An Offset Cancelation Technique for Latch Type Sense Amplifiers

An offset compensation technique for a latch type sense amplifier is proposed in this paper. The proposed scheme is based on the recalibration of the charging/discharging current of the critical nodes which are affected by the device mismatches. The circuit has been designed in a 65 nm CMOS technology with 1.2 V core transistors. The auto-calibration procedure is fully digital. Simulation results are given verifying the operation for sampling a 5 Gb/s signal dissipating only 360 uW

Silicon-on-Insulator Power Management Integrated Circuit for Thin-Film Solid-State Lithium-Ion Micro-Batteries

This thesis presents the design and implementation of a power management integrated circuit (IC) that is capable of both current and voltage charging thin-film, solid-state, lithium-ion micro-batteries. The power management system has been fabricated using a single-poly, 0.35-ìm, partially-depleted, silicon-on-insulator process (PD-SOI). The system contains a temperature stable current charger (current generator and a 4-bit current-mode DAC), a regulated voltage supply (voltage amplifier), and a voltage monitoring circuit (2-bit flash ADC). Experimental results of the first version of the power management system show proper functionality was obtained. The current charger produced a 2% worst-case variation in output current over the temperature range 0–100°C. The regulated voltage output was measured to be 4.4 V and the digital outputs of the flash ADC transitioned at 3.45 and 4.76 V

A radiation-hard dual-channel 12-bit 40 MS/s ADC prototype for the ATLAS liquid argon calorimeter readout electronics upgrade at the CERN LHC

The readout electronics upgrade for the ATLAS Liquid Argon Calorimeters at the CERN Large Hadron Collider requires a radiation-hard ADC. The design of a radiation-hard dual-channel 12-bit 40 MS/s pipeline ADC for this use is presented. The design consists of two pipeline A/D channels each with four Multiplying Digital-to-Analog Converters followed by 8-bit Successive-Approximation-Register analog-to-digital converters. The custom design, fabricated in a commercial 130 nm CMOS process, shows a performance of 67.9 dB SNDR at 10 MHz for a single channel at 40 MS/s, with a latency of 87.5 ns (to first bit read out), while its total power consumption is 50 mW/channel. The chip uses two power supply voltages: 1.2 and 2.5 V. The sensitivity to single event effects during irradiation is measured and determined to meet the system requirements

Ultra-low Power Circuits for Internet of Things (IOT)

Miniaturized sensor nodes offer an unprecedented opportunity for the semiconductor industry which led to a rapid development of the application space: the Internet of Things (IoT). IoT is a global infrastructure that interconnects physical and virtual things which have the potential to dramatically improve people's daily lives. One of key aspect that makes IoT special is that the internet is expanding into places that has been ever reachable as device form factor continue to decreases. Extremely small sensors can be placed on plants, animals, humans, and geologic features, and connected to the Internet. Several challenges, however, exist that could possibly slow the development of IoT. In this thesis, several circuit techniques as well as system level optimizations to meet the challenging power/energy requirement for the IoT design space are described. First, a fully-integrated temperature sensor for battery-operated, ultra-low power microsystems is presented. Sensor operation is based on temperature independent/dependent current sources that are used with oscillators and counters to generate a digital temperature code. Second, an ultra-low power oscillator designed for wake-up timers in compact wireless sensors is presented. The proposed topology separates the continuous comparator from the oscillation path and activates it only for short period when it is required. As a result, both low power tracking and generation of precise wake-up signal is made possible. Third, an 8-bit sub-ranging SAR ADC for biomedical applications is discussed that takes an advantage of signal characteristics. ADC uses a moving window and stores the previous MSBs voltage value on a series capacitor to achieve energy saving compared to a conventional approach while maintaining its accuracy. Finally, an ultra-low power acoustic sensing and object recognition microsystem that uses frequency domain feature extraction and classification is presented. By introducing ultra-low 8-bit SAR-ADC with 50fF input capacitance, power consumption of the frontend amplifier has been reduced to single digit nW-level. Also, serialized discrete Fourier transform (DFT) feature extraction is proposed in a digital back-end, replacing a high-power/area-consuming conventional FFT.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/137157/1/seojeong_1.pd

