Memory built-in self-repair and correction for improving yield: a review

Nanometer memories are highly prone to defects due to dense structure, necessitating memory built-in self-repair as a must-have feature to improve yield. Today’s system-on-chips contain memories occupying an area as high as 90% of the chip area. Shrinking technology uses stricter design rules for memories, making them more prone to manufacturing defects. Further, using 3D-stacked memories makes the system vulnerable to newer defects such as those coming from through-silicon-vias (TSV) and micro bumps. The increased memory size is also resulting in an increase in soft errors during system operation. Multiple memory repair techniques based on redundancy and correction codes have been presented to recover from such defects and prevent system failures. This paper reviews recently published memory repair methodologies, including various built-in self-repair (BISR) architectures, repair analysis algorithms, in-system repair, and soft repair handling using error correcting codes (ECC). It provides a classification of these techniques based on method and usage. Finally, it reviews evaluation methods used to determine the effectiveness of the repair algorithms. The paper aims to present a survey of these methodologies and prepare a platform for developing repair methods for upcoming-generation memories

Sustainable Fault-handling Of Reconfigurable Logic Using Throughput-driven Assessment

A sustainable Evolvable Hardware (EH) system is developed for SRAM-based reconfigurable Field Programmable Gate Arrays (FPGAs) using outlier detection and group testing-based assessment principles. The fault diagnosis methods presented herein leverage throughput-driven, relative fitness assessment to maintain resource viability autonomously. Group testing-based techniques are developed for adaptive input-driven fault isolation in FPGAs, without the need for exhaustive testing or coding-based evaluation. The techniques maintain the device operational, and when possible generate validated outputs throughout the repair process. Adaptive fault isolation methods based on discrepancy-enabled pair-wise comparisons are developed. By observing the discrepancy characteristics of multiple Concurrent Error Detection (CED) configurations, a method for robust detection of faults is developed based on pairwise parallel evaluation using Discrepancy Mirror logic. The results from the analytical FPGA model are demonstrated via a self-healing, self-organizing evolvable hardware system. Reconfigurability of the SRAM-based FPGA is leveraged to identify logic resource faults which are successively excluded by group testing using alternate device configurations. This simplifies the system architect\u27s role to definition of functionality using a high-level Hardware Description Language (HDL) and system-level performance versus availability operating point. System availability, throughput, and mean time to isolate faults are monitored and maintained using an Observer-Controller model. Results are demonstrated using a Data Encryption Standard (DES) core that occupies approximately 305 FPGA slices on a Xilinx Virtex-II Pro FPGA. With a single simulated stuck-at-fault, the system identifies a completely validated replacement configuration within three to five positive tests. The approach demonstrates a readily-implemented yet robust organic hardware application framework featuring a high degree of autonomous self-control

Design and Implementation of Repair-aware Test Flow for Multi-Memory

ABSTRAC

Autonomous Recovery Of Reconfigurable Logic Devices Using Priority Escalation Of Slack

Field Programmable Gate Array (FPGA) devices offer a suitable platform for survivable hardware architectures in mission-critical systems. In this dissertation, active dynamic redundancy-based fault-handling techniques are proposed which exploit the dynamic partial reconfiguration capability of SRAM-based FPGAs. Self-adaptation is realized by employing reconfiguration in detection, diagnosis, and recovery phases. To extend these concepts to semiconductor aging and process variation in the deep submicron era, resilient adaptable processing systems are sought to maintain quality and throughput requirements despite the vulnerabilities of the underlying computational devices. A new approach to autonomous fault-handling which addresses these goals is developed using only a uniplex hardware arrangement. It operates by observing a health metric to achieve Fault Demotion using Recon- figurable Slack (FaDReS). Here an autonomous fault isolation scheme is employed which neither requires test vectors nor suspends the computational throughput, but instead observes the value of a health metric based on runtime input. The deterministic flow of the fault isolation scheme guarantees success in a bounded number of reconfigurations of the FPGA fabric. FaDReS is then extended to the Priority Using Resource Escalation (PURE) online redundancy scheme which considers fault-isolation latency and throughput trade-offs under a dynamic spare arrangement. While deep-submicron designs introduce new challenges, use of adaptive techniques are seen to provide several promising avenues for improving resilience. The scheme developed is demonstrated by hardware design of various signal processing circuits and their implementation on a Xilinx Virtex-4 FPGA device. These include a Discrete Cosine Transform (DCT) core, Motion Estimation (ME) engine, Finite Impulse Response (FIR) Filter, Support Vector Machine (SVM), and Advanced Encryption Standard (AES) blocks in addition to MCNC benchmark circuits. A iii significant reduction in power consumption is achieved ranging from 83% for low motion-activity scenes to 12.5% for high motion activity video scenes in a novel ME engine configuration. For a typical benchmark video sequence, PURE is shown to maintain a PSNR baseline near 32dB. The diagnosability, reconfiguration latency, and resource overhead of each approach is analyzed. Compared to previous alternatives, PURE maintains a PSNR within a difference of 4.02dB to 6.67dB from the fault-free baseline by escalating healthy resources to higher-priority signal processing functions. The results indicate the benefits of priority-aware resiliency over conventional redundancy approaches in terms of fault-recovery, power consumption, and resource-area requirements. Together, these provide a broad range of strategies to achieve autonomous recovery of reconfigurable logic devices under a variety of constraints, operating conditions, and optimization criteria

