Cross-Layer Automated Hardware Design for Accuracy-Configurable Approximate Computing

Approximate Computing trades off computation accuracy against performance or energy efficiency. It is a design paradigm that arose in the last decade as an answer to diminishing returns from Dennard\u27s scaling and a shift in the prominent workloads. A range of modern workloads, categorized mainly as recognition, mining, and synthesis, features an inherent tolerance to approximations. Their characteristics, such as redundancies in their input data and robust-to-noise algorithms, allow them to produce outputs of acceptable quality, despite an approximation in some of their computations. Approximate Computing leverages the application tolerance by relaxing the exactness in computation towards primary design goals of increasing performance or improving energy efficiency. Existing techniques span across the abstraction layers of computer systems where cross-layer techniques are shown to offer a larger design space and yield higher savings. Currently, the majority of the existing work aims at meeting a single accuracy. The extent of approximation tolerance, however, significantly varies with a change in input characteristics and applications. In this dissertation, methods and implementations are presented for cross-layer and automated design of accuracy-configurable Approximate Computing to maximally exploit the performance and energy benefits. In particular, this dissertation addresses the following challenges and introduces novel contributions: A main Approximate Computing category in hardware is to scale either voltage or frequency beyond the safe limits for power or performance benefits, respectively. The rationale is that timing errors would be gradual and for an initial range tolerable. This scaling enables a fine-grain accuracy-configurability by varying the timing error occurrence. However, conventional synthesis tools aim at meeting a single delay for all paths within the circuit. Subsequently, with voltage or frequency scaling, either all paths succeed, or a large number of paths fail simultaneously, with a steep increase in error rate and magnitude. This dissertation presents an automated method for minimizing path delays by individually constraining the primary outputs of combinational circuits. As a result, it reduces the number of failing paths and makes the timing errors significantly more gradual, and also rarer and smaller on average. Additionally, it reveals that delays can be significantly reduced towards the least significant bit (LSB) and allows operating at a higher frequency when small operands are computed. Precision scaling, i.e., reducing the representation of data and its accuracy is widely used in multiple abstraction layers in Approximate Computing. Reducing data precision also reduces the transistor toggles, and therefore the dynamic power consumption. Application and architecture level precision scaling results in using only LSBs of the circuit. Arithmetic circuits often have less complexity and logic depth in LSBs compared to most significant bits (MSB). To take advantage of this circuit property, a delay-altering synthesis methodology is proposed. The method finds energy-optimal delay values under configurable precision usage and assigns them to primary outputs used for different precisions. Thereby, it enables dynamic frequency-precision scalable circuits for energy efficiency. Within the hardware architecture, it is possible to instantiate multiple units with the same functionality with different fixed approximation levels, where each block benefits from having fewer transistors and also synthesis relaxations. These blocks can be selected dynamically and thus allow to configure the accuracy during runtime. Instantiating such approximate blocks can be a lower dynamic power but higher area and leakage cost alternative to the current state-of-the-art gating mechanisms which switch off a group of paths in the circuit to reduce the toggling activity. Jointly, instantiating multiple blocks and gating mechanisms produce a large design space of accuracy-configurable hardware, where energy-optimal solutions require a cross-layer search in architecture and circuit levels. To that end, an approximate hardware synthesis methodology is proposed with joint optimizations in architecture and circuit for dynamic accuracy scaling, and thereby it enables energy vs. area trade-offs

