3D Stacked Cache Data Management for Energy Minimization of 3D Chip Multiprocessor

In this model a runtime cache data mapping is discussed for 3-D stacked L2 caches to minimize the overall energy of 3-D chip multiprocessors (CMPs). The suggested method considers both temperature distribution and memory traffic of 3-D CMPs. Experimental result shows energy reduction achieving up to 22.88% compared to an existing solution which considers only the temperature distribution.  New tendencies envisage 3D Multi-Processor System-On-Chip (MPSoC) design as a promising solution to keep increasing the performance of the next-generation high performance computing (HPC) systems. However, as the power density of HPC systems increases with the arrival of 3D MPSoCs with energy reduction achieving up to 19.55% by supplying electrical power to the computing equipment and constantly removing the generated heat is rapidly becoming the dominant cost in any HPC facility

Temperature-Aware Runtime Power Management for Chip-Multiprocessors with 3-D Stacked Cache

The advent of 3-D fabrication technology makes it possible to stack a large amount of last-level cache memory onto a multi-core die to reduce off-chip memory accesses and, thus, increases system performance. However, the higher power density (i.e., power dissipation per unit volume) of 3-D integrated circuits (ICs) might incur temperature-related problems in reliability, leakage power, system performance, and cooling cost. In this paper, we propose a runtime solution to maximize the performance (i.e., instruction throughput) of chip-multiprocessors with 3-D stacked last-level cache memory, without thermal-constraint violation. The proposed method combines runtime cache tuning (e.g., cache-way partitioning, cache-way power-gating, cache data placement) with per-core dynamic voltage/frequency scaling (DVFS) in a temperature-aware manner. Experimental results show that the integrated method offers 23% performance improvement on average in terms of instructions per second (IPS) compared with temperature-aware runtime cache tuning only

Modeling and optimization of high-performance many-core systems for energy-efficient and reliable computing

Thesis (Ph.D.)--Boston UniversityMany-core systems, ranging from small-scale many-core processors to large-scale high performance computing (HPC) data centers, have become the main trend in computing system design owing to their potential to deliver higher throughput per watt. However, power densities and temperatures increase following the growth in the performance capacity, and bring major challenges in energy efficiency, cooling costs, and reliability. These challenges require a joint assessment of performance, power, and temperature tradeoffs as well as the design of runtime optimization techniques that monitor and manage the interplay among them. This thesis proposes novel modeling and runtime management techniques that evaluate and optimize the performance, energy, and reliability of many-core systems. We first address the energy and thermal challenges in 3D-stacked many-core processors. 3D processors with stacked DRAM have the potential to dramatically improve performance owing to lower memory access latency and higher bandwidth. However, the performance increase may cause 3D systems to exceed the power budgets or create thermal hot spots. In order to provide an accurate analysis and enable the design of efficient management policies, this thesis introduces a simulation framework to jointly analyze performance, power, and temperature for 3D systems. We then propose a runtime optimization policy that maximizes the system performance by characterizing the application behavior and predicting the operating points that satisfy the power and thermal constraints. Our policy reduces the energy-delay product (EDP) by up to 61.9% compared to existing strategies. Performance, cooling energy, and reliability are also critical aspects in HPC data centers. In addition to causing reliability degradation, high temperatures increase the required cooling energy. Communication cost, on the other hand, has a significant impact on system performance in HPC data centers. This thesis proposes a topology-aware technique that maximizes system reliability by selecting between workload clustering and balancing. Our policy improves the system reliability by up to 123.3% compared to existing temperature balancing approaches. We also introduce a job allocation methodology to simultaneously optimize the communication cost and the cooling energy in a data center. Our policy reduces the cooling cost by 40% compared to cooling-aware and performance-aware policies, while achieving comparable performance to performance-aware policy

Optimization-based power and thermal management for dark silicon aware 3D chip multiprocessors using heterogeneous cache hierarchy

