Design for pre-bond testability in 3D integrated circuits

In this dissertation we propose several DFT techniques specific to 3D stacked IC systems. The goal has explicitly been to create techniques that integrate easily with existing IC test systems. Specifically, this means utilizing scan- and wrapper-based techniques, two foundations of the digital IC test industry. First, we describe a general test architecture for 3D ICs. In this architecture, each tier of a 3D design is wrapped in test control logic that both manages tier test pre-bond and integrates the tier into the large test architecture post-bond. We describe a new kind of boundary scan to provide the necessary test control and observation of the partial circuits, and we propose a new design methodology for test hardcore that ensures both pre-bond functionality and post-bond optimality. We present the application of these techniques to the 3D-MAPS test vehicle, which has proven their effectiveness. Second, we extend these DFT techniques to circuit-partitioned designs. We find that boundary scan design is generally sufficient, but that some 3D designs require special DFT treatment. Most importantly, we demonstrate that the functional partitioning inherent in 3D design can potentially decrease the total test cost of verifying a circuit. Third, we present a new CAD algorithm for designing 3D test wrappers. This algorithm co-designs the pre-bond and post-bond wrappers to simultaneously minimize test time and routing cost. On average, our algorithm utilizes over 90% of the wires in both the pre-bond and post-bond wrappers. Finally, we look at the 3D vias themselves to develop a low-cost, high-volume pre-bond test methodology appropriate for production-level test. We describe the shorting probes methodology, wherein large test probes are used to contact multiple small 3D vias. This technique is an all-digital test method that integrates seamlessly into existing test flows. Our experimental results demonstrate two key facts: neither the large capacitance of the probe tips nor the process variation in the 3D vias and the probe tips significantly hinders the testability of the circuits. Taken together, this body of work defines a complete test methodology for testing 3D ICs pre-bond, eliminating one of the key hurdles to the commercialization of 3D technology.PhDCommittee Chair: Lee, Hsien-Hsin; Committee Member: Bakir, Muhannad; Committee Member: Lim, Sung Kyu; Committee Member: Vuduc, Richard; Committee Member: Yalamanchili, Sudhaka

Precise Timing of Digital Signals: Circuits and Applications

With the rapid advances in process technologies, the performance of state-of-the-art integrated circuits is improving steadily. The drive for higher performance is accompanied with increased emphasis on meeting timing constraints not only at the design phase but during device operation as well. Fortunately, technology advancements allow for even more precise control of the timing of digital signals, an advantage which can be used to provide solutions that can address some of the emerging timing issues. In this thesis, circuit and architectural techniques for the precise timing of digital signals are explored. These techniques are demonstrated in applications addressing timing issues in modern digital systems. A methodology for slow-speed timing characterization of high-speed pipelined datapaths is proposed. The technique uses a clock-timing circuit to create shifted versions of a slow-speed clock. These clocks control the data flow in the pipeline in the test mode. Test results show that the design provides an average timing resolution of 52.9ps in 0.18μm CMOS technology. Results also demonstrate the ability of the technique to track the performance of high-speed pipelines at a reduced clock frequency and to test the clock-timing circuit itself. In order to achieve higher resolutions than that of an inverter/buffer stage, a differential (vernier) delay line is commonly used. To allow for the design of differential delay lines with programmable delays, a digitally-controlled delay-element is proposed. The delay element is monotonic and achieves a high degree of transfer characteristics' (digital code vs. delay) linearity. Using the proposed delay element, a sub-1ps resolution is demonstrated experimentally in 0.18μm CMOS. The proposed delay element with a fixed delay step of 2ps is used to design a high-precision all-digital phase aligner. High-precision phase alignment has many applications in modern digital systems such as high-speed memory controllers, clock-deskew buffers, and delay and phase-locked loops. The design is based on a differential delay line and a variation tolerant phase detector using redundancy. Experimental results show that the phase aligner's range is from -264ps to +247ps which corresponds to an average delay step of approximately 2.43ps. For various input phase difference values, test results show that the difference is reduced to less than 2ps at the output of the phase aligner. On-chip time measurement is another application that requires precise timing. It has applications in modern automatic test equipment and on-chip characterization of jitter and skew. In order to achieve small conversion time, a flash time-to-digital converter is proposed. Mismatch between the various delay comparators limits the time measurement precision. This is demonstrated through an experiment in which a 6-bit, 2.5ps resolution flash time-to-digital converter provides an effective resolution of only 4-bits. The converter achieves a maximum conversion rate of 1.25GSa/s