Enhancing Power Efficient Design Techniques in Deep Submicron Era

Excessive power dissipation has been one of the major bottlenecks for design and manufacture in the past couple of decades. Power efficient design has become more and more challenging when technology scales down to the deep submicron era that features the dominance of leakage, the manufacture variation, the on-chip temperature variation and higher reliability requirements, among others. Most of the computer aided design (CAD) tools and algorithms currently used in industry were developed in the pre deep submicron era and did not consider the new features explicitly and adequately. Recent research advances in deep submicron design, such as the mechanisms of leakage, the source and characterization of manufacture variation, the cause and models of on-chip temperature variation, provide us the opportunity to incorporate these important issues in power efficient design. We explore this opportunity in this dissertation by demonstrating that significant power reduction can be achieved with only minor modification to the existing CAD tools and algorithms. First, we consider peak current, which has become critical for circuit's reliability in deep submicron design. Traditional low power design techniques focus on the reduction of average power. We propose to reduce peak current while keeping the overhead on average power as small as possible. Second, dual Vt technique and gate sizing have been used simultaneously for leakage savings. However, this approach becomes less effective in deep submicron design. We propose to use the newly developed process-induced mechanical stress to enhance its performance. Finally, in deep submicron design, the impact of on-chip temperature variation on leakage and performance becomes more and more significant. We propose a temperature-aware dual Vt approach to alleviate hot spots and achieve further leakage reduction. We also consider this leakage-temperature dependency in the dynamic voltage scaling approach and discover that a commonly accepted result is incorrect for the current technology. We conduct extensive experiments with popular design benchmarks, using the latest industry CAD tools and design libraries. The results show that our proposed enhancements are promising in power saving and are practical to solve the low power design challenges in deep submicron era

클럭 게이팅 및 플립 플롭 동시 최적화를 위한 설계 및 알고리즘

학위논문 (석사)-- 서울대학교 대학원 : 공과대학 전기·정보공학부, 2019. 2. 김태환.본 논문에서는 표준 셀에서부터 배치 단계에 이르는 다양한 설계단에에서 칩의 동적 전력을 최적화 기법을 소개한다. 이 연구는 우선 데이터 구동형 (즉, 토글링 기반) 클럭 게이팅이 종래 클럭 게이팅 기법들에서 결코 다루어지지 않았던 플립 플 롭의 합성과 밀접하게 통합될 수 있는 방법을 연구한다. 우리의 관측의 핵심은 플립 플롭 셀의 일부 내부 부품이 클럭 게이팅 인에이블 신호를 생성 하기 위해 재사용 될 수 있다는 것이다. 이를 바탕으로 eXOR-FF 라고 불리는 새롭게 최적화된 플립 플롭 배선 구조를 제안합니다. 이 구조에서는 매 클럭 주기마다 내부 로직을 재사용 하여 클럭 게이팅을 통해 플립 플롭을 활성화할지 또는 비활성화할지 결정합니다. 모든 쌍의 플립 플롭 및 토글릴 감지 로직에서의 영역을 절약함에 따라서 누설 및 동적 전력의 절전 효과를 달성합니다. 그런 다음, 두 가지고유한 장점을 제공하는 배치/타이밍 인식 클럭 게이팅 탐색에 대한 포괄적인 방법론을 제안합니다. 해당 방 법론은 eXOR-FF 의 이점을 극대화하고, 전력 소비 및 타이밍 영향의 분해에 대한 정밀 분석을 수행하고 틀럭 게이팅 참색의 핵심 엔진을 비용기능으로 변환하는데 가장 적합합니다. ISCAS89, ITC89, ITC99 및 IWLS 2005의 벤치 마크 회로를 사용 한 실험을 통해 제안 된 방법이 이전의 데이터 구동 클록 게이팅 방식과 비교하여 총 전력을 5.6 % 및 면적으로 5.3 % 줄일 수 있음을 보여 주었다.In this paper, we introduce dynamic power optimization techniques applicable for various design stage from standard cell to placement stage. This work firstly investi�gates the problem of how designing data-driven (i.e., toggling based) clock gating can be closely integrated with the synthesis of flip-flops, which has never been addressed in the prior clock gating works. Our key observation is that some internal part of a flip-flop cell can be reused to generate its clock gating enable signal. Based on this, we propose a newly optimized flip-flop wiring structure, called eXOR-FF, in which an internal logic can be reused for every clock cycle to decide if the flip-flop is to be activated or inactivated through clock gating, thereby achieving area saving (thus, leakage as well as dynamic power saving) on every pair of flip-flop and its toggling detection logic. Then, we propose a comprehensive methodology of placement/timing�aware clock gating exploration that provides two unique strengths: best suited for max�imally exploiting the benefit of eXOR-FFs and precise analyses on the decomposition of power consumptions and timing impact, and translating them into cost functions in core engine of clock gating exploration. Through experiments with benchmark circuits in ISCAS89, ITC89, ITC99 and IWLS 2005, it is shown that our proposed method is able to reduce the total power by 5.6% and total cell area by 5.3% compared with the previous data-driven clock gating method in [1].Abstract Contents List of Tables List of Figures 1 Introduction 1.1 Power Consumption in CMOS Digital Design 1.2 Low Power Design Methodologies 1.3 Contribution of This Thesis 2 Preliminary and Motivations 6 2.1 Background 2.2 Observation on Area and Power Saving 2.3 Observation on Timing Impact 3 Redesign of Flip-flops Specialized for Clock Gating 3.1 Observation on Area Impact 4 Placement-aware Clock Gating Methodology Utilizing eXOR-FF Cells 4.1 Overall Design Flow 4.2 Cost Formulation for Conventional Clock Gating 4.3 Cost Formulation for Our Clock Gating using eXOR-FFs 5 Experiments 5.1 Experimental Setup 5.2 Experimental Results 5.3 Comparing with Industry Algorithm 6 Conclusion Abstract (In Korean)Maste