Management of a problem recently known as “dark silicon” is a new challenge in multicore designs. Prior innovative studies have addressed the dark silicon problem in the fields of power-efficient core design. However, addressing dark silicon challenges in uncore component designs such as cache hierarchy, on-chip interconnect etc. that consume significant portion of the on-chip power consumption is largely unexplored. In this paper, for the first time, we propose an integrated approach which considers the impact of power consumption of core and uncore components simultaneously to improve multi/many-core performance in the dark silicon era. The proposed approach dynamically (1) predicts the changing program behavior on each core; (2) re-determines frequency/voltage, cache capacity and technology in each level of the cache hierarchy based on the program's scalability in order to satisfy the power and temperature constraints. In the proposed architecture, for future chip-multiprocessors (CMPs), we exploit emerging technologies such as non-volatile memories (NVMs) and 3D techniques to combat dark silicon. Also, for the first time, we propose a detailed power model which is useful for future dark silicon CMPs power modeling. Experimental results on SPEC 2000/2006 benchmarks show that the proposed method improves throughput by about 54.3% and energy-delay product by about 61% on average, respectively, in comparison with the conventional CMP architecture with homogenous cache system. (A preliminary short version of this work was presented in the 18th Euromicro Conference on Digital System Design (DSD), 2015.) © 2017 Elsevier B.V

A survey of emerging architectural techniques for improving cache energy consumption

The search goes on for another ground breaking phenomenon to reduce the ever-increasing disparity between the CPU performance and storage. There are encouraging breakthroughs in enhancing CPU performance through fabrication technologies and changes in chip designs but not as much luck has been struck with regards to the computer storage resulting in material negative system performance. A lot of research effort has been put on finding techniques that can improve the energy efficiency of cache architectures. This work is a survey of energy saving techniques which are grouped on whether they save the dynamic energy, leakage energy or both. Needless to mention, the aim of this work is to compile a quick reference guide of energy saving techniques from 2013 to 2016 for engineers, researchers and students

Hybrid stacked memory architecture for energy efficient embedded chip-multiprocessors based on compiler directed approach

Energy consumption becomes the most critical limitation on the performance of nowadays embedded system designs. On-chip memories due to major contribution in overall system energy consumption are always significant issue for embedded systems. Using conventional memory technologies in future designs in nano-scale era causes a drastic increase in leakage power consumption and temperature-related problems. Emerging non-volatile memory (NVM) technologies are promising replacement for conventional memory structure in embedded systems due to its attractive characteristics such as near-zero leakage power, high density and non-volatility. Recent advantages of NVM technologies can significantly mitigate the issue of memory leakage power. However, they introduce new challenges such as limited write endurance and high write energy consumption which restrict them for adoption in modern memory systems. In this article, we propose a stacked hybrid memory system to minimize energy consumption for 3D embedded chip-multiprocessors (eCMP). For reaching this target, we present a convex optimization-based model to distribute data blocks between SRAM and NVM banks based on data access pattern derived by compiler. Our compiler-assisted hybrid memory architecture can achieve up to 51.28 times improvement in lifetime. In addition, experimental results show that our proposed method reduce energy consumption by 56% on average compared to the traditional memory design where single technology is used. © 2015 IEEE

A heterogeneous memory organization with minimum energy consumption in 3D chip-multiprocessors

Main memories play an important role in overall energy consumption of embedded systems. Using conventional memory technologies in future designs in nanoscale era cause a drastic increase in leakage power consumption and temperature-related problems. Emerging non-volatile memory (NVM) technologies offer many desirable characteristics such as near-zero leakage power, high density and non-volatility. They can significantly mitigate the issue of memory leakage power in future embedded chip-multiprocessor (eCMP) systems. However, they suffer from challenges such as limited write endurance and high write energy consumption which restrict them for adoption in modern memory systems. In this article, we propose a stacked hybrid memory system for 3D chip-multiprocessors to take advantages of both traditional and non-volatile memory technologies. For reaching this target, we present a convex optimization-based model that minimizes the system energy consumption while satisfy endurance constraint in order to design a reliable memory system. Experimental results show that the proposed method improves energy-delay product (EDP) and performance by about 44.8% and 13.8% on average respectively compared with the traditional memory design where single technology is used. © 2016 IEEE

