - Complas XI

The strain localization phenomenon that may occur during sheet metal forming represents a major cause of defective parts produced in the industry. Several instability criteria have been developed in the literature to predict the occurrence of these instabilities. The proposed work aims to couple a Gurson-type model to the Rice’s localization criterion. The implementation of the modeling is achieved via a user subroutine (Umat) in Abaqus/std using a Runge-Kutta explicit integration scheme. Finally, we show the effectiveness of the proposed coupling for the prediction of the formability of stretched metal sheets

The Study of Optical and Electrical Properties of Nanostructured Silicon Carbide Thin Films Grown by Pulsed-Laser Deposition

In this paper, nanostructured silicon carbide (SiC) thin films are deposited onto glass substrate using pulsed laser deposition technique. Electrical and optical characterizations such as conductivity, resistivity, transmission, Seeback effect, absorption, absorption coefficient, energy band gap, and extinction coefficient as a function of photon energy, and the effect of thin films thickness on transmission are carried out to characterize the prepared samples. Results showed that the prepared SiC thin film is an n-type semiconductor with an indirect bandgap of ~3 eV, 448 nm cutoff wavelength, 3.4395 × 104 cm−1 absorption coefficient and 0.154 extinction coefficient. The surface morphology of the SiC thin films is studied using scanning electron microscope at a substrate temperature of 400 °C and it is found that the grain size of the prepared SiC thin film is about 30 nm. As such, the nano thin films optical and structural characteristics enable the films to be used as gases sensors in many optoelectronic devices such as the environment and ultraviolet photodiode