Fully embedded optical and electrical interconnections in flexible foils

This paper presents the development of a technology platform for the full integration of opto-electronic and electronic components, as well as optical interconnections in a flexible foil. A technology is developed to embed ultra thin (20 μ m) VCSEL's and Photodiodes in layers of optical transparent material. These layers are sandwiched in between two Polyimide layers to get a flexible foil with a final stack thickness of 150 μ m. Optical waveguides are structured by photolithography in the optical layers and pluggable mirror components couple the light from the embedded opto-electronics in and out of the waveguides. Besides optical links and optoelectronic components, electrical circuitry is also embedded by means of embedded copper tracks and thinned down Integrated Circuits (20 μ m). Optical connection towards the outer world is realized by U-groove passive alignment coupling of optical fibers with the embedded waveguides

Correlation between the reliability of HEMT devices and that of a combined oscillator-amplifier

We evaluate an oscillator-amplifier MMIC submitted to high-temperature operating life time tests. To relate adequately these results with individual components’ results, it is important to realise that failure mechanisms in non-linear MMICs are governed by the maximally instantaneous voltages/currents and hence that comparisons should be conducted at equal instantaneous conditions

Design of an integrated airframe/propulsion control system architecture

The design of an integrated airframe/propulsion control system architecture is described. The design is based on a prevalidation methodology that uses both reliability and performance. A detailed account is given for the testing associated with a subset of the architecture and concludes with general observations of applying the methodology to the architecture

Thick-Film and LTCC Passive Components for High-Temperature Electronics

At this very moment an increasing interest in the field of high-temperature electronics is observed. This is a result of development in the area of wide-band semiconductors’ engineering but this also generates needs for passives with appropriate characteristics. This paper presents fabrication as well as electrical and stability properties of passive components (resistors, capacitors, inductors) made in thick-film or Low-Temperature Co-fired Ceramics (LTCC) technologies fulfilling demands of high-temperature electronics. Passives with standard dimensions usually are prepared by screen-printing whereas combination of standard screen-printing with photolithography or laser shaping are recommenced for fabrication of micropassives. Attainment of proper characteristics versus temperature as well as satisfactory long-term high-temperature stability of micropassives is more difficult than for structures with typical dimensions for thick-film and LTCC technologies because of increase of interfacial processes’ importance. However it is shown that proper selection of thick-film inks together with proper deposition method permit to prepare thick-film micropassives (microresistors, air-cored microinductors and interdigital microcapacitors) suitable for the temperature range between 150°C and 400°C

Packaging technology enabling flexible optical interconnections

This paper reports on the latest trends and results on the integration of optical and opto-electronic devices and interconnections inside flexible carrier materials. Electrical circuits on flexible substrates are a very fast growing segment in electronics, but opto-electronics and optics should be able to follow these upcoming trends. This paper presents the back-thinning and packaging of single opto-electronic devices resulting in highly flexible and reliable packages. Optical waveguides and optical out-of-plane coupling structures are integrated inside the same layer stack, resulting in complete VCSEL-to-PD links with low total optical losses and high resistance to heat cycling and moisture exposure

Preliminary candidate advanced avionics system for general aviation

An integrated avionics system design was carried out to the level which indicates subsystem function, and the methods of overall system integration. Sufficient detail was included to allow identification of possible system component technologies, and to perform reliability, modularity, maintainability, cost, and risk analysis upon the system design. Retrofit to older aircraft, availability of this system to the single engine two place aircraft, was considered

Theory of reliable systems

An attempt was made to refine the current notion of system reliability by identifying and investigating attributes of a system which are important to reliability considerations. Techniques which facilitate analysis of system reliability are included. Special attention was given to fault tolerance, diagnosability, and reconfigurability characteristics of systems

Electrical Loads and Power Systems for the DEMO Nuclear Fusion Project

EU-DEMO is a European project, having the ambitious goal to be the first demonstrative power plant based on nuclear fusion. The electrical power that is expected to be produced is in the order of 700–800 MW, to be delivered via a connection to the European High Voltage electrical grid. The initiation and control of fusion processes, besides the problems related to the nuclear physics, need very complex electrical systems. Moreover, also the conversion of the output power is not trivial, especially because of the inherent discontinuity in the EU-DEMO operations. The present article concerns preliminary studies for the feasibility and realization of the nuclear fusion power plant EU-DEMO, with a special focus on the power electrical systems. In particular, the first stage of the study deals with the survey and analysis of the electrical loads, starting from the steady-state loads. Their impact is so relevant that could jeopardy the efficiency and the convenience of the plant itself. Afterwards, the loads are inserted into a preliminary internal distribution grid, sizing the main electrical components to carry out the power flow analysis, which is based on simulation models implemented in the DIgSILENT PowerFactory software