Improving virtual memory performance in virtualized environments

Virtual Memory is a major system performance bottleneck in virtualized environments. In addition to expensive address translations, frequent virtual machine context switches are common in virtualized environments, resulting in increased TLB miss rates, subsequent expensive page walks and data cache contention due to incoming page table entries evicting useful data. Orthogonally, translation coherence, which is currently an expensive operation implemented in software, can consume up to 50% of the runtime of an application executing on the guest. To improve the performance of virtual memory in virtualized environments, two solutions have been proposed in this thesis - namely, (1) Context Switch Aware Large TLB (CSALT), an architecture which addresses the problem of increased TLB miss rates and their adverse impact on data caches. CSALT copes with the increased demand of context switches by storing a large number TLB entries. It mitigates data cache contention by employing a novel TLB-aware cache partitioning scheme. On 8-core systems that switch between two virtual machine contexts executing multi-threaded workloads, CSALT achieves an average performance improvement of 85% over a baseline with conventional L1-L2 TLBs and 25% over a baseline which has a large L3 TLB (2) Translation Coherence using Addressable TLBs (TCAT), a hardware translation coherence scheme which eliminates almost all of the overheads associated with address translation coherence. TCAT overlays translation coherence atop cache coherence to accurately identify slave cores. It then leverages the addressable Part-Of-Memory TLB (POM-TLB) to eliminate expensive Inter Processor Interrupts (IPI) and achieve precise invalidations on the slave core. On 8-core systems with one virtual machine context executing multi-threaded workloads, TCAT achieves an average performance improvement of 13% over the kvmtlb baselineElectrical and Computer Engineerin

