Low-power and application-specific SRAM design for energy-efficient motion estimation

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2012.Cataloged from PDF version of thesis.Includes bibliographical references (p. 181-189).Video content is expected to account for 70% of total mobile data traffic in 2015. High efficiency video coding, in this context, is crucial for lowering the transmission and storage costs for portable electronics. However, modern video coding standards impose a large hardware complexity. Hence, energy-efficiency of these hardware blocks is becoming more critical than ever before for mobile devices. SRAMs are critical components in almost all SoCs affecting the overall energy-efficiency. This thesis focuses on algorithm and architecture development as well as low-power and application-specific SRAM design targeting motion estimation. First, a motion estimation design is considered for the next generation video standard, HEVC. Hardware cost and coding efficiency trade-offs are quantified and an optimum design choice between hardware complexity and coding efficiency is proposed. Hardware-efficient search algorithm, shared search range across CU engines and pixel pre-fetching algorithms provide 4.3x area, 56x on-chip bandwidth and 151 x off-chip bandwidth reduction. Second, a highly-parallel motion estimation design targeting ultra-low voltage operation and supporting AVC/H.264 and VC-1 standards are considered. Hardware reconfigurability along with frame and macro-block parallel processing are implemented for this engine to maximize hardware sharing between multiple standards and to meet throughput constraints. Third, in the context of low-power SRAMs, a 6T and an 8T SRAM are designed in 28nm and 45nm CMOS technologies targeting low voltage operation. The 6T design achieves operation down to 0.6V and the 8T design achieves operation down to 0.5V providing ~ 2.8x and ~ 4.8x reduction in energy/access respectively. Finally, an application-specific SRAM design targeted for motion estimation is developed. Utilizing the correlation of pixel data to reduce bit-line switching activity, this SRAM achieves up to 1.9x energy savings compared to a similar conventional 8T design. These savings demonstrate that application-specific SRAM design can introduce a new dimension and can be combined with voltage scaling to maximize energy-efficiency.by Mahmut Ersin Sinangil.Ph.D

Approximate Computing Survey, Part II: Application-Specific & Architectural Approximation Techniques and Applications

The challenging deployment of compute-intensive applications from domains such Artificial Intelligence (AI) and Digital Signal Processing (DSP), forces the community of computing systems to explore new design approaches. Approximate Computing appears as an emerging solution, allowing to tune the quality of results in the design of a system in order to improve the energy efficiency and/or performance. This radical paradigm shift has attracted interest from both academia and industry, resulting in significant research on approximation techniques and methodologies at different design layers (from system down to integrated circuits). Motivated by the wide appeal of Approximate Computing over the last 10 years, we conduct a two-part survey to cover key aspects (e.g., terminology and applications) and review the state-of-the art approximation techniques from all layers of the traditional computing stack. In Part II of our survey, we classify and present the technical details of application-specific and architectural approximation techniques, which both target the design of resource-efficient processors/accelerators & systems. Moreover, we present a detailed analysis of the application spectrum of Approximate Computing and discuss open challenges and future directions.Comment: Under Review at ACM Computing Survey

Modeling and Mitigation of Soft Errors in Nanoscale SRAMs

Energetic particle (alpha particle, cosmic neutron, etc.) induced single event data upset or soft error has emerged as a key reliability concern in SRAMs in sub-100 nanometre technologies. Low operating voltage, small node capacitance, high packing density, and lack of error masking mechanisms are primarily responsible for the soft error susceptibility of SRAMs. In addition, since SRAM occupies the majority of die area in system-on-chips (SoCs) and microprocessors, different leakage reduction techniques, such as, supply voltage reduction, gated grounding, etc., are applied to SRAMs in order to limit the overall chip leakage. These leakage reduction techniques exponentially increase the soft error rate in SRAMs. The soft error rate is further accentuated by process variations, which are prominent in scaled-down technologies. In this research, we address these concerns and propose techniques to characterize and mitigate soft errors in nanoscale SRAMs. We develop a comprehensive analytical model of the critical charge, which is a key to assessing the soft error susceptibility of SRAMs. The model is based on the dynamic behaviour of the cell and a simple decoupling technique for the non-linearly coupled storage nodes. The model describes the critical charge in terms of NMOS and PMOS transistor parameters, cell supply voltage, and noise current parameters. Consequently, it enables characterizing the spread of critical charge due to process induced variations in these parameters and to manufacturing defects, such as, resistive contacts or vias. In addition, the model can estimate the improvement in critical charge when MIM capacitors are added to the cell in order to improve the soft error robustness. The model is validated by SPICE simulations (90nm CMOS) and radiation test. The critical charge calculated by the model is in good agreement with SPICE simulations with a maximum discrepancy of less than 5%. The soft error rate estimated by the model for low voltage (sub 0.8 V) operations is within 10% of the soft error rate measured in the radiation test. Therefore, the model can serve as a reliable alternative to time consuming SPICE simulations for optimizing the critical charge and hence the soft error rate at the design stage. In order to limit the soft error rate further, we propose an area-efficient multiword based error correction code (MECC) scheme. The MECC scheme combines four 32 bit data words to form a composite 128 bit ECC word and uses an optimized 4-input transmission-gate XOR logic. Thus MECC significantly reduces the area overhead for check-bit storage and the delay penalty for error correction. In addition, MECC interleaves two composite words in a row for limiting cosmic neutron induced multi-bit errors. The ground potentials of the composite words are controlled to minimize leakage power without compromising the read data stability. However, use of composite words involves a unique write operation where one data word is written while other three data words are read to update the check-bits. A power efficient word line signaling technique is developed to facilitate the write operation. A 64 kb SRAM macro with MECC is designed and fabricated in a commercial 90nm CMOS technology. Measurement results show that the SRAM consumes 534 μW at 100 MHz with a data latency of 3.3 ns for a single bit error correction. This translates into 82% per-bit energy saving and 8x speed improvement over recently reported multiword ECC schemes. Accelerated neutron radiation test carried out at TRIUMF in Vancouver confirms that the proposed MECC scheme can correct up to 85% of soft errors