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

Voyager electronic parts radiation program, volume 1

The Voyager spacecraft is subject to radiation from external natural space, from radioisotope thermoelectric generators and heater units, and from the internal environment where penetrating electrons generate surface ionization effects in semiconductor devices. Methods for radiation hardening and tests for radiation sensitivity are described. Results of characterization testing and sample screening of over 200 semiconductor devices in a radiation environment are summarized

Design of Analog-to-Digital Converters with Embedded Mixing for Ultra-Low-Power Radio Receivers

In the field of radio receivers, down-conversion methods usually rely on one (or more) explicit mixing stage(s) before the analog-to-digital converter (ADC). These stages not only contribute to the overall power consumption but also have an impact on area and can compromise the receiver’s performance in terms of noise and linearity. On the other hand, most ADCs require some sort of reference signal in order to properly digitize an analog input signal. The implementation of this reference signal usually relies on bandgap circuits and reference buffers to generate a constant, stable, dc signal. Disregarding this conventional approach, the work developed in this thesis aims to explore the viability behind the usage of a variable reference signal. Moreover, it demonstrates that not only can an input signal be properly digitized, but also shifted up and down in frequency, effectively embedding the mixing operation in an ADC. As a result, ADCs in receiver chains can perform double-duty as both a quantizer and a mixing stage. The lesser known charge-sharing (CS) topology, within the successive approximation register (SAR) ADCs, is used for a practical implementation, due to its feature of “pre-charging” the reference signal prior to the conversion. Simulation results from an 8-bit CS-SAR ADC designed in a 0.13 μm CMOS technology validate the proposed technique

Design and implementation of a multi-modal sensor with on-chip security

With the advancement of technology, wearable devices for fitness tracking, patient monitoring, diagnosis, and disease prevention are finding ways to be woven into modern world reality. CMOS sensors are known to be compact, with low power consumption, making them an inseparable part of wireless medical applications and Internet of Things (IoT). Digital/semi-digital output, by the translation of transmitting data into the frequency domain, takes advantages of both the analog and digital world. However, one of the most critical measures of communication, security, is ignored and not considered for fabrication of an integrated chip. With the advancement of Moore\u27s law and the possibility of having a higher number of transistors and more complex circuits, the feasibility of having on-chip security measures is drawing more attention. One of the fundamental means of secure communication is real-time encryption. Encryption/ciphering occurs when we encode a signal or data, and prevents unauthorized parties from reading or understanding this information. Encryption is the process of transmitting sensitive data securely and with privacy. This measure of security is essential since in biomedical devices, the attacker/hacker can endanger users of IoT or wearable sensors (e.g. attacks at implanted biosensors can cause fatal harm to the user). This work develops 1) A low power and compact multi-modal sensor that can measure temperature and impedance with a quasi-digital output and 2) a low power on-chip signal cipher for real-time data transfer

A 2V rail-to-rail micropower CMOS comparator

The design of a rail-to-rail micropower comparator in CMOS technology is described. The circuit is intended for implantable biomedical devices powered by batteries, with a total consumption of 500nA and operation up to supply voltages of 2V. This cell, currently being fabricated, has a core die area of 0.27 mm2 on a 2.4;m standard analog CMOS technology with a 0.85V nominal threshold voltage. It is expected to have a typical response time of 35ms ;and an offset voltage of about 6mV. The limitations imposed by the low supply voltage are presented. The ways of overcoming these limitations, based on an accurate sizing of the transistors for operation in the weak and moderate inversion regions are studied. An approach, based on a capacitive D/A converter, for the generation of a comparison reference input that is digitally programmable is also presented