A micropower centroiding vision processor

Published versio

A 2x2 bit multiplier using hybrid 13t full adder with vedic mathematics method

Various arithmetic circuits such as multipliers require full adder (FA) as the main block for the circuit to operate. Speed and energy consumption become very vital in design consideration for a low power adder. In this paper, a 2x2 bit Vedic multiplier using hybrid full adder (HFA) with 13 transistors (13T) had been designed successfully. The design was simulated using Synopsys Custom Tools in General Purpose Design Kit (GPDK) 90 nm CMOS technology process. In this design, four AND gates and two hybrid FA (HFAs) are cascaded together and each HFA is constructed from three modules. The cascaded module is arranged in the Vedic mathematics algorithm. This algorithm satisfied the requirement of a fast multiplication operation because of the vertical and crosswise architecture from the Urdhva Triyakbyam Sutra which reduced the number of partial products compared to the conventional multiplication algorithm. With the combination of hybrid full adder and Vedic mathematics, a new combination of multiplier method with low power and low delay is produced. Performance parameters such as power consumption and delay were compared to some of the existing designs. With a 1V voltage supply, the average power consumption of the proposed multiplier was found to be 22.96 µW and a delay of 161 ps

Ultra-Low Power Circuit Design for Cubic-Millimeter Wireless Sensor Platform.

Modern daily life is surrounded by smaller and smaller computing devices. As Bell’s Law predicts, the research community is now looking at tiny computing platforms and mm3-scale sensor systems are drawing an increasing amount of attention since they can create a whole new computing environment. Designing mm3-scale sensor nodes raises various circuit and system level challenges and we have addressed and proposed novel solutions for many of these challenges to create the first complete 1.0mm3 sensor system including a commercial microprocessor. We demonstrate a 1.0mm3 form factor sensor whose modular die-stacked structure allows maximum volume utilization. Low power I2C communication enables inter-layer serial communication without losing compatibility to standard I2C communication protocol. A dual microprocessor enables concurrent computation for the sensor node control and measurement data processing. A multi-modal power management unit allowed energy harvesting from various harvesting sources. An optical communication scheme is provided for initial programming, synchronization and re-programming after recovery from battery discharge. Standby power reduction techniques are investigated and a super cut-off power gating scheme with an ultra-low power charge pump reduces the standby power of logic circuits by 2-19× and memory by 30%. Different approaches for designing low-power memory for mm3-scale sensor nodes are also presented in this work. A dual threshold voltage gain cell eDRAM design achieves the lowest eDRAM retention power and a 7T SRAM design based on hetero-junction tunneling transistors reduces the standby power of SRAM by 9-19× with only 15% area overhead. We have paid special attention to the timer for the mm3-scale sensor systems and propose a multi-stage gate-leakage-based timer to limit the standard deviation of the error in hourly measurement to 196ms and a temperature compensation scheme reduces temperature dependency to 31ppm/°C. These techniques for designing ultra-low power circuits for a mm3-scale sensor enable implementation of a 1.0mm3 sensor node, which can be used as a skeleton for future micro-sensor systems in variety of applications. These microsystems imply the continuation of the Bell’s Law, which also predicts the massive deployment of mm3-scale computing systems and emergence of even smaller and more powerful computing systems in the near future.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/91438/1/sori_1.pd

Test Chip Design for Process Variation Characterization in 3D Integrated Circuits

A test chip design is presented for the characterization of process variations and Through Silicon Via (TSV) induced mechanical stress in 3D integrated circuits. The chip was de- signed, layed-out, and taped-out for fabrication in a 130nm Tezzaron/GlobalFoundries process through CMC microsystems. The test chip takes advantage of the architecture of 3D ICs to split its test structure onto the two tiers of the 3D IC, achieving a device array density of 40.94 m2 per device. The design also has a high spatial resolution and measurement delity compared to similar 2D variation characterization test structures. Background leakage subtraction and radial ltering are two techniques that are ap- plied to the chip's measurements to reduce its error further for subthreshold device current measurements and stress-induced mobility measurements, respectively. Experimental mea- surements are be taken from the chip using a custom PCB measurement setup once the chip has returned from fabrication