A Multi-layer Fpga Framework Supporting Autonomous Runtime Partial Reconfiguration

Partial reconfiguration is a unique capability provided by several Field Programmable Gate Array (FPGA) vendors recently, which involves altering part of the programmed design within an SRAM-based FPGA at run-time. In this dissertation, a Multilayer Runtime Reconfiguration Architecture (MRRA) is developed, evaluated, and refined for Autonomous Runtime Partial Reconfiguration of FPGA devices. Under the proposed MRRA paradigm, FPGA configurations can be manipulated at runtime using on-chip resources. Operations are partitioned into Logic, Translation, and Reconfiguration layers along with a standardized set of Application Programming Interfaces (APIs). At each level, resource details are encapsulated and managed for efficiency and portability during operation. An MRRA mapping theory is developed to link the general logic function and area allocation information to the device related physical configuration level data by using mathematical data structure and physical constraints. In certain scenarios, configuration bit stream data can be read and modified directly for fast operations, relying on the use of similar logic functions and common interconnection resources for communication. A corresponding logic control flow is also developed to make the entire process autonomous. Several prototype MRRA systems are developed on a Xilinx Virtex II Pro platform. The Virtex II Pro on-chip PowerPC core and block RAM are employed to manage control operations while multiple physical interfaces establish and supplement autonomous reconfiguration capabilities. Area, speed and power optimization techniques are developed based on the developed Xilinx prototype. Evaluations and analysis of these prototype and techniques are performed on a number of benchmark and hashing algorithm case studies. The results indicate that based on a variety of test benches, up to 70% reduction in the resource utilization, up to 50% improvement in power consumption, and up to 10 times increase in run-time performance are achieved using the developed architecture and approaches compared with Xilinx baseline reconfiguration flow. Finally, a Genetic Algorithm (GA) for a FPGA fault tolerance case study is evaluated as a ultimate high-level application running on this architecture. It demonstrated that this is a hardware and software infrastructure that enables an FPGA to dynamically reconfigure itself efficiently under the control of a soft microprocessor core that is instantiated within the FPGA fabric. Such a system contributes to the observed benefits of intelligent control, fast reconfiguration, and low overhead

An Adaptive Modular Redundancy Technique to Self-regulate Availability, Area, and Energy Consumption in Mission-critical Applications

As reconfigurable devices\u27 capacities and the complexity of applications that use them increase, the need for self-reliance of deployed systems becomes increasingly prominent. A Sustainable Modular Adaptive Redundancy Technique (SMART) composed of a dual-layered organic system is proposed, analyzed, implemented, and experimentally evaluated. SMART relies upon a variety of self-regulating properties to control availability, energy consumption, and area used, in dynamically-changing environments that require high degree of adaptation. The hardware layer is implemented on a Xilinx Virtex-4 Field Programmable Gate Array (FPGA) to provide self-repair using a novel approach called a Reconfigurable Adaptive Redundancy System (RARS). The software layer supervises the organic activities within the FPGA and extends the self-healing capabilities through application-independent, intrinsic, evolutionary repair techniques to leverage the benefits of dynamic Partial Reconfiguration (PR). A SMART prototype is evaluated using a Sobel edge detection application. This prototype is shown to provide sustainability for stressful occurrences of transient and permanent fault injection procedures while still reducing energy consumption and area requirements. An Organic Genetic Algorithm (OGA) technique is shown capable of consistently repairing hard faults while maintaining correct edge detector outputs, by exploiting spatial redundancy in the reconfigurable hardware. A Monte Carlo driven Continuous Markov Time Chains (CTMC) simulation is conducted to compare SMART\u27s availability to industry-standard Triple Modular Technique (TMR) techniques. Based on nine use cases, parameterized with realistic fault and repair rates acquired from publically available sources, the results indicate that availability is significantly enhanced by the adoption of fast repair techniques targeting aging-related hard-faults. Under harsh environments, SMART is shown to improve system availability from 36.02% with lengthy repair techniques to 98.84% with fast ones. This value increases to five nines (99.9998%) under relatively more favorable conditions. Lastly, SMART is compared to twenty eight standard TMR benchmarks that are generated by the widely-accepted BL-TMR tools. Results show that in seven out of nine use cases, SMART is the recommended technique, with power savings ranging from 22% to 29%, and area savings ranging from 17% to 24%, while still maintaining the same level of availability