Cross layer reliability estimation for digital systems

Forthcoming manufacturing technologies hold the promise to increase multifuctional computing systems performance and functionality thanks to a remarkable growth of the device integration density. Despite the benefits introduced by this technology improvements, reliability is becoming a key challenge for the semiconductor industry. With transistor size reaching the atomic dimensions, vulnerability to unavoidable fluctuations in the manufacturing process and environmental stress rise dramatically. Failing to meet a reliability requirement may add excessive re-design cost to recover and may have severe consequences on the success of a product. %Worst-case design with large margins to guarantee reliable operation has been employed for long time. However, it is reaching a limit that makes it economically unsustainable due to its performance, area, and power cost. One of the open challenges for future technologies is building ``dependable'' systems on top of unreliable components, which will degrade and even fail during normal lifetime of the chip. Conventional design techniques are highly inefficient. They expend significant amount of energy to tolerate the device unpredictability by adding safety margins to a circuit's operating voltage, clock frequency or charge stored per bit. Unfortunately, the additional cost introduced to compensate unreliability are rapidly becoming unacceptable in today's environment where power consumption is often the limiting factor for integrated circuit performance, and energy efficiency is a top concern. Attention should be payed to tailor techniques to improve the reliability of a system on the basis of its requirements, ending up with cost-effective solutions favoring the success of the product on the market. Cross-layer reliability is one of the most promising approaches to achieve this goal. Cross-layer reliability techniques take into account the interactions between the layers composing a complex system (i.e., technology, hardware and software layers) to implement efficient cross-layer fault mitigation mechanisms. Fault tolerance mechanism are carefully implemented at different layers starting from the technology up to the software layer to carefully optimize the system by exploiting the inner capability of each layer to mask lower level faults. For this purpose, cross-layer reliability design techniques need to be complemented with cross-layer reliability evaluation tools, able to precisely assess the reliability level of a selected design early in the design cycle. Accurate and early reliability estimates would enable the exploration of the system design space and the optimization of multiple constraints such as performance, power consumption, cost and reliability. This Ph.D. thesis is devoted to the development of new methodologies and tools to evaluate and optimize the reliability of complex digital systems during the early design stages. More specifically, techniques addressing hardware accelerators (i.e., FPGAs and GPUs), microprocessors and full systems are discussed. All developed methodologies are presented in conjunction with their application to real-world use cases belonging to different computational domains

Non-invasive Techniques Towards Recovering Highly Secure Unclonable Cryptographic Keys and Detecting Counterfeit Memory Chips

Due to the ubiquitous presence of memory components in all electronic computing systems, memory-based signatures are considered low-cost alternatives to generate unique device identifiers (IDs) and cryptographic keys. On the one hand, this unique device ID can potentially be used to identify major types of device counterfeitings such as remarked, overproduced, and cloned. On the other hand, memory-based cryptographic keys are commercially used in many cryptographic applications such as securing software IP, encrypting key vault, anchoring device root of trust, and device authentication for could services. As memory components generate this signature in runtime rather than storing them in memory, an attacker cannot clone/copy the signature and reuse them in malicious activity. However, to ensure the desired level of security, signatures generated from two different memory chips should be completely random and uncorrelated from each other. Traditionally, memory-based signatures are considered unique and uncorrelated due to the random variation in the manufacturing process. Unfortunately, in previous studies, many deterministic components of the manufacturing process, such as memory architecture, layout, systematic process variation, device package, are ignored. This dissertation shows that these deterministic factors can significantly correlate two memory signatures if those two memory chips share the same manufacturing resources (i.e., manufacturing facility, specification set, design file, etc.). We demonstrate that this signature correlation can be used to detect major counterfeit types in a non-invasive and low-cost manner. Furthermore, we use this signature correlation as side-channel information to attack memory-based cryptographic keys. We validate our contribution by collecting data from several commercially available off-the-shelf (COTS) memory chips/modules and considering different usage-case scenarios