Power Management Techniques for Data Centers: A Survey

With growing use of internet and exponential growth in amount of data to be stored and processed (known as 'big data'), the size of data centers has greatly increased. This, however, has resulted in significant increase in the power consumption of the data centers. For this reason, managing power consumption of data centers has become essential. In this paper, we highlight the need of achieving energy efficiency in data centers and survey several recent architectural techniques designed for power management of data centers. We also present a classification of these techniques based on their characteristics. This paper aims to provide insights into the techniques for improving energy efficiency of data centers and encourage the designers to invent novel solutions for managing the large power dissipation of data centers.Comment: Keywords: Data Centers, Power Management, Low-power Design, Energy Efficiency, Green Computing, DVFS, Server Consolidatio

The Thermal-Constrained Real-Time Systems Design on Multi-Core Platforms -- An Analytical Approach

Over the past decades, the shrinking transistor size enabled more transistors to be integrated into an IC chip, to achieve higher and higher computing performances. However, the semiconductor industry is now reaching a saturation point of Moore’s Law largely due to soaring power consumption and heat dissipation, among other factors. High chip temperature not only significantly increases packing/cooling cost, degrades system performance and reliability, but also increases the energy consumption and even damages the chip permanently. Although designing 2D and even 3D multi-core processors helps to lower the power/thermal barrier for single-core architectures by exploring the thread/process level parallelism, the higher power density and longer heat removal path has made the thermal problem substantially more challenging, surpassing the heat dissipation capability of traditional cooling mechanisms such as cooling fan, heat sink, heat spread, etc., in the design of new generations of computing systems. As a result, dynamic thermal management (DTM), i.e. to control the thermal behavior by dynamically varying computing performance and workload allocation on an IC chip, has been well-recognized as an effective strategy to deal with the thermal challenges. Over the past decades, the shrinking transistor size, benefited from the advancement of IC technology, enabled more transistors to be integrated into an IC chip, to achieve higher and higher computing performances. However, the semiconductor industry is now reaching a saturation point of Moore’s Law largely due to soaring power consumption and heat dissipation, among other factors. High chip temperature not only significantly increases packing/cooling cost, degrades system performance and reliability, but also increases the energy consumption and even damages the chip permanently. Although designing 2D and even 3D multi-core processors helps to lower the power/thermal barrier for single-core architectures by exploring the thread/process level parallelism, the higher power density and longer heat removal path has made the thermal problem substantially more challenging, surpassing the heat dissipation capability of traditional cooling mechanisms such as cooling fan, heat sink, heat spread, etc., in the design of new generations of computing systems. As a result, dynamic thermal management (DTM), i.e. to control the thermal behavior by dynamically varying computing performance and workload allocation on an IC chip, has been well-recognized as an effective strategy to deal with the thermal challenges. Different from many existing DTM heuristics that are based on simple intuitions, we seek to address the thermal problems through a rigorous analytical approach, to achieve the high predictability requirement in real-time system design. In this regard, we have made a number of important contributions. First, we develop a series of lemmas and theorems that are general enough to uncover the fundamental principles and characteristics with regard to the thermal model, peak temperature identification and peak temperature reduction, which are key to thermal-constrained real-time computer system design. Second, we develop a design-time frequency and voltage oscillating approach on multi-core platforms, which can greatly enhance the system throughput and its service capacity. Third, different from the traditional workload balancing approach, we develop a thermal-balancing approach that can substantially improve the energy efficiency and task partitioning feasibility, especially when the system utilization is high or with a tight temperature constraint. The significance of our research is that, not only can our proposed algorithms on throughput maximization and energy conservation outperform existing work significantly as demonstrated in our extensive experimental results, the theoretical results in our research are very general and can greatly benefit other thermal-related research