High Quality Compact Delay Test Generation

Delay testing is used to detect timing defects and ensure that a circuit meets its timing specifications. The growing need for delay testing is a result of the advances in deep submicron (DSM) semiconductor technology and the increase in clock frequency. Small delay defects that previously were benign now produce delay faults, due to reduced timing margins. This research focuses on the development of new test methods for small delay defects, within the limits of affordable test generation cost and pattern count. First, a new dynamic compaction algorithm has been proposed to generate compacted test sets for K longest paths per gate (KLPG) in combinational circuits or scan-based sequential circuits. This algorithm uses a greedy approach to compact paths with non-conflicting necessary assignments together during test generation. Second, to make this dynamic compaction approach practical for industrial use, a recursive learning algorithm has been implemented to identify more necessary assignments for each path, so that the path-to-test-pattern matching using necessary assignments is more accurate. Third, a realistic low cost fault coverage metric targeting both global and local delay faults has been developed. The metric suggests the test strategy of generating a different number of longest paths for each line in the circuit while maintaining high fault coverage. The number of paths and type of test depends on the timing slack of the paths under this metric. Experimental results for ISCAS89 benchmark circuits and three industry circuits show that the pattern count of KLPG can be significantly reduced using the proposed methods. The pattern count is comparable to that of transition fault test, while achieving higher test quality. Finally, the proposed ATPG methodology has been applied to an industrial quad-core microprocessor. FMAX testing has been done on many devices and silicon data has shown the benefit of KLPG test

Radiation Hardened by Design Methodologies for Soft-Error Mitigated Digital Architectures

abstract: Digital architectures for data encryption, processing, clock synthesis, data transfer, etc. are susceptible to radiation induced soft errors due to charge collection in complementary metal oxide semiconductor (CMOS) integrated circuits (ICs). Radiation hardening by design (RHBD) techniques such as double modular redundancy (DMR) and triple modular redundancy (TMR) are used for error detection and correction respectively in such architectures. Multiple node charge collection (MNCC) causes domain crossing errors (DCE) which can render the redundancy ineffectual. This dissertation describes techniques to ensure DCE mitigation with statistical confidence for various designs. Both sequential and combinatorial logic are separated using these custom and computer aided design (CAD) methodologies. Radiation vulnerability and design overhead are studied on VLSI sub-systems including an advanced encryption standard (AES) which is DCE mitigated using module level coarse separation on a 90-nm process with 99.999% DCE mitigation. A radiation hardened microprocessor (HERMES2) is implemented in both 90-nm and 55-nm technologies with an interleaved separation methodology with 99.99% DCE mitigation while achieving 4.9% increased cell density, 28.5 % reduced routing and 5.6% reduced power dissipation over the module fences implementation. A DMR register-file (RF) is implemented in 55 nm process and used in the HERMES2 microprocessor. The RF array custom design and the decoders APR designed are explored with a focus on design cycle time. Quality of results (QOR) is studied from power, performance, area and reliability (PPAR) perspective to ascertain the improvement over other design techniques. A radiation hardened all-digital multiplying pulsed digital delay line (DDL) is designed for double data rate (DDR2/3) applications for data eye centering during high speed off-chip data transfer. The effect of noise, radiation particle strikes and statistical variation on the designed DDL are studied in detail. The design achieves the best in class 22.4 ps peak-to-peak jitter, 100-850 MHz range at 14 pJ/cycle energy consumption. Vulnerability of the non-hardened design is characterized and portions of the redundant DDL are separated in custom and auto-place and route (APR). Thus, a range of designs for mission critical applications are implemented using methodologies proposed in this work and their potential PPAR benefits explored in detail.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

