Performance Comparison of Phase Change Materials and Metal-Insulator Transition Materials for Direct Current and Radio Frequency Switching Applications

Advanced understanding of the physics makes phase change materials (PCM) and metal-insulator transition (MIT) materials great candidates for direct current (DC) and radio frequency (RF) switching applications. In the literature, germanium telluride (GeTe), a PCM, and vanadium dioxide (VO2), an MIT material have been widely investigated for DC and RF switching applications due to their remarkable contrast in their OFF/ON state resistivity values. In this review, innovations in design, fabrication, and characterization associated with these PCM and MIT material-based RF switches, have been highlighted and critically reviewed from the early stage to the most recent works. We initially report on the growth of PCM and MIT materials and then discuss their DC characteristics. Afterwards, novel design approaches and notable fabrication processes; utilized to improve switching performance; are discussed and reviewed. Finally, a brief vis-á-vis comparison of resistivity, insertion loss, isolation loss, power consumption, RF power handling capability, switching speed, and reliability is provided to compare their performance to radio frequency microelectromechanical systems (RF MEMS) switches; which helps to demonstrate the current state-of-the-art, as well as insight into their potential in future applications

Monolithic integration of broadband optical isolators for polarization-diverse silicon photonics

Integrated optical isolators have been a longstanding challenge for photonic integrated circuits (PIC). An ideal integrated optical isolator for PIC should be made by a monolithic process, have a small footprint, exhibit broadband and polarization-diverse operation, and be compatible with multiple materials platforms. Despite significant progress, the optical isolators reported so far do not meet all these requirements. In this article we present monolithically integrated broadband magneto-optical isolators on silicon and silicon nitride (SiN) platforms operating for both TE and TM modes with record high performances, fulfilling all the essential characteristics for PIC applications. In particular, we demonstrate fully-TE broadband isolators by depositing high quality magneto-optical garnet thin films on the sidewalls of Si and SiN waveguides, a critical result for applications in TE-polarized on-chip lasers and amplifiers. This work demonstrates monolithic integration of high performance optical isolators on chip for polarization-diverse silicon photonic systems, enabling new pathways to impart nonreciprocal photonic functionality to a variety of integrated photonic devices

Study of optoelectronic switch for satellite-switched time-division multiple access

The use of optoelectronic switching for satellite switched time division multiple access will improve the isolation and reduce the crosstalk of an IF switch matrix. The results are presented of a study on optoelectronic switching. Tasks include literature search, system requirements study, candidate switching architecture analysis, and switch model optimization. The results show that the power divided and crossbar switching architectures are good candidates for an IF switch matrix

Technologies for 3D Heterogeneous Integration

3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also offers the possibility to build up systems with high complexity just by combining devices of different technologies. For ultra thin silicon is the base of this integration technology, the fundamental processing steps will be described, as well as appropriate handling concepts. Three main concepts for 3D integration have been developed at IZM. The approach with the greatest flexibility called Inter Chip Via - Solid Liquid Interdiffusion (ICV-SLID) is introduced. This is a chip-to-wafer stacking technology which combines the advantages of the Inter Chip Via (ICV) process and the solid-liquid-interdiffusion technique (SLID) of copper and tin. The fully modular ICV-SLID concept allows the formation of multiple device stacks. A test chip was designed and the total process sequence of the ICV-SLID technology for the realization of a three-layer chip-to-wafer stack was demonstrated. The proposed wafer-level 3D integration concept has the potential for low cost fabrication of multi-layer high-performance 3D-SoCs and is well suited as a replacement for embedded technologies based on monolithic integration. To address yield issues a wafer-level chip-scale handling is presented as well, to select known-good dies and work on them with wafer-level process sequences before joining them to integrated stacks.Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838

Surface micromachined mechanisms and micromotors

Electric micromotors are sub-millimeter sized actuators capable of unrestrained motion in at least one degree of freedom. Polysilicon surface micromachining using heavily phosphorus-doped LPCVD polysilicon for the structural material, LPCVD silicon nitride for the electrical isolation and deposited silicon dioxide for the sacrificial material has formed the fabrication technology base for the development of these micromotors. Two polysilicon surface micromachining processes, referred to here as the center-pin and flange, have been demonstrated for the fabrication of passive mechanisms and micromotors. Passive mechanisms such as gear trains, cranks and manipulators have been implemented on silicon. Reported operational micromotors have been of the rotary variable-capacitance salient-pole and harmonic (or wobble) side-drive designs. These micromotors are capable of motive torques in the 10 pN m order of magnitude range. Preliminary progress has been made in studying the operational, friction and wear characteristics of these micromechanical devices. Typical operational voltages have been as low as 37 V and 26 V across 1.5 mu m air gap salient-pole and harmonic micromotors. These excitations correspond to electric field intensities above 10(