Low Power Processor Architectures and Contemporary Techniques for Power Optimization – A Review

The technological evolution has increased the number of transistors for a given die area significantly and increased the switching speed from few MHz to GHz range. Such inversely proportional decline in size and boost in performance consequently demands shrinking of supply voltage and effective power dissipation in chips with millions of transistors. This has triggered substantial amount of research in power reduction techniques into almost every aspect of the chip and particularly the processor cores contained in the chip. This paper presents an overview of techniques for achieving the power efficiency mainly at the processor core level but also visits related domains such as buses and memories. There are various processor parameters and features such as supply voltage, clock frequency, cache and pipelining which can be optimized to reduce the power consumption of the processor. This paper discusses various ways in which these parameters can be optimized. Also, emerging power efficient processor architectures are overviewed and research activities are discussed which should help reader identify how these factors in a processor contribute to power consumption. Some of these concepts have been already established whereas others are still active research areas. © 2009 ACADEMY PUBLISHER

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

A polymorphic hardware platform

In the domain of spatial computing, it appears that platforms based on either reconfigurable datapath units or on hybrid microprocessor/logic cell organizations are in the ascendancy as they appear to offer the most efficient means of providing resources across the greatest range of hardware designs. This paper encompasses an initial exploration of an alternative organization. It looks at the effect of using a very fine-grained approach based on a largely undifferentiated logic cell that can be configured to operate as a state element, logic or interconnect - or combinations of all three. A vertical layout style hides the overheads imposed by reconfigurability to an extent where very fine-grained organizations become a viable option. It is demonstrated that the technique can be used to develop building blocks for both synchronous and asynchronous circuits, supporting the development of hybrid architectures such as globally asynchronous, locally synchronous

Venice: Exploring Server Architectures for Effective Resource Sharing

Consolidated server racks are quickly becoming the backbone of IT infrastructure for science, engineering, and business, alike. These servers are still largely built and organized as when they were distributed, individual entities. Given that many fields increasingly rely on analytics of huge datasets, it makes sense to support flexible resource utilization across servers to improve cost-effectiveness and performance. We introduce Venice, a family of data-center server architectures that builds a strong communication substrate as a first-class resource for server chips. Venice provides a diverse set of resource-joining mechanisms that enables user programs to efficiently leverage non-local resources. To better understand the implications of design decisions about system support for resource sharing we have constructed a hardware prototype that allows us to more accurately measure end-to-end performance of at-scale applications and to explore tradeoffs among performance, power, and resource-sharing transparency. We present results from our initial studies analyzing these tradeoffs when sharing memory, accelerators, or NICs. We find that it is particularly important to reduce or hide latency, that data-sharing access patterns should match the features of the communication channels employed, and that inter-channel collaboration can be exploited for better performance

Empowering parallel computing with field programmable gate arrays

After more than 30 years, reconfigurable computing has grown from a concept to a mature field of science and technology. The cornerstone of this evolution is the field programmable gate array, a building block enabling the configuration of a custom hardware architecture. The departure from static von Neumannlike architectures opens the way to eliminate the instruction overhead and to optimize the execution speed and power consumption. FPGAs now live in a growing ecosystem of development tools, enabling software programmers to map algorithms directly onto hardware. Applications abound in many directions, including data centers, IoT, AI, image processing and space exploration. The increasing success of FPGAs is largely due to an improved toolchain with solid high-level synthesis support as well as a better integration with processor and memory systems. On the other hand, long compile times and complex design exploration remain areas for improvement. In this paper we address the evolution of FPGAs towards advanced multi-functional accelerators, discuss different programming models and their HLS language implementations, as well as high-performance tuning of FPGAs integrated into a heterogeneous platform. We pinpoint fallacies and pitfalls, and identify opportunities for language enhancements and architectural refinements

Implications and Limitations of Securing an InfiniBand Network

The InfiniBand Architecture is one of the leading network interconnects used in high performance computing, delivering very high bandwidth and low latency. As the popularity of InfiniBand increases, the possibility for new InfiniBand applications arise outside the domain of high performance computing, thereby creating the opportunity for new security risks. In this work, new security questions are considered and addressed. The study demonstrates that many common traffic analyzing tools cannot monitor or capture InfiniBand traffic transmitted between two hosts. Due to the kernel bypass nature of InfiniBand, many host-based network security systems cannot be executed on InfiniBand applications. Those that can impose a significant performance loss for the network. The research concludes that not all network security practices used for Ethernet translate to InfiniBand as previously suggested and that an answer to meeting specific security requirements for an InfiniBand network might reside in hardware offload

ASC: A stream compiler for computing with FPGAs

Published versio

SPICE²: A Spatial, Parallel Architecture for Accelerating the Spice Circuit Simulator

Spatial processing of sparse, irregular floating-point computation using a single FPGA enables up to an order of magnitude speedup (mean 2.8X speedup) over a conventional microprocessor for the SPICE circuit simulator. We deliver this speedup using a hybrid parallel architecture that spatially implements the heterogeneous forms of parallelism available in SPICE. We decompose SPICE into its three constituent phases: Model-Evaluation, Sparse Matrix-Solve, and Iteration Control and parallelize each phase independently. We exploit data-parallel device evaluations in the Model-Evaluation phase, sparse dataflow parallelism in the Sparse Matrix-Solve phase and compose the complete design in streaming fashion. We name our parallel architecture SPICE²: Spatial Processors Interconnected for Concurrent Execution for accelerating the SPICE circuit simulator. We program the parallel architecture with a high-level, domain-specific framework that identifies, exposes and exploits parallelism available in the SPICE circuit simulator. This design is optimized with an auto-tuner that can scale the design to use larger FPGA capacities without expert intervention and can even target other parallel architectures with the assistance of automated code-generation. This FPGA architecture is able to outperform conventional processors due to a combination of factors including high utilization of statically-scheduled resources, low-overhead dataflow scheduling of fine-grained tasks, and overlapped processing of the control algorithms. We demonstrate that we can independently accelerate Model-Evaluation by a mean factor of 6.5X(1.4--23X) across a range of non-linear device models and Matrix-Solve by 2.4X(0.6--13X) across various benchmark matrices while delivering a mean combined speedup of 2.8X(0.2--11X) for the two together when comparing a Xilinx Virtex-6 LX760 (40nm) with an Intel Core i7 965 (45nm). With our high-level framework, we can also accelerate Single-Precision Model-Evaluation on NVIDIA GPUs, ATI GPUs, IBM Cell, and Sun Niagara 2 architectures. We expect approaches based on exploiting spatial parallelism to become important as frequency scaling slows down and modern processing architectures turn to parallelism (\eg multi-core, GPUs) due to constraints of power consumption. This thesis shows how to express, exploit and optimize spatial parallelism for an important class of problems that are challenging to parallelize.</p

Performance Implications of NoCs on 3D-Stacked Memories: Insights from the Hybrid Memory Cube

Memories that exploit three-dimensional (3D)-stacking technology, which integrate memory and logic dies in a single stack, are becoming popular. These memories, such as Hybrid Memory Cube (HMC), utilize a network-on-chip (NoC) design for connecting their internal structural organizations. This novel usage of NoC, in addition to aiding processing-in-memory capabilities, enables numerous benefits such as high bandwidth and memory-level parallelism. However, the implications of NoCs on the characteristics of 3D-stacked memories in terms of memory access latency and bandwidth have not been fully explored. This paper addresses this knowledge gap by (i) characterizing an HMC prototype on the AC-510 accelerator board and revealing its access latency behaviors, and (ii) by investigating the implications of such behaviors on system and software designs