Circuits and Systems Advances in Near Threshold Computing

Modern society is witnessing a sea change in ubiquitous computing, in which people have embraced computing systems as an indispensable part of day-to-day existence. Computation, storage, and communication abilities of smartphones, for example, have undergone monumental changes over the past decade. However, global emphasis on creating and sustaining green environments is leading to a rapid and ongoing proliferation of edge computing systems and applications. As a broad spectrum of healthcare, home, and transport applications shift to the edge of the network, near-threshold computing (NTC) is emerging as one of the promising low-power computing platforms. An NTC device sets its supply voltage close to its threshold voltage, dramatically reducing the energy consumption. Despite showing substantial promise in terms of energy efficiency, NTC is yet to see widescale commercial adoption. This is because circuits and systems operating with NTC suffer from several problems, including increased sensitivity to process variation, reliability problems, performance degradation, and security vulnerabilities, to name a few. To realize its potential, we need designs, techniques, and solutions to overcome these challenges associated with NTC circuits and systems. The readers of this book will be able to familiarize themselves with recent advances in electronics systems, focusing on near-threshold computing

Methodologies for Accelerated Analysis of the Reliability and the Energy Efficiency Levels of Modern Microprocessor Architectures

Η εξέλιξη της τεχνολογίας ημιαγωγών, της αρχιτεκτονικής υπολογιστών και της σχεδίασης οδηγεί σε αύξηση της απόδοσης των σύγχρονων μικροεπεξεργαστών, η οποία επίσης συνοδεύεται από αύξηση της ευπάθειας των προϊόντων. Οι σχεδιαστές εφαρμόζουν διάφορες τεχνικές κατά τη διάρκεια της ζωής των ολοκληρωμένων κυκλωμάτων με σκοπό να διασφαλίσουν τα υψηλά επίπεδα αξιοπιστίας των παραγόμενων προϊόντων και να τα προστατέψουν από διάφορες κατηγορίες σφαλμάτων διασφαλίζοντας την ορθή λειτουργία τους. Αυτή η διδακτορική διατριβή προτείνει καινούριες μεθόδους για να διασφαλίσει τα υψηλά επίπεδα αξιοπιστίας και ενεργειακής απόδοσης των σύγχρονων μικροεπεξεργαστών οι οποίες μπορούν να εφαρμοστούν κατά τη διάρκεια του πρώιμου σχεδιαστικού σταδίου, του σταδίου παραγωγής ή του σταδίου της κυκλοφορίας των ολοκληρωμένων κυκλωμάτων στην αγορά. Οι συνεισφορές αυτής της διατριβής μπορούν να ομαδοποιηθούν στις ακόλουθες δύο κατηγορίες σύμφωνα με το στάδιο της ζωής των μικροεπεξεργαστών στο οποίο εφαρμόζονται: • Πρώιμο σχεδιαστικό στάδιο: Η στατιστική εισαγωγή σφαλμάτων σε δομές που είναι μοντελοποιημένες σε προσομοιωτές οι οποίοι στοχεύουν στην μελέτη της απόδοσης είναι μια επιστημονικά καθιερωμένη μέθοδος για την ακριβή μέτρηση της αξιοπιστίας, αλλά υστερεί στον αργό χρόνο εκτέλεσης. Σε αυτή τη διατριβή, αρχικά παρουσιάζουμε ένα νέο πλήρως αυτοματοποιημένο εργαλείο εισαγωγής σφαλμάτων σε μικροαρχιτεκτονικό επίπεδο που στοχεύει στην ακριβή αξιολόγηση της αξιοπιστίας ενός μεγάλου πλήθους μονάδων υλικού σε σχέση με διάφορα μοντέλα σφαλμάτων (παροδικά, διακοπτόμενα, μόνιμα σφάλματα). Στη συνέχεια, χρησιμοποιώντας το ίδιο εργαλείο και στοχεύοντας τα παροδικά σφάλματα, παρουσιάζουμε διάφορες μελέτες σχετιζόμενες με την αξιοπιστία και την απόδοση, οι οποίες μπορούν να βοηθήσουν τις σχεδιαστικές αποφάσεις στα πρώιμα στάδια της ζωής των επεξεργαστών. Τελικά, προτείνουμε δύο μεθοδολογίες για να επιταχύνουμε τα μαζικά πειράματα στατιστικής εισαγωγής σφαλμάτων. Στην πρώτη, επιταχύνουμε τα πειράματα έπειτα από την πραγματική εισαγωγή των σφαλμάτων στις δομές του υλικού. Στη δεύτερη, επιταχύνουμε ακόμη περισσότερο τα πειράματα προτείνοντας τη μεθοδολογία με όνομα MeRLiN, η οποία βασίζεται στη μείωση της αρχικής λίστας σφαλμάτων μέσω της ομαδοποίησής τους σε ισοδύναμες ομάδες έπειτα από κατηγοριοποίηση σύμφωνα με την εντολή που τελικά προσπελαύνει τη δομή που φέρει το σφάλμα. • Παραγωγικό στάδιο και στάδιο κυκλοφορίας στην αγορά: Οι συνεισφορές αυτής της διδακτορικής διατριβής σε αυτά τα στάδια της ζωής των μικροεπεξεργαστών καλύπτουν δύο σημαντικά επιστημονικά πεδία. Αρχικά, χρησιμοποιώντας το ολοκληρωμένο κύκλωμα των 48 πυρήνων με ονομασία Intel SCC, προτείνουμε μια τεχνική επιτάχυνσης του εντοπισμού μονίμων σφαλμάτων που εφαρμόζεται κατά τη διάρκεια λειτουργίας