Studies on Core-Based Testing of System-on-Chips Using Functional Bus and Network-on-Chip Interconnects

The tests of a complex system such as a microprocessor-based system-onchip (SoC) or a network-on-chip (NoC) are difficult and expensive. In this thesis, we propose three core-based test methods that reuse the existing functional interconnects-a flat bus, hierarchical buses of multiprocessor SoC's (MPSoC), and a N oC-in order to avoid the silicon area cost of a dedicated test access mechanism (TAM). However, the use of functional interconnects as functional TAM's introduces several new problems. During tests, the interconnects-including the bus arbitrator, the bus bridges, and the NoC routers-operate in the functional mode to transport the test stimuli and responses, while the core under tests (CUT) operate in the test mode. Second, the test data is transported to the CUT through the functional bus, and not directly to the test port. Therefore, special core test wrappers that can provide the necessary control signals required by the different functional interconnect are proposed. We developed two types of wrappers, one buffer-based wrapper for the bus-based systems and another pair of complementary wrappers for the NoCbased systems. Using the core test wrappers, we propose test scheduling schemes for the three functionally different types of interconnects. The test scheduling scheme for a flat bus is developed based on an efficient packet scheduling scheme that minimizes both the buffer sizes and the test time under a power constraint. The schedulingscheme is then extended to take advantage of the hierarchical bus architecture of the MPSoC systems. The third test scheduling scheme based on the bandwidth sharing is developed specifically for the NoC-based systems. The test scheduling is performed under the objective of co-optimizing the wrapper area cost and the resulting test application time using the two complementary NoC wrappers. For each of the proposed methodology for the three types of SoC architec .. ture, we conducted a thorough experimental evaluation in order to verify their effectiveness compared to other methods

How to Implement an Asynchronous Test Wrapper for Network-on-Chip Nodes

International audienceThe Network-on-Chip (NoC) paradigm is currently known as an alternative solution for the on chip communication in the next SoC generation, especially, asynchronous NoCs. One of the challenges for asynchronous NoC-based systems design is testing asynchronous network architectures for manufacturing defects. To improve the testability of asynchronous NoCs, we have developed a scalable and configurable asynchronous Design-for-Test (DfT) architecture. In this architecture, each asynchronous network node is surrounded by an asynchronous test wrapper and the network communication channels are reused as a high-speed Test Access Mechanism (TAM). This architecture is designed to test all network elements (routers, communication channels), but it can also be used to test computational resources. In this paper, we introduce how to realize and implement the test wrapper in Quasi Delay Insensitive (QDI) asynchronous logic style. The validation and experimental results are also presented

Reusing IEEE 1687-Compatible Instruments and Sub-Networks over a System Bus

Accessing embedded test and monitoring circuitry (the so-called embedded instruments) in in-field products can reduce maintenance and diagnostics costs. Performing such access can be facilitated when done over an internal system bus, due to that it might be faster and less cumbersome to reach a system processor (on an in-field product) over a network interface, compared with the effort and speed of gaining access to a test interface on the same product. Enabling such access might require that, at the component level, the embedded instruments in a system-on-chip (SoC) become accessible both from a chip interface and from an on-chip processor over a system bus. Although this reuse of embedded instruments can be achieved by already existing standards, such as IEEE 1687, the system bus might become a scalability bottleneck when the number of instruments that are to be reused increases. In this paper, we propose two solutions that address the scalability in this type of reuse while maintaining compatibility with IEEE 1687 tools. We also discuss the trade-offs associated with each approach and present timing analyses that by considering system parameters such as clock rates determine how the correct operation can be guaranteed. To validate the proposed solutions, we have implemented them on an FPGA using AXI as system bus, and have used standard IEEE 1687 tools to access the instruments. We present some details of the implementation to highlight practical issues such as clock domain crossing, as well as how the presented timing analyses can be used to adjust design parameters

A PUF-based cryptographic security solution for IoT systems on chip

The integration of multicore processors and peripherals from multiple intellectual property core providers as hardware components of IoT multiprocessor systems-on-chip (SoC) represents a source of security vulnerabilities for the in-chip communication. This paper describes the concept and the practical results of a SoC security implementation that is illustrative for IoT applications. The mechanism employed in this approach uses physically unclonable functions (PUF) and symmetric cryptography in order to encrypt the transferred messages within the SoC between the microprocessor and its peripherals. The mechanism is experimentally validated at FPGA level, the paper describing also an implementation scenario for an IoT ARM based device