Cross layer reliability estimation for digital systems

Forthcoming manufacturing technologies hold the promise to increase multifuctional computing systems performance and functionality thanks to a remarkable growth of the device integration density. Despite the benefits introduced by this technology improvements, reliability is becoming a key challenge for the semiconductor industry. With transistor size reaching the atomic dimensions, vulnerability to unavoidable fluctuations in the manufacturing process and environmental stress rise dramatically. Failing to meet a reliability requirement may add excessive re-design cost to recover and may have severe consequences on the success of a product. %Worst-case design with large margins to guarantee reliable operation has been employed for long time. However, it is reaching a limit that makes it economically unsustainable due to its performance, area, and power cost. One of the open challenges for future technologies is building ``dependable'' systems on top of unreliable components, which will degrade and even fail during normal lifetime of the chip. Conventional design techniques are highly inefficient. They expend significant amount of energy to tolerate the device unpredictability by adding safety margins to a circuit's operating voltage, clock frequency or charge stored per bit. Unfortunately, the additional cost introduced to compensate unreliability are rapidly becoming unacceptable in today's environment where power consumption is often the limiting factor for integrated circuit performance, and energy efficiency is a top concern. Attention should be payed to tailor techniques to improve the reliability of a system on the basis of its requirements, ending up with cost-effective solutions favoring the success of the product on the market. Cross-layer reliability is one of the most promising approaches to achieve this goal. Cross-layer reliability techniques take into account the interactions between the layers composing a complex system (i.e., technology, hardware and software layers) to implement efficient cross-layer fault mitigation mechanisms. Fault tolerance mechanism are carefully implemented at different layers starting from the technology up to the software layer to carefully optimize the system by exploiting the inner capability of each layer to mask lower level faults. For this purpose, cross-layer reliability design techniques need to be complemented with cross-layer reliability evaluation tools, able to precisely assess the reliability level of a selected design early in the design cycle. Accurate and early reliability estimates would enable the exploration of the system design space and the optimization of multiple constraints such as performance, power consumption, cost and reliability. This Ph.D. thesis is devoted to the development of new methodologies and tools to evaluate and optimize the reliability of complex digital systems during the early design stages. More specifically, techniques addressing hardware accelerators (i.e., FPGAs and GPUs), microprocessors and full systems are discussed. All developed methodologies are presented in conjunction with their application to real-world use cases belonging to different computational domains

Testability and redundancy techniques for improved yield and reliability of CMOS VLSI circuits

The research presented in this thesis is concerned with the design of fault-tolerant integrated circuits as a contribution to the design of fault-tolerant systems. The economical manufacture of very large area ICs will necessitate the incorporation of fault-tolerance features which are routinely employed in current high density dynamic random access memories. Furthermore, the growing use of ICs in safety-critical applications and/or hostile environments in addition to the prospect of single-chip systems will mandate the use of fault-tolerance for improved reliability. A fault-tolerant IC must be able to detect and correct all possible faults that may affect its operation. The ability of a chip to detect its own faults is not only necessary for fault-tolerance, but it is also regarded as the ultimate solution to the problem of testing. Off-line periodic testing is selected for this research because it achieves better coverage of physical faults and it requires less extra hardware than on-line error detection techniques. Tests for CMOS stuck-open faults are shown to detect all other faults. Simple test sequence generation procedures for the detection of all faults are derived. The test sequences generated by these procedures produce a trivial output, thereby, greatly simplifying the task of test response analysis. A further advantage of the proposed test generation procedures is that they do not require the enumeration of faults. The implementation of built-in self-test is considered and it is shown that the hardware overhead is comparable to that associated with pseudo-random and pseudo-exhaustive techniques while achieving a much higher fault coverage through-the use of the proposed test generation procedures. The consideration of the problem of testing the test circuitry led to the conclusion that complete test coverage may be achieved if separate chips cooperate in testing each other's untested parts. An alternative approach towards complete test coverage would be to design the test circuitry so that it is as distributed as possible and so that it is tested as it performs its function. Fault correction relies on the provision of spare units and a means of reconfiguring the circuit so that the faulty units are discarded. This raises the question of what is the optimum size of a unit? A mathematical model, linking yield and reliability is therefore developed to answer such a question and also to study the effects of such parameters as the amount of redundancy, the size of the additional circuitry required for testing and reconfiguration, and the effect of periodic testing on reliability. The stringent requirement on the size of the reconfiguration logic is illustrated by the application of the model to a typical example. Another important result concerns the effect of periodic testing on reliability. It is shown that periodic off-line testing can achieve approximately the same level of reliability as on-line testing, even when the time between tests is many hundreds of hours