Physical parameter-aware Networks-on-Chip design

PhD ThesisNetworks-on-Chip (NoCs) have been proposed as a scalable, reliable and power-efficient communication fabric for chip multiprocessors (CMPs) and multiprocessor systems-on-chip (MPSoCs). NoCs determine both the performance and the reliability of such systems, with a significant power demand that is expected to increase due to developments in both technology and architecture. In terms of architecture, an important trend in many-core systems architecture is to increase the number of cores on a chip while reducing their individual complexity. This trend increases communication power relative to computation power. Moreover, technology-wise, power-hungry wires are dominating logic as power consumers as technology scales down. For these reasons, the design of future very large scale integration (VLSI) systems is moving from being computation-centric to communication-centric. On the other hand, chip’s physical parameters integrity, especially power and thermal integrity, is crucial for reliable VLSI systems. However, guaranteeing this integrity is becoming increasingly difficult with the higher scale of integration due to increased power density and operating frequencies that result in continuously increasing temperature and voltage drops in the chip. This is a challenge that may prevent further shrinking of devices. Thus, tackling the challenge of power and thermal integrity of future many-core systems at only one level of abstraction, the chip and package design for example, is no longer sufficient to ensure the integrity of physical parameters. New designtime and run-time strategies may need to work together at different levels of abstraction, such as package, application, network, to provide the required physical parameter integrity for these large systems. This necessitates strategies that work at the level of the on-chip network with its rising power budget. This thesis proposes models, techniques and architectures to improve power and thermal integrity of Network-on-Chip (NoC)-based many-core systems. The thesis is composed of two major parts: i) minimization and modelling of power supply variations to improve power integrity; and ii) dynamic thermal adaptation to improve thermal integrity. This thesis makes four major contributions. The first is a computational model of on-chip power supply variations in NoCs. The proposed model embeds a power delivery model, an NoC activity simulator and a power model. The model is verified with SPICE simulation and employed to analyse power supply variations in synthetic and real NoC workloads. Novel observations regarding power supply noise correlation with different traffic patterns and routing algorithms are found. The second is a new application mapping strategy aiming vii to minimize power supply noise in NoCs. This is achieved by defining a new metric, switching activity density, and employing a force-based objective function that results in minimizing switching density. Significant reductions in power supply noise (PSN) are achieved with a low energy penalty. This reduction in PSN also results in a better link timing accuracy. The third contribution is a new dynamic thermal-adaptive routing strategy to effectively diffuse heat from the NoC-based threedimensional (3D) CMPs, using a dynamic programming (DP)-based distributed control architecture. Moreover, a new approach for efficient extension of two-dimensional (2D) partially-adaptive routing algorithms to 3D is presented. This approach improves three-dimensional networkon- chip (3D NoC) routing adaptivity while ensuring deadlock-freeness. Finally, the proposed thermal-adaptive routing is implemented in field-programmable gate array (FPGA), and implementation challenges, for both thermal sensing and the dynamic control architecture are addressed. The proposed routing implementation is evaluated in terms of both functionality and performance. The methodologies and architectures proposed in this thesis open a new direction for improving the power and thermal integrity of future NoC-based 2D and 3D many-core architectures

