Design of an Analog and of a Digital-Based OTA in Flexible Integrated Circuit Technology

In this paper, an Analog and a Digital-Based Operational Transconductance Amplifier (OTA) in a 800nm Indium-Gallium-Zinc-Oxide (IGZO) Thin-Film Transistors (TFT) Flexible Integrated Circuits (FlexICs) technology are presented and compared on the basis of post-layout simulations.The analog OTA (A-OTA) and the Digital-Based OTA (DBOTA) occupy a total area of 42,624μm2 and 25,207μm2, respectively and - based on post-layout Monte Carlo (MC) simulations on 100 samples operated at 3.3V with 50pF capacitive load - they achieve an average gain-bandwidth product (GBW) of 58 kHz and 86 kHz, respectively, with an average power consumption of 90 μW and 113 μW. The simulated standard deviation of the input offset voltage is 22.3mV for the A-OTA and 7.2mV for the DB-OTA while the input-referred integrated noise over the entire GBW is 8.8 μVRMS and 87 μVRMS for the A-OTA and DB-OTA respectively

High-throughput large-area plastic nanoelectronics

Large-area electronics (LAE) manufacturing has been a key focus of both academic and industrial research, especially within the last decade. The growing interest is born out of the possibility of adding attractive properties (flexibility, light weight or minimal thickness) at low cost to well-established technologies, such as photovoltaics, displays, sensors or enabling the realisation of emerging technologies such as wearable devices and the Internet of Things. As such there has been great progress in the development of materials specifically designed to be employed in solution processed (plastic) electronics, including organic, transparent metal oxide and nanoscale semiconductors, as well as progress in the deposition methods of these materials using low-cost high-throughput printing techniques, such as gravure printing, inkjet printing, and roll-to-roll vacuum deposition. Meanwhile, industry innovation driven by Moore’s law has pushed conventional silicon-based electronic components to the nanoscale. The processes developed for LAE must strive to reach these dimensions. Given that the complex and expensive patterning techniques employed by the semiconductor industry so far are not compatible with LAE, there is clearly a need to develop large-area high throughput nanofabrication techniques. This thesis presents progress in adhesion lithography (a-Lith), a nanogap electrode fabrication process that can be applied over large areas on arbitrary substrates. A-Lith is a self-alignment process based on the alteration of surface energies of a starting metal electrode which allows the removal of any overlap of a secondary metal electrode. Importantly, it is an inexpensive, scalable and high throughput technique, and, especially if combined with low temperature deposition of the active material, it is fundamentally compatible with large-area fabrication of nanoscale electronic devices on flexible (plastic) substrates. Herein, I present routes towards process optimisation with a focus on gap size reduction and yield maximisation. Asymmetric gaps with sizes below 10 nm and yields of > 90 % for hundreds of electrode pairs generated on a single substrate are demonstrated. These large width electrode nanogaps represent the highest aspect ratio nanogaps (up to 108) fabricated to date. As a next step, arrays of Schottky nanodiodes are fabricated by deposition of a suitable semiconductor from solution into the nanogap structures. Of principal interest is the wide bandgap transparent semiconductor, zinc oxide (ZnO). Lateral ZnO Schottky diodes show outstanding characteristics, with on-off ratios of up to 106 and forward current values up to 10 mA for obtained upon combining a-Lith with low-temperature solution processing. These unique devices are further investigated for application in rectifier circuits, and in particular for potential use in radio frequency identification (RFID) tag technology. The ZnO diodes are found to surpass the 13.56 MHz frequency bernchmark used in commercial applications and approach the ultra-high frequency (UHF) band (hundreds of megahertz), outperforming current state of the art printed diodes. Solution processed fullerene (C60) is also shown to approach the UHF band in this co-planar device configuration, highlighting the viability of a-Lith for enabling large-area flexible radio frequency nanoelectronics. Finally, resistive switching memory device arrays based on a-Lith patterned nanogap aluminium symmetric electrodes are demonstrated for the first time. These devices are based either on empty aluminium nanogap electrodes, or with the gap filled with a solution-processed semiconductor, the latter being ZnO, the semiconducting polymer poly(9,9-dioctylfluorene-alt-benzothiadiazole) (F8BT) or carbon nanotube/polyfluorene blends. The switching mechanism, retention time and switching speed are investigated and compared with published data. The fabrication of arrays of these devices illustrates the potential of a-Lith as a simple technique for the realisation of large-area high-density memory applications.Open Acces