Novel Cache Hierarchies with Photonic Interconnects for Chip Multiprocessors

[ES] Los procesadores multinúcleo actuales cuentan con recursos compartidos entre los diferentes núcleos. Dos de estos recursos compartidos, la cache de último nivel y el ancho de banda de memoria principal, pueden convertirse en cuellos de botella para el rendimiento. Además, con el crecimiento del número de núcleos que implementan los diseños más recientes, la red dentro del chip también se convierte en un cuello de botella que puede afectar negativamente al rendimiento, ya que las redes tradicionales pueden encontrar limitaciones a su escalabilidad en el futuro cercano. Prácticamente la totalidad de los diseños actuales implementan jerarquías de memoria que se comunican mediante rápidas redes de interconexión. Esta organización es eficaz dado que permite reducir el número de accesos que se realizan a memoria principal y la latencia media de acceso a memoria. Las caches, la red de interconexión y la memoria principal, conjuntamente con otras técnicas conocidas como la prebúsqueda, permiten reducir las enormes latencias de acceso a memoria principal, limitando así el impacto negativo ocasionado por la diferencia de rendimiento existente entre los núcleos de cómputo y la memoria. Sin embargo, compartir los recursos mencionados es fuente de diferentes problemas y retos, siendo uno de los principales el manejo de la interferencia entre aplicaciones. Hacer un uso eficiente de la jerarquía de memoria y las caches, así como contar con una red de interconexión apropiada, es necesario para sostener el crecimiento del rendimiento en los diseños tanto actuales como futuros. Esta tesis analiza y estudia los principales problemas e inconvenientes observados en estos dos recursos: la cache de último nivel y la red dentro del chip. En primer lugar, se estudia la escalabilidad de las tradicionales redes dentro del chip con topología de malla, así como esta puede verse comprometida en próximos diseños que cuenten con mayor número de núcleos. Los resultados de este estudio muestran que, a mayor número de núcleos, el impacto negativo de la distancia entre núcleos en la latencia puede afectar seriamente al rendimiento del procesador. Como solución a este problema, en esta tesis proponemos una de red de interconexión óptica modelada en un entorno de simulación detallado, que supone una solución viable a los problemas de escalabilidad observados en los diseños tradicionales. A continuación, esta tesis dedica un esfuerzo importante a identificar y proponer soluciones a los principales problemas de diseño de las jerarquías de memoria actuales como son, por ejemplo, el sobredimensionado del espacio de cache privado, la existencia de réplicas de datos y rigidez e incapacidad de adaptación de las estructuras de cache. Aunque bien conocidos, estos problemas y sus efectos adversos en el rendimiento pueden ser evitados en procesadores de alto rendimiento gracias a la enorme capacidad de la cache de último nivel que este tipo de procesadores típicamente implementan. Sin embargo, en procesadores de bajo consumo, no existe la posibilidad de contar con tales capacidades y hacer un uso eficiente del espacio disponible es crítico para mantener el rendimiento. Como solución a estos problemas en procesadores de bajo consumo, proponemos una novedosa organización de jerarquía de dos niveles cache que utiliza una red de interconexión óptica. Los resultados obtenidos muestran que, comparado con diseños convencionales, el consumo de energía estática en la arquitectura propuesta es un 60% menor, pese a que los resultados de rendimiento presentan valores similares. Por último, hemos extendido la arquitectura propuesta para dar soporte tanto a aplicaciones paralelas como secuenciales. Los resultados obtenidos con la esta nueva arquitectura muestran un ahorro de hasta el 78 % de energía estática en la ejecución de aplicaciones paralelas.[CA] Els processadors multinucli actuals compten amb recursos compartits entre els diferents nuclis. Dos d'aquests recursos compartits, la memòria d’últim nivell i l'ample de banda de memòria principal, poden convertir-se en colls d'ampolla per al rendiment. A mes, amb el creixement del nombre de nuclis que implementen els dissenys mes recents, la xarxa dins del xip també es converteix en un coll d'ampolla que pot afectar negativament el rendiment, ja que les xarxes tradicionals poden trobar limitacions a la seva escalabilitat en el futur proper. Pràcticament la totalitat dels dissenys actuals implementen jerarquies de memòria que es comuniquen mitjançant rapides xarxes d’interconnexió. Aquesta organització es eficaç ates que permet reduir el nombre d'accessos que es realitzen a memòria principal i la latència mitjana d’accés a memòria. Les caches, la xarxa d’interconnexió i la memòria principal, conjuntament amb altres tècniques conegudes com la prebúsqueda, permeten reduir les enormes latències d’accés a memòria principal, limitant així l'impacte negatiu ocasionat per la diferencia de rendiment existent entre els nuclis de còmput i la memòria. No obstant això, compartir els recursos esmentats és font de diversos problemes i reptes, sent un dels principals la gestió de la interferència entre aplicacions. Fer un us eficient de la jerarquia de memòria i les caches, així com comptar amb una xarxa d’interconnexió apropiada, es necessari per sostenir el creixement del rendiment en els dissenys tant actuals com futurs. Aquesta tesi analitza i estudia els principals problemes i inconvenients observats en aquests dos recursos: la memòria cache d’últim nivell i la xarxa dins del xip. En primer lloc, s'estudia l'escalabilitat de les xarxes tradicionals dins del xip amb topologia de malla, així com aquesta es pot veure compromesa en propers dissenys que compten amb major nombre de nuclis. Els resultats d'aquest estudi mostren que, a major nombre de nuclis, l'impacte negatiu de la distància