근사 컴퓨팅을 이용한 회로 노화 보상과 에너지 효율적인 신경망 구현

학위논문 (박사) -- 서울대학교 대학원 : 공과대학 전기·정보공학부, 2020. 8. 이혁재.Approximate computing reduces the cost (energy and/or latency) of computations by relaxing the correctness (i.e., precision) of computations up to the level, which is dependent on types of applications. Moreover, it can be realized in various hierarchies of computing system design from circuit level to application level. This dissertation presents the methodologies applying approximate computing across such hierarchies; compensating aging-induced delay in logic circuit by dynamic computation approximation (Chapter 1), designing energy-efficient neural network by combining low-power and low-latency approximate neuron models (Chapter 2), and co-designing in-memory gradient descent module with neural processing unit so as to address a memory bottleneck incurred by memory I/O for high-precision data (Chapter 3). The first chapter of this dissertation presents a novel design methodology to turn the timing violation caused by aging into computation approximation error without the reliability guardband or increasing the supply voltage. It can be realized by accurately monitoring the critical path delay at run-time. The proposal is evaluated at two levels: RTL component level and system level. The experimental results at the RTL component level show a significant improvement in terms of (normalized) mean squared error caused by the timing violation and, at the system level, show that the proposed approach successfully transforms the aging-induced timing violation errors into much less harmful computation approximation errors, therefore it recovers image quality up to perceptually acceptable levels. It reduces the dynamic and static power consumption by 21.45% and 10.78%, respectively, with 0.8% area overhead compared to the conventional approach. The second chapter of this dissertation presents an energy-efficient neural network consisting of alternative neuron models; Stochastic-Computing (SC) and Spiking (SP) neuron models. SC has been adopted in various fields to improve the power efficiency of systems by performing arithmetic computations stochastically, which approximates binary computation in conventional computing systems. Moreover, a recent work showed that deep neural network (DNN) can be implemented in the manner of stochastic computing and it greatly reduces power consumption. However, Stochastic DNN (SC-DNN) suffers from problem of high latency as it processes only a bit per cycle. To address such problem, it is proposed to adopt Spiking DNN (SP-DNN) as an input interface for SC-DNN since SP effectively processes more bits per cycle than SC-DNN. Moreover, this chapter resolves the encoding mismatch problem, between two different neuron models, without hardware cost by compensating the encoding mismatch with synapse weight calibration. A resultant hybrid DNN (SPSC-DNN) consists of SP-DNN as bottom layers and SC-DNN as top layers. Exploiting the reduced latency from SP-DNN and low-power consumption from SC-DNN, the proposed SPSC-DNN achieves improved energy-efficiency with lower error-rate compared to SC-DNN and SP-DNN in same network configuration. The third chapter of this dissertation proposes GradPim architecture, which accelerates the parameter updates by in-memory processing which is codesigned with 8-bit floating-point training in Neural Processing Unit (NPU) for deep neural networks. By