UV phototransistors based upon spray coated and sputter deposited ZnO TFTs

A comparison of Zinc Oxide (ZnO) phototransistors prepared by spray and sputter coating process is presented. The work shows that spray coated layers provide significant advantages in sensor response over ZnO phototransistors made by physical vapour deposition and we show that spray deposited ZnO phototransistors can exhibit state-of-the-art performances for UV photodetectors. Topographic images of the samples surface shows that there is increase in surface roughness in spray coated samples indicating increasing grain sizes, which is considered the source of the greater sensor responsivity. X-ray photoelectron spectroscopy (XPS) is also used to understand the root cause of the greater UV responsivity. It was observed that sprayed ZnO TFTs are more sensitive to UV radiation due to higher adsorption of oxygen level. Responsivity and external quantum efficiency (EQE) of the sprayed and sputtered ZnO TFTs are also evaluated

On improvements in metal oxide based flexible transistors through systematic evaluation of material properties

Thin-film metal oxide (MOx) semiconductors have opened the way to a new generation of electronics based on their unique properties. With mobilities, mu, of up to 80 cm2V-1s-1, metal oxides do not rival crystalline silicon (mu~1000 cm2V-1s-1) for complex applications. But such oxides do have three unique characteristics driving great interest: their mobilities persist in the amorphous form, contrary to the thousandfold drop seen in silicon; they are transparent; and they can be processed at, or near, room temperature. Most work on MOx semiconductors, in particular indium gallium zinc oxide (IGZO), has focused on display applications, where MOx thin-film transistors (TFTs) are used to drive individual pixels, reducing power consumption by blocking less light than alternatives, and allowing smaller pixels due to reduced TFT sizes. Such work has seen great advances in IGZO, but has generally not considered the thermal budget during production. By utilising the low temperature processing possible with MOx, a new world of applications becomes possible: flexible electronics. This work aims to improve the characteristics of TFTs based on amorphous IGZO (a-IGZO) through detailed study of the thin-film structure in relation to functional performance, looking at the material structure of three critical layers in an a-IGZO TFT. A study of optimisation of a dielectric layer of Al2O3, deposited by atomic layer deposition (ALD), is presented. This dielectric, between the a-IGZO and the gate electrode, shows a three-layer substructure in what has previously been regarded as a single homogeneous layer. A study of the insulating Al2O3 buffer layer below the a-IGZO compared the properties of Al2O3 deposited by ALD and sputtering. Sputtered material has a more complex structure than ALD, consisting of multiple sublayers that correlate with the sputtering process. The structure of the two materials is discussed, and the impact on device performance considered. A detailed systematic study of the effects of annealing of a-IGZO shows a strong dependence of the density on both time and temperature. A two mechanism model is proposed which consists of structural relaxation of the amorphous material followed by absorption of oxygen from the environment. Finally, investigation of the influence of the buffer material on the a-IGZO, and the structure of this interface showed little difference in the growth of the a-IGZO, but did reveal some changes in the interface, while a systematic study of annealing effects on the a-IGZO-dielectric interface showed some interesting changes in this structure, both of which are likely to significantly impact the operational characteristics of TFT devices

Design and simulation of a smart bottle with fill-level sensing based on oxide TFT technology

Packaging is an important element responsible for brand growth and one of the main rea-sons for producers to gain competitive advantages through technological innovation. In this re-gard, the aim of this work is to design a fully autonomous electronic system for a smart bottle packaging, being integrated in a European project named ROLL-OUT. The desired application for the smart bottle is to act as a fill-level sensor system in order to determine the liquid content level that exists inside an opaque bottle, so the consumer can exactly know the remaining quantity of the product inside. An in-house amorphous indium–gallium–zinc oxide thin-film transistor (a-IGZO TFT) model, previously developed, was used for circuit designing purposes. This model was based in an artificial neural network (ANN) equivalent circuit approach. Taking into account that only n-type oxide TFTs were used, plenty of electronic building-blocks have been designed: clock generator, non-overlapping phase generator, a capacitance-to-voltage converter and a comparator. As it was demonstrated by electrical simulations, it has been achieved good functionality for each block, having a final system with a power dissipation of 2.3 mW (VDD=10 V) not considering the clock generator. Four printed circuit boards (PCBs) have been also designed in order to help in the testing phase. Mask layouts were already designed and are currently in fabrication, foreseeing a suc-cessful circuit fabrication, and a major step towards the design and integration of complex trans-ducer systems using oxide TFTs technology