Master of Science

thesisThis thesis designs, implements, and evaluates modular Open Core Protocol (OCP) interfaces for Intellectual Property (IP) cores and Network-on-Chip (NoC) that re- duces System-On-Chip (SoC) design time and enables research on di erent architectural sequencing control methods. To utilize the NoCs design time optimization feature at the boundaries, a standardized industry socket was required, which can address the SoC shorter time-to-market requirements, design issues, and also the subsequent reuse of developed IP cores. OCP is an open industry standard socket interface speci cation used in this research to enable the IP cores reusability across multiple SoC designs. This research work designs and implements clocked OCP interfaces between IP cores and On-Chip Network Fabric (NoC), in single- and multi- frequency clocked domains. The NoC interfaces between IP cores and on-chip network fabric are implemented using the standard network interface structure. It consists of back-end and front-end submodules corresponding to customized interfaces to IP cores or network fabric and OCP Master and Slave entities, respectively. A generic domain interface (DI) protocol is designed which acts as the bridge between back-end and front-end submodules for synchronization and data ow control. Clocked OCP interfaces are synthesized, placed and routed using IBM's 65nm process technology. The implemented designs are veri ed for OCP compliance using SOLV (Sonics OCP Library for Veri cation). Finally, this thesis reports the performance metrics such as design target frequency of operation, latency, area, energy per transaction, and maximum bandwidth across network on-chip for single- and multifrequency clocked designs

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

Design for pre-bond testability in 3D integrated circuits

In this dissertation we propose several DFT techniques specific to 3D stacked IC systems. The goal has explicitly been to create techniques that integrate easily with existing IC test systems. Specifically, this means utilizing scan- and wrapper-based techniques, two foundations of the digital IC test industry. First, we describe a general test architecture for 3D ICs. In this architecture, each tier of a 3D design is wrapped in test control logic that both manages tier test pre-bond and integrates the tier into the large test architecture post-bond. We describe a new kind of boundary scan to provide the necessary test control and observation of the partial circuits, and we propose a new design methodology for test hardcore that ensures both pre-bond functionality and post-bond optimality. We present the application of these techniques to the 3D-MAPS test vehicle, which has proven their effectiveness. Second, we extend these DFT techniques to circuit-partitioned designs. We find that boundary scan design is generally sufficient, but that some 3D designs require special DFT treatment. Most importantly, we demonstrate that the functional partitioning inherent in 3D design can potentially decrease the total test cost of verifying a circuit. Third, we present a new CAD algorithm for designing 3D test wrappers. This algorithm co-designs the pre-bond and post-bond wrappers to simultaneously minimize test time and routing cost. On average, our algorithm utilizes over 90% of the wires in both the pre-bond and post-bond wrappers. Finally, we look at the 3D vias themselves to develop a low-cost, high-volume pre-bond test methodology appropriate for production-level test. We describe the shorting probes methodology, wherein large test probes are used to contact multiple small 3D vias. This technique is an all-digital test method that integrates seamlessly into existing test flows. Our experimental results demonstrate two key facts: neither the large capacitance of the probe tips nor the process variation in the 3D vias and the probe tips significantly hinders the testability of the circuits. Taken together, this body of work defines a complete test methodology for testing 3D ICs pre-bond, eliminating one of the key hurdles to the commercialization of 3D technology.PhDCommittee Chair: Lee, Hsien-Hsin; Committee Member: Bakir, Muhannad; Committee Member: Lim, Sung Kyu; Committee Member: Vuduc, Richard; Committee Member: Yalamanchili, Sudhaka

PyCARL: A PyNN Interface for Hardware-Software Co-Simulation of Spiking Neural Network

We present PyCARL, a PyNN-based common Python programming interface for hardware-software co-simulation of spiking neural network (SNN). Through PyCARL, we make the following two key contributions. First, we provide an interface of PyNN to CARLsim, a computationally-efficient, GPU-accelerated and biophysically-detailed SNN simulator. PyCARL facilitates joint development of machine learning models and code sharing between CARLsim and PyNN users, promoting an integrated and larger neuromorphic community. Second, we integrate cycle-accurate models of state-of-the-art neuromorphic hardware such as TrueNorth, Loihi, and DynapSE in PyCARL, to accurately model hardware latencies that delay spikes between communicating neurons and degrade performance. PyCARL allows users to analyze and optimize the performance difference between software-only simulation and hardware-software co-simulation of their machine learning models. We show that system designers can also use PyCARL to perform design-space exploration early in the product development stage, facilitating faster time-to-deployment of neuromorphic products. We evaluate the memory usage and simulation time of PyCARL using functionality tests, synthetic SNNs, and realistic applications. Our results demonstrate that for large SNNs, PyCARL does not lead to any significant overhead compared to CARLsim. We also use PyCARL to analyze these SNNs for a state-of-the-art neuromorphic hardware and demonstrate a significant performance deviation from software-only simulations. PyCARL allows to evaluate and minimize such differences early during model development.Comment: 10 pages, 25 figures. Accepted for publication at International Joint Conference on Neural Networks (IJCNN) 202