Soft Error Analysis and Mitigation at High Abstraction Levels

Radiation-induced soft errors, as one of the major reliability challenges in future technology nodes, have to be carefully taken into consideration in the design space exploration. This thesis presents several novel and efficient techniques for soft error evaluation and mitigation at high abstract levels, i.e. from register transfer level up to behavioral algorithmic level. The effectiveness of proposed techniques is demonstrated with extensive synthesis experiments

Innovative Techniques for Testing and Diagnosing SoCs

We rely upon the continued functioning of many electronic devices for our everyday welfare, usually embedding integrated circuits that are becoming even cheaper and smaller with improved features. Nowadays, microelectronics can integrate a working computer with CPU, memories, and even GPUs on a single die, namely System-On-Chip (SoC). SoCs are also employed on automotive safety-critical applications, but need to be tested thoroughly to comply with reliability standards, in particular the ISO26262 functional safety for road vehicles. The goal of this PhD. thesis is to improve SoC reliability by proposing innovative techniques for testing and diagnosing its internal modules: CPUs, memories, peripherals, and GPUs. The proposed approaches in the sequence appearing in this thesis are described as follows: 1. Embedded Memory Diagnosis: Memories are dense and complex circuits which are susceptible to design and manufacturing errors. Hence, it is important to understand the fault occurrence in the memory array. In practice, the logical and physical array representation differs due to an optimized design which adds enhancements to the device, namely scrambling. This part proposes an accurate memory diagnosis by showing the efforts of a software tool able to analyze test results, unscramble the memory array, map failing syndromes to cell locations, elaborate cumulative analysis, and elaborate a final fault model hypothesis. Several SRAM memory failing syndromes were analyzed as case studies gathered on an industrial automotive 32-bit SoC developed by STMicroelectronics. The tool displayed defects virtually, and results were confirmed by real photos taken from a microscope. 2. Functional Test Pattern Generation: The key for a successful test is the pattern applied to the device. They can be structural or functional; the former usually benefits from embedded test modules targeting manufacturing errors and is only effective before shipping the component to the client. The latter, on the other hand, can be applied during mission minimally impacting on performance but is penalized due to high generation time. However, functional test patterns may benefit for having different goals in functional mission mode. Part III of this PhD thesis proposes three different functional test pattern generation methods for CPU cores embedded in SoCs, targeting different test purposes, described as follows: a. Functional Stress Patterns: Are suitable for optimizing functional stress during I Operational-life Tests and Burn-in Screening for an optimal device reliability characterization b. Functional Power Hungry Patterns: Are suitable for determining functional peak power for strictly limiting the power of structural patterns during manufacturing tests, thus reducing premature device over-kill while delivering high test coverage c. Software-Based Self-Test Patterns: Combines the potentiality of structural patterns with functional ones, allowing its execution periodically during mission. In addition, an external hardware communicating with a devised SBST was proposed. It helps increasing in 3% the fault coverage by testing critical Hardly Functionally Testable Faults not covered by conventional SBST patterns. An automatic functional test pattern generation exploiting an evolutionary algorithm maximizing metrics related to stress, power, and fault coverage was employed in the above-mentioned approaches to quickly generate the desired patterns. The approaches were evaluated on two industrial cases developed by STMicroelectronics; 8051-based and a 32-bit Power Architecture SoCs. Results show that generation time was reduced upto 75% in comparison to older methodologies while increasing significantly the desired metrics. 3. Fault Injection in GPGPU: Fault injection mechanisms in semiconductor devices are suitable for generating structural patterns, testing and activating mitigation techniques, and validating robust hardware and software applications. GPGPUs are known for fast parallel computation used in high performance computing and advanced driver assistance where reliability is the key point. Moreover, GPGPU manufacturers do not provide design description code due to content secrecy. Therefore, commercial fault injectors using the GPGPU model is unfeasible, making radiation tests the only resource available, but are costly. In the last part of this thesis, we propose a software implemented fault injector able to inject bit-flip in memory elements of a real GPGPU. It exploits a software debugger tool and combines the C-CUDA grammar to wisely determine fault spots and apply bit-flip operations in program variables. The goal is to validate robust parallel algorithms by studying fault propagation or activating redundancy mechanisms they possibly embed. The effectiveness of the tool was evaluated on two robust applications: redundant parallel matrix multiplication and floating point Fast Fourier Transform

System-level power optimization:techniques and tools

This tutorial surveys design methods for energy-efficient system-level design. We consider electronic sytems consisting of a hardware platform and software layers. We consider the three major constituents of hardware that consume energy, namely computation, communication, and storage units, and we review methods of reducing their energy consumption. We also study models for analyzing the energy cost of software, and methods for energy-efficient software design and compilation. This survery is organized around three main phases of a system design: conceptualization and modeling design and implementation, and runtime management. For each phase, we review recent techniques for energy-efficient design of both hardware and software