Technological Integration in Printed Electronics

Conventional electronics requires the use of numerous deposition techniques (e.g. chemical vapor deposition, physical vapor deposition, and photolithography) with demanding conditions like ultra-high vacuum, elevated temperature and clean room facilities. In the last decades, printed electronics (PE) has proved the use of standard printing techniques to develop electronic devices with new features such as, large area fabrication, mechanical flexibility, environmental friendliness and—potentially—cost effectiveness. This kind of devices is especially interesting for the popular concept of the Internet of Things (IoT), in which the number of employed electronic devices increases massively. Because of this trend, the cost and environmental impact are gradually becoming a substantial issue. One of the main technological barriers to overcome for PE to be a real competitor in this context, however, is the integration of these non-conventional techniques between each other and the embedding of these devices in standard electronics. This chapter summarizes the advances made in this direction, focusing on the use of different techniques in one process flow and the integration of printed electronics with conventional systems

Novel Semiconducting Materials and Thin Film Technologies for High Energy Radiation Detection

Nowadays the development of real-time ionizing radiation detection system operating over large areas is crucial. Increasing quest for flexible, portable, low cost and low power consumption sensors pushed the scientific community to look for alternative materials and technologies able to fulfill these new requirements. In this thesis the potentiality of organic semiconductors and metal oxides as material platforms for novel ionizing radiation sensors is demonstrated. In particular, organic semiconductors are human tissue-equivalent and this represents a unique and desirable property for the development of dosimeters to be employed in the medical field. The ionizing radiation sensors described in this thesis have been designed, fabricated and characterized during my PhD research and are realized onto polymeric foils leading to flexible devices operating at low voltages, in ambient condition and able to directly detect X-rays, gamma-rays and protons. Following the study of the properties and of the mechanisms of interaction between the radiation and the active layers of the sensors, several strategies have been adopted to enhance the efficiency of these detectors. X-rays dosimeters based on organic semiconductors have been realized presenting record sensitivity values compared with the state of the art for large area radiation detection. The unprecedentedly reported performance led to the possibility to testing these devices in actual medical environments. Moreover, the proof-of-principle demonstration of a dosimetric detection of proton beams by organic-based sensors is reported. Finally, a new sensing platform based on metal oxides is introduced. Combining the advantages of amorphous high mobility oxide semiconductors with a multilayer dielectric, novel devices have been designed, capable of providing a sensitivity one order of magnitude higher than the one shown by the standard RADFETs. Thanks to their unique properties, these sensors have been integrated with a wireless readout system based on a commercial RFID tag and its assessment is presented

Solution-processed Amorphous Oxide Semiconductors for Thin-film Power Management Circuitry

Thin-film electronics has opened up new applications not achievable by wafer-based electronics. Following commercial success in displays and solar cells, the future industry sectors for thin film devices are limitless, and include novel wearable electronics and medical devices. Such new applications enabled by human-size electronics have been widely investigated, but their potential use in power-management circuitry has been seldom addressed. The key strengths of thin-film electronics are that they can be deposited on various substrates at a large-area scale, and they can be additively deposited on existing device layers without degrading them. These advantageous features can be used to overcome the current barriers facing silicon (Si) electronics in power-management applications. Namely, thin film electronics can be used to directly deposit circuits including power harvesters on RFID tags to reduce the current tag cost based on Si IC. Furthermore, they can be directly heterointegrated with Si chips to enhance their voltage handling capability. Finally, thin film electronics can be deposited onto solar cell arrays to improve efficiency by managing partial shading conditions. Among thin-film materials, we explore the scope of solution-derived amorphous oxide semiconductor (AOS) due to its high carrier mobility, wide band-gap, and in-air deposition capability. In this thesis, we push the boundaries of AOS by (i) developing an air-stable, ink-based deposition process for high-performance amorphous zinc-tin-oxide semiconductor. We choose a deposition process based on metal-organic decomposition, such that the film properties are independent of relative humidity in the deposition ambient, enabling future large-area roll-to-roll processing. (ii) Second, by exploiting in situ chemical evolution, namely reduction and oxidation, at the interface of zinc-tin-oxide and various metal electrodes (primarily Pd, Mo, and Ag), we intentionally manipulate the electrode contact properties to form high-quality ohmic contacts and Schottky barriers. We explain the results based on competing thermodynamic processes and interlayer diffusion. (iii) Third, we combine these techniques to fabricate novel devices, namely vertically-conducting thin-film diodes and Schottky-gated TFTs, and we investigate the impact of the contact formation process on the resulting device physics using temperature-dependent current-voltage measurements. (iv) Finally, we demonstrate the use of these devices in several novel thin-film power electronics applications. These circuits include thin-film RFID energy harvesters, thin-film heterointegrated 3D-IC on Si chip for voltage bridging, and thin-film bypass diodes for future integration on solar cells to improve efficiency under partial shading conditions.PHDElectrical and Computer EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/149911/1/ybson_1.pd