keeping the high precision processing algorithms in memory, such as the parameter update incorporating high-precision weights in its computation, the GradPim architecture can achieve high computational efficiency using 8-bit floating point in NPU and also gain power efficiency by eliminating massive high-precision data transfers between NPU and off-chip memory. A simple extension of DDR4 SDRAM utilizing bank-group parallelism makes the operation designs in processing-in-memory (PIM) module efficient in terms of hardware cost and performance. The experimental results show that the proposed architecture can improve the performance of the parameter update phase in the training by up to 40% and greatly reduce the memory bandwidth requirement while posing only a minimal amount of overhead to the protocol and the DRAM area.근사 컴퓨팅은 연산의 정확도의 손실을 어플리케이션 별 적절한 수준까지 허용함으로써 연산에 필요한 비용 (에너지나 지연시간)을 줄인다. 게다가, 근사 컴퓨팅은 컴퓨팅 시스템 설계의 회로 계층부터 어플리케이션 계층까지 다양한 계층에 적용될 수 있다. 본 논문에서는 근사 컴퓨팅 방법론을 다양한 시스템 설계의 계층에 적용하여 전력과 에너지 측면에서 이득을 얻을 수 있는 방법들을 제안하였다. 이는, 연산 근사화 (computation Approximation)를 통해 회로의 노화로 인해 증가된 지연시간을 추가적인 전력소모 없이 보상하는 방법과 (챕터 1), 근사 뉴런모델 (approximate neuron model)을 이용해 에너지 효율이 높은 신경망을 구성하는 방법 (챕터 2), 그리고 메모리 대역폭으로 인한 병목현상 문제를 높은 정확도 데이터를 활용한 연산을 메모리 내에서 수행함으로써 완화시키는 방법을 (챕터3) 제안하였다. 첫 번째 챕터는 회로의 노화로 인한 지연시간위반을 (timing violation) 설계마진이나 (reliability guardband) 공급전력의 증가 없이 연산오차 (computation approximation error)를 통해 보상하는 설계방법론 (design methodology)를 제안하였다. 이를 위해 주요경로의 (critical path) 지연시간을 동작시간에 정확하게 측정할 필요가 있다. 여기서 제안하는 방법론은 RTL component와 system 단계에서 평가되었다. RTL component 단계의 실험결과를 통해 제안한 방식이 표준화된 평균제곱오차를 (normalized mean squared error) 상당히 줄였음을 볼 수 있다. 그리고 system 단계에서는 이미지처리 시스템에서 이미지의 품질이 인지적으로 충분히 회복되는 것을 보임으로써 회로노화로 인해 발생한 지연시간위반 오차가 에러의 크기가 작은 연산오차로 변경되는 것을 확인 할 수 있었다. 결론적으로, 제안된 방법론을 따랐을 때 0.8%의 공간을 (area) 더 사용하는 비용을 지불하고 21.45%의 동적전력소모와 (dynamic power consumption) 10.78%의 정적전력소모의 (static power consumption) 감소를 달성할 수 있었다. 두 번째 챕터는 근사 뉴런모델을 활용하는 고-에너지효율의 신경망을 (neural network) 제안하였다. 본 논문에서 사용한 두 가지의 근사 뉴런모델은 확률컴퓨팅과 (stochastic computing) 스파이킹뉴런 (spiking neuron) 이론들을 기반으로 모델링되었다. 확률컴퓨팅은 산술연산들을 확률적으로 수행함으로써 이진연산을 낮은 전력소모로 수행한다. 최근에 확률컴퓨팅 뉴런모델을 이용하여 심층 신경망 (deep neural network)를 구현할 수 있다는 연구가 진행되었다. 그러나, 확률컴퓨팅을 뉴런모델링에 활용할 경우 심층신경망이 매 클락사이클마다 (clock cycle) 하나의 비트만을 (bit) 처리하므로, 지연시간 측면에서 매우 나쁠 수 밖에 없는 문제가 있다. 따라서 본 논문에서는 이러한 문제를 해결하기 위하여 스파이킹 뉴런모델로 구성된 스파이킹 심층신경망을 확률컴퓨팅을 활용한 심층신경망 구조와 결합하였다. 스파이킹 뉴런모델의 경우 매 클락사이클마다 여러 비트를 처리할 수 있으므로 심층신경망의 입력 인터페이스로 사용될 경우 지연시간을 줄일 수 있다. 하지만, 확률컴퓨팅 뉴런모델과 스파이킹 뉴런모델의 경우 부호화 (encoding) 방식이 다른 문제가 있다. 따라서 본 논문에서는 해당 부호화 불일치 문제를 모델의 파라미터를 학습할 때 고려함으로써, 파라미터들의 값이 부호화 불일치를 고려하여 조절 (calibration) 될 수 있도록 하여 문제를 해결하였다. 이러한 분석의 결과로, 앞 쪽에는 스파이킹 심층신경망을 배치하고 뒷 쪽애는 확률컴퓨팅 심층신경망을 배치하는 혼성신경망을 제안하였다. 혼성신경망은 스파이킹 심층신경망을 통해 매 클락사이클마다 처리되는 비트 양의 증가로 인한 지연시간 감소 효과와 확률컴퓨팅 심층신경망의 저전력 소모 특성을 모두 활용함으로써 각 심층신경망을 따로 사용하는 경우 대비 우수한 에너지 효율성을 비슷하거나 더 나은 정확도 결과를 내면서 달성한다. 세 번째 챕터는 심층신경망을 8비트 부동소숫점 연산으로 학습하는 신경망처리유닛의 (neural processing unit) 파라미터 갱신을 (parameter update) 메모리-내-연산으로 (in-memory processing) 가속하는 GradPIM 아키텍쳐를 제안하였다. GradPIM은 8비트의 낮은 정확도 연산은 신경망처리유닛에 남기고, 높은 정확도를 가지는 데이터를 활용하는 연산은 (파라미터 갱신) 메모리 내부에 둠으로써 신경망처리유닛과 메모리간의 데이터통신의 양을 줄여, 높은 연산효율과 전력효율을 달성하였다. 또한, GradPIM은 bank-group 수준의 병렬화를 이루어 내 높은 내부 대역폭을 활용함으로써 메모리 대역폭을 크게 확장시킬 수 있게 되었다. 또한 이러한 메모리 구조의 변경이 최소화되었기 때문에 추가적인 하드웨어 비용도 최소화되었다. 