Solid State Circuits Technologies

The evolution of solid-state circuit technology has a long history within a relatively short period of time. This technology has lead to the modern information society that connects us and tools, a large market, and many types of products and applications. The solid-state circuit technology continuously evolves via breakthroughs and improvements every year. This book is devoted to review and present novel approaches for some of the main issues involved in this exciting and vigorous technology. The book is composed of 22 chapters, written by authors coming from 30 different institutions located in 12 different countries throughout the Americas, Asia and Europe. Thus, reflecting the wide international contribution to the book. The broad range of subjects presented in the book offers a general overview of the main issues in modern solid-state circuit technology. Furthermore, the book offers an in depth analysis on specific subjects for specialists. We believe the book is of great scientific and educational value for many readers. I am profoundly indebted to the support provided by all of those involved in the work. First and foremost I would like to acknowledge and thank the authors who worked hard and generously agreed to share their results and knowledge. Second I would like to express my gratitude to the Intech team that invited me to edit the book and give me their full support and a fruitful experience while working together to combine this book

Adaptation in Standard CMOS Processes with Floating Gate Structures and Techniques

We apply adaptation into ordinary circuits and systems to achieve high performance, high quality results. Mismatch in manufactured VLSI devices has been the main limiting factor in quality for many analog and mixed-signal designs. Traditional compensation methods are generally costly. A few examples include enlarging the device size, averaging signals, and trimming with laser. By applying floating gate adaptation to standard CMOS circuits, we demonstrate here that we are able to trim CMOS comparator offset to a precision of 0.7mV, reduce CMOS image sensor fixed-pattern noise power by a factor of 100, and achieve 5.8 effective number of bits (ENOB) in a 6-bit flash analog-to-digital converter (ADC) operating at 750MHz. The adaptive circuits generally exhibit special features in addition to an improved performance. These special features are generally beyond the capabilities of traditional CMOS design approaches and they open exciting opportunities in novel circuit designs. Specifically, the adaptive comparator has the ability to store an accurate arbitrary offset, the image sensor can be set up to memorize previously captured scenes like a human retina, and the ADC can be configured to adapt to the incoming analog signal distribution and perform an efficient signal conversion that minimizes distortion and maximizes output entropy

Random dopants and low-frequency noise reduction in deep-submicron MOSFET technology

The future of mixed-signal, memory, and microprocessor technologies are dependent on ever increasing analog and digital integration, higher cell densities, and demand for more processing power. As a result MOSFET device dimensions continue to shrink to meet these demands. A side effect of device scaling is increased variability at each technological node which affects both analog and digital circuits in terms of decreased yields, performance, and noise margins. At deep sub-micron dimensions the Low-Frequency Noise (LFN) of the MOSFET is dominated by the influence of one or more active traps capturing and emitting charge to and from the oxide creating wide variations in the LFN from otherwise identical devices. Additionally, the random position of dopant atoms near the Si/SiO₂ interface create a potential landscape that induces regions of high and low conductivity which in turn causes a situation where the current is no longer uniform in the device, but consist of individual current paths or percolating currents. The coupling between the random variation of the percolation current and active traps in the oxide are responsible for the large spread ( > 3 orders of magnitude) in the noise characteristics observed in deep sub-micron MOSFET devices. The compact LFN model presented here accounts for the action of traps on percolating currents in deep-sub-micron and nano-scale MOSFETs. Two schemes for reduction of LFN are studied based on the smoothing of the surface potential. First, noise reduction is demonstrated with measurements on sub-micron MOSFETs with forward substrate bias. Secondly, the model is further verified through the reduction of noise by the removal of dopant atoms near the Si/SiO₂ interface of the device. Both schemes result in a lower noise and threshold device. Finally, these experimental findings are applied to a 2.2μm 2 MP CMOS image sensor. From the temporal noise measurements on threshold implant process splits, the image sensor noise has been significantly reduced as a direct result of fundamentals described by this MOSFET LFN model and further proves the validity of these findings.Keywords: Low-Frequency Noise, MOSFET, sub-micron, RT