αρχιτεκτονικών με πολλούς πυρήνες, η οποία εκμεταλλεύεται το δίκτυο υψηλής ταχύτητας μεταφοράς μηνυμάτων που διατίθεται στα ολοκληρωμένα κυκλώματα αυτού του είδους. Δεύτερον, προτείνουμε μια λεπτομερή στατιστική μεθοδολογία με σκοπό την ακριβή πρόβλεψη σε επίπεδο συστήματος των ασφαλών ορίων λειτουργίας της τάσης των πυρήνων τύπου ARMv8 που βρίσκονται πάνω στη CPU X-Gene 2.The evolution in semiconductor manufacturing technology, computer architecture and design leads to increase in performance of modern microprocessors, which is also accompanied by increase in products’ vulnerability to errors. Designers apply different techniques throughout microprocessors life-time in order to ensure the high reliability requirements of the delivered products that are defined as their ability to avoid service failures that are more frequent and more severe than is acceptable. This thesis proposes novel methods to guarantee the high reliability and energy efficiency requirements of modern microprocessors that can be applied during the early design phase, the manufacturing phase or after the chips release to the market. The contributions of this thesis can be grouped in the two following categories according to the phase of the CPUs lifecycle that are applied at: • Early design phase: Statistical fault injection using microarchitectural structures modeled in performance simulators is a state-of-the-art method to accurately measure the reliability, but suffers from low simulation throughput. In this thesis, we firstly present a novel fully-automated versatile microarchitecture-level fault injection framework (called MaFIN) for accurate characterization of a wide range of hardware components of an x86-64 microarchitecture with respect to various fault models (transient, intermittent, permanent faults). Next, using the same tool and focusing on transient faults, we present several reliability and performance related studies that can assist design decision in the early design phases. Moreover, we propose two methodologies to accelerate the statistical fault injection campaigns. In the first one, we accelerate the fault injection campaigns after the actual injection of the faults in the simulated hardware structures. In the second, we further accelerate the microarchitecture level fault injection campaigns by proposing MeRLiN a fault pre-processing methodology that is based on the pruning of the initial fault list by grouping the faults in equivalent classes according to the instruction access patterns to hardware entries. • Manufacturing phase and release to the market: The contributions of this thesis in these phases of microprocessors life-cycle cover two important aspects. Firstly, using the 48-core Intel’s SCC architecture, we propose a technique to accelerate online error detection of permanent faults for many-core architectures by exploiting their high-speed message passing on-chip network. Secondly, we propose a comprehensive statistical analysis methodology to accurately predict at the system level the safe voltage operation margins of the ARMv8 cores of the X- Gene 2 chip when it operates in scaled voltage conditions

Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip

Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips. To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability. Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield. With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle. To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired. In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements

System-level power optimization:techniques and tools

This tutorial surveys design methods for energy-efficient system-level design. We consider electronic sytems consisting of a hardware platform and software layers. We consider the three major constituents of hardware that consume energy, namely computation, communication, and storage units, and we review methods of reducing their energy consumption. We also study models for analyzing the energy cost of software, and methods for energy-efficient software design and compilation. This survery is organized around three main phases of a system design: conceptualization and modeling design and implementation, and runtime management. For each phase, we review recent techniques for energy-efficient design of both hardware and software