실험 결과를 통해 GradPIM이 최소한의 DRAM 프로토콜 변화와 DRAM칩 내의 공간사용을 통해 심층신경망 학습과정 중 파라미터 갱신에 필요한 시간을 40%만큼 향상시켰음을 보였다.Chapter I: Dynamic Computation Approximation for Aging Compensation 1 1.1 Introduction 1 1.1.1 Chip Reliability 1 1.1.2 Reliability Guardband 2 1.1.3 Approximate Computing in Logic Circuits 2 1.1.4 Computation approximation for Aging Compensation 3 1.1.5 Motivational Case Study 4 1.2 Previous Work 5 1.2.1 Aging-induced Delay 5 1.2.2 Delay-Configurable Circuits 6 1.3 Proposed System 8 1.3.1 Overview of the Proposed System 8 1.3.2 Proposed Adder 9 1.3.3 Proposed Multiplier 11 1.3.4 Proposed Monitoring Circuit 16 1.3.5 Aging Compensation Scheme 19 1.4 Design Methodology 20 1.5 Evaluation 24 1.5.1 Experimental setup 24 1.5.2 RTL component level Adder/Multiplier 27 1.5.3 RTL component level Monitoring circuit 30 1.5.4 System level 31 1.6 Summary 38 Chapter II: Energy-Efficient Neural Network by Combining Approximate Neuron Models 40 2.1 Introduction 40 2.1.1 Deep Neural Network (DNN) 40 2.1.2 Low-power designs for DNN 41 2.1.3 Stochastic-Computing Deep Neural Network 41 2.1.4 Spiking Deep Neural Network 43 2.2 Hybrid of Stochastic and Spiking DNNs 44 2.2.1 Stochastic-Computing vs Spiking Deep Neural Network 44 2.2.2 Combining Spiking Layers and Stochastic Layers 46 2.2.3 Encoding Mismatch 47 2.3 Evaluation 49 2.3.1 Latency and Test Error 49 2.3.2 Energy Efficiency 51 2.4 Summary 54 Chapter III: GradPIM: In-memory Gradient Descent in Mixed-Precision DNN Training 55 3.1 Introduction 55 3.1.1 Neural Processing Unit 55 3.1.2 Mixed-precision Training 56 3.1.3 Mixed-precision Training with In-memory Gradient Descent 57 3.1.4 DNN Parameter Update Algorithms 59 3.1.5 Modern DRAM Architecture 61 3.1.6 Motivation 63 3.2 Previous Work 65 3.2.1 Processing-In-Memory 65 3.2.2 Co-design Neural Processing Unit and Processing-In-Memory 66 3.2.3 Low-precision Computation in NPU 67 3.3 GradPIM 68 3.3.1 GradPIM Architecture 68 3.3.2 GradPIM Operations 69 3.3.3 Timing Considerations 70 3.3.4 Update Phase Procedure 73 3.3.5 Commanding GradPIM 75 3.4 NPU Co-design with GradPIM 76 3.4.1 NPU Architecture 76 3.4.2 Data Placement 79 3.5 Evaluation 82 3.5.1 Evaluation Methodology 82 3.5.2 Experimental Results 83 3.5.3 Sensitivity Analysis 88 3.5.4 Layer Characterizations 90 3.5.5 Distributed Data Parallelism 90 3.6 Summary 92 3.6.1 Discussion 92 Bibliography 113 요약 114Docto

Energy challenges for ICT

The energy consumption from the expanding use of information and communications technology (ICT) is unsustainable with present drivers, and it will impact heavily on the future climate change. However, ICT devices have the potential to contribute signi - cantly to the reduction of CO2 emission and enhance resource e ciency in other sectors, e.g., transportation (through intelligent transportation and advanced driver assistance systems and self-driving vehicles), heating (through smart building control), and manu- facturing (through digital automation based on smart autonomous sensors). To address the energy sustainability of ICT and capture the full potential of ICT in resource e - ciency, a multidisciplinary ICT-energy community needs to be brought together cover- ing devices, microarchitectures, ultra large-scale integration (ULSI), high-performance computing (HPC), energy harvesting, energy storage, system design, embedded sys- tems, e cient electronics, static analysis, and computation. In this chapter, we introduce challenges and opportunities in this emerging eld and a common framework to strive towards energy-sustainable ICT