entre nuclis en la latència pot afectar seriosament al rendiment del processador. Com a solució' a aquest problema, en aquesta tesi proposem una xarxa d’interconnexió' òptica modelada en un entorn de simulació detallat, que suposa una solució viable als problemes d'escalabilitat observats en els dissenys tradicionals. A continuació, aquesta tesi dedica un esforç important a identificar i proposar solucions als principals problemes de disseny de les jerarquies de memòria actuals com son, per exemple, el sobredimensionat de l'espai de memòria cache privat, l’existència de repliques de dades i la rigidesa i incapacitat d’adaptació' de les estructures de memòria cache. Encara que ben coneguts, aquests problemes i els seus efectes adversos en el rendiment poden ser evitats en processadors d'alt rendiment gracies a l'enorme capacitat de la memòria cache d’últim nivell que aquest tipus de processadors típicament implementen. No obstant això, en processadors de baix consum, no hi ha la possibilitat de comptar amb aquestes capacitats, i fer un us eficient de l'espai disponible es torna crític per mantenir el rendiment. Com a solució a aquests problemes en processadors de baix consum, proposem una nova organització de jerarquia de dos nivells de memòria cache que utilitza una xarxa d’interconnexió òptica. Els resultats obtinguts mostren que, comparat amb dissenys convencionals, el consum d'energia estàtica en l'arquitectura proposada és un 60% menor, malgrat que els resultats de rendiment presenten valors similars. Per últim, hem estes l'arquitectura proposada per donar suport tant a aplicacions paral·leles com seqüencials. Els resultats obtinguts amb aquesta nova arquitectura mostren un estalvi de fins al 78 % d'energia estàtica en l’execució d'aplicacions paral·leles.[EN] Current multicores face the challenge of sharing resources among the different processor cores. Two main shared resources act as major performance bottlenecks in current designs: the off-chip main memory bandwidth and the last level cache. Additionally, as the core count grows, the network on-chip is also becoming a potential performance bottleneck, since traditional designs may find scalability issues in the near future. Memory hierarchies communicated through fast interconnects are implemented in almost every current design as they reduce the number of off-chip accesses and the overall latency, respectively. Main memory, caches, and interconnection resources, together with other widely-used techniques like prefetching, help alleviate the huge memory access latencies and limit the impact of the core-memory speed gap. However, sharing these resources brings several concerns, being one of the most challenging the management of the inter-application interference. Since almost every running application needs to access to main memory, all of them are exposed to interference from other co-runners in their way to the memory controller. For this reason, making an efficient use of the available cache space, together with achieving fast and scalable interconnects, is critical to sustain the performance in current and future designs. This dissertation analyzes and addresses the most important shortcomings of two major shared resources: the Last Level Cache (LLC) and the Network on Chip (NoC). First, we study the scalability of both electrical and optical NoCs for future multicoresand many-cores. To perform this study, we model optical interconnects in a cycle-accurate multicore simulation framework. A proper model is required; otherwise, important performance deviations may be observed otherwise in the evaluation results. The study reveals that, as the core count grows, the effect of distance on the end-to-end latency can negatively impact on the processor performance. In contrast, the study also shows that silicon nanophotonics are a viable solution to solve the mentioned latency problems. This dissertation is also motivated by important design concerns related to current memory hierarchies, like the oversizing of private cache space, data replication overheads, and lack of flexibility regarding sharing of cache structures. These issues, which can be overcome in high performance processors by virtue of huge LLCs, can compromise performance in low power processors. To address these issues we propose a more efficient cache hierarchy organization that leverages optical interconnects. The proposed architecture is conceived as an optically interconnected two-level cache hierarchy composed of multiple cache modules that can be dynamically turned on and off independently. Experimental results show that, compared to conventional designs, static energy consumption is improved by up to 60% while achieving similar performance results. Finally, we extend the proposal to support both sequential and parallel applications. This extension is required since the proposal adapts to the dynamic cache space needs of the running applications, and multithreaded applications's behaviors widely differ from those of single threaded programs. In addition, coherence management is also addressed, which is challenging since each cache module can be assigned to any core at a given time in the proposed approach. For parallel applications, the evaluation shows that the proposal achieves up to 78% static energy savings. In summary, this thesis tackles major challenges originated by the sharing of on-chip caches and communication resources in current multicores, and proposes new cache hierarchy organizations leveraging optical interconnects to address them. The proposed organizations reduce both static and dynamic energy consumption compared to conventional approaches while achieving similar performance; which results in better energy efficiency.Puche Lara, J. (2021). Novel Cache Hierarchies with Photonic Interconnects for Chip Multiprocessors [Tesis doctoral]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/165254TESI