A High Frequency (HF) Inductive Power Transfer Circuit for High Temperature Applications Using SiC Schottky Diodes

Wireless sensors placed in high temperature environments, such as aircraft engines, are desirable to reduce the mass and complexity of routing wires. While communication with the sensors is straight forward, providing power wirelessly is still a challenge. This paper introduces an inductive wireless power transfer circuit incorporating SiC Schottky diodes and its operation from room temperature (25 C) to 500 C

GaN-based LSK demodulators for wireless data receivers in high-temperature applications

ABSTRACT: GaN (gallium nitride)-based fully-integrated demodulators are presented. These modules, intended for wireless applications, target high-temperature (HT) environments including monitoring devices in aerospace. The presented demodulators are dedicated to recover Load-shift keying signals modulating a low carrier frequency to maximize power transfer efficiency and increase data transmission rate through metallic barriers. Logic gates are implemented and successfully tested at HT exceeding 400 °C. Proposed demodulators are built from half and full bridge rectifiers, comparators, voltage references and inverters, and operate at a minimum carrier frequency (fc) of 50 kHz. A demodulator based on a digital topology is proposed to cover MHz range fc. A complementary ±14 V supply voltage is required to operate the circuits. Reported post-layout simulation results validate the functionality and performance offered by the proposed demodulators over the 25 °C–400 °C temperature range. Also, a complete chip layout has been done, where the introduced demodulators occupy 10 mm² of a GaN die area

Circuits Techniques for Wireless Sensing Systems in High-Temperature Environments

RÉSUMÉ Dans ce projet, nous proposons de nouvelles techniques d’intégration basées sur la technologie de nitrure de gallium (GaN). Ces techniques permettent de mettre en œuvre un système de transmission de données sans fil entièrement intégré dédié aux capteurs de surveillance pour des applications d'environnement hostile. Le travail nécessite de trouver une technologie capable de résister à l'environnement sévère, principalement à haute température, et de permettre un niveau d'intégration élevé. Le système réalisé serait le premier dispositif de transmission de données basé sur la technologie GaN. En plus de supporter les conditions de haute température (HT) dépassant 600 oC, le système de transmission sans fil attendu devrait fonctionner à travers une barrière métallique séparant le module émetteur du récepteur. Une revue de la littérature sur les applications en environnements hostiles ainsi que sur l'électronique correspondante a été réalisée pour sélectionner la technologie AlGaN/GaN HEMT (transistor à haute mobilité d'électrons) comme une technologie appropriée. Le kit de conception GaN500, fourni par le Conseil national de recherches du Canada (CNRC), a été adopté pour concevoir et mettre en œuvre le système proposé. Cette technologie a été initialement introduite pour desservir les applications radiofréquences (RF) et micro-ondes. Par conséquent, elle n'avait pas été validée pour concevoir et fabriquer des circuits intégrés analogiques et numériques complexes et son utilisation à des températures extrêmes n’était pas validée. Nous avons donc caractérisé à haute température des dispositifs fabriqués en GaN500 et des éléments passifs intégrés correspondants ont été réalisés. Ces composants ont été testés sur la plage de température comprise entre 25 et 600 oC dans cette thèse. Les résultats de caractérisation ont été utilisés pour extraire les modèles HT des HEMT intégrés et des éléments passifs à utiliser dans les simulations. En outre, plusieurs composants intégrés basés sur la technologie GaN500, notamment des NOT, NOR, NAND, XOR, XNOR, registres, éléments de délais et oscillateurs ont été mis en œuvre et testés en HT. Des circuits analogiques à base de GaN500, comprenant un amplificateur de tension, un comparateur, un redresseur simple alternance, un redresseur double alternance, une pompe de charge et une référence de tension ont également été mis en œuvre et testés en HT. Le système de transmission de données mis en œuvre se compose d'un module de modulation situé dans la partie émettrice et d'un module de démodulation situé dans la partie réceptrice.----------ABSTRACT In this project, we propose new integrated-circuit design techniques based on the Gallium Nitride (GaN) technology to implement a fully-integrated data transmission system dedicated to wireless sensing in harsh environment applications. The goal in this thesis is to find a proper technology able to withstand harsh-environments (HEs), mainly characterized by high temperatures, and to allow a high-integration level. The reported design is the first data transmission system based on GaN technology. In addition to high temperature (HT) environment exceeding 600 oC, the expected wireless transmission systems may need to operate through metallic barriers separating the transmitting from the receiving modules. A wide literature review on the HE applications and corresponding electronics has been done to select the AlGaN/GaN HEMT (high-electron-mobility transistor) technology. The GaN500 design kit, provided by National Research Council of Canada (NRC), was adopted to design and implement the proposed system. This technology was initially provided to serve radio frequency (RF) and microwave circuits and applications. Consequently, it was not validated to implement complex integrated systems and to withstand extreme temperatures. Therefore, the high-temperature characterization of fabricated GaN500 devices and corresponding integrated passive elements was performed over the temperature range 25-600 oC in this thesis. The characterization results were used to extract HT models of the integrated HEMTs and passive elements to be used in simulations. Also, several GaN500-based digital circuits including NOT, NOR, NAND, XOR, XNOR, register, Delay and Ring oscillator were implemented and tested at HT. GaN500-based Analog circuits including front-end amplifier, comparator, half-bridge rectifier, full-bridge rectifier, charge pump and voltage reference were implemented and tested at HT as well. The implemented data transmission system consists of a modulation module located in the transmitting part and a demodulation block located in the receiving part. The proposed modulation system is based on the delta-sigma modulation technique and composed of a front-end amplifier, a comparator, a register, a charge pump and a ring oscillator. The output stage of the transmitter is intended to perform the load-shift-keying (LSK) modulation required to accomplish the data transmission through the dedicated inductive link. At the receiver level, three demodulation topologies were proposed to acquire the delivered LSK-modulated signals

Electronics and Packaging Intended for Emerging Harsh Environment Applications: A Review

ABSTRACT: Several industrial applications require specific electronic systems installed in harsh environments to perform measurements, monitoring, and control tasks such as in space exploration, aerospace missions, automotive industries, down-hole oil and gas industry, and geothermal power plants. The extreme environment could be surrounding high-, low-, and wide-range temperature, intense radiation, or even a combination of above conditions. We review, in this paper, the main leading applications that demand advanced technologies to fit the unconventional requirements of extreme operating conditions, discussing their main merits and limits compared to established and emerging technologies in this field, including silicon (Si), silicon on insulator (SOI), silicon germanium (SiGe), silicon carbide (SiC) as well as III–V semiconductors particularly the gallium nitride (GaN) semiconductor. In spite of successfully exceeding extreme conditions borders by developing advanced semiconductor devices dedicated for harsh environments, especially in high-temperature applications, the packaging challenges are still limiting the reliability of the developed technologies. Those challenges are examined in this review in terms of limitations and proposed solutions

Factories of the Future

Engineering; Industrial engineering; Production engineerin

NASA Technology Plan 1998

This NASA Strategic Plan describes an ambitious, exciting vision for the Agency across all its Strategic Enterprises that addresses a series of fundamental questions of science and research. This vision is so challenging that it literally depends on the success of an aggressive, cutting-edge advanced technology development program. The objective of this plan is to describe the NASA-wide technology program in a manner that provides not only the content of ongoing and planned activities, but also the rationale and justification for these activities in the context of NASA's future needs. The scope of this plan is Agencywide, and it includes technology investments to support all major space and aeronautics program areas, but particular emphasis is placed on longer term strategic technology efforts that will have broad impact across the spectrum of NASA activities and perhaps beyond. Our goal is to broaden the understanding of NASA technology programs and to encourage greater participation from outside the Agency. By relating technology goals to anticipated mission needs, we hope to stimulate additional innovative approaches to technology challenges and promote more cooperative programs with partners outside NASA who share common goals. We also believe that this will increase the transfer of NASA-sponsored technology into nonaerospace applications, resulting in an even greater return on the investment in NASA

Modern Applications in Optics and Photonics: From Sensing and Analytics to Communication

Optics and photonics are among the key technologies of the 21st century, and offer potential for novel applications in areas such as sensing and spectroscopy, analytics, monitoring, biomedical imaging/diagnostics, and optical communication technology. The high degree of control over light fields, together with the capabilities of modern processing and integration technology, enables new optical measurement systems with enhanced functionality and sensitivity. They are attractive for a range of applications that were previously inaccessible. This Special Issue aims to provide an overview of some of the most advanced application areas in optics and photonics and indicate the broad potential for the future

The 1st Advanced Manufacturing Student Conference (AMSC21) Chemnitz, Germany 15–16 July 2021

The Advanced Manufacturing Student Conference (AMSC) represents an educational format designed to foster the acquisition and application of skills related to Research Methods in Engineering Sciences. Participating students are required to write and submit a conference paper and are given the opportunity to present their findings at the conference. The AMSC provides a tremendous opportunity for participants to practice critical skills associated with scientific publication. Conference Proceedings of the conference will benefit readers by providing updates on critical topics and recent progress in the advanced manufacturing engineering and technologies and, at the same time, will aid the transfer of valuable knowledge to the next generation of academics and practitioners. *** The first AMSC Conference Proceeding (AMSC21) addressed the following topics: Advances in “classical” Manufacturing Technologies, Technology and Application of Additive Manufacturing, Digitalization of Industrial Production (Industry 4.0), Advances in the field of Cyber-Physical Systems, Virtual and Augmented Reality Technologies throughout the entire product Life Cycle, Human-machine-environment interaction and Management and life cycle assessment.:- Advances in “classical” Manufacturing Technologies - Technology and Application of Additive Manufacturing - Digitalization of Industrial Production (Industry 4.0) - Advances in the field of Cyber-Physical Systems - Virtual and Augmented Reality Technologies throughout the entire product Life Cycle - Human-machine-environment interaction - Management and life cycle assessmen

The Commercial Application of Missile/Space Technology, Parts 1 and 2

This report is concerned with the transfer of technology from missile and space programs to non-missile/space applications in the United States. It presents the findings of a University of Denver Research Institute study sponsored by a National Aeronautics and Space Administration (NASA) grant awarded in November 1961. Initial stimulation for the unsolicited proposal leading to this study came from a 1960 Brookings Institution report to NASA, Proposed Studies on the Implications of Peaceful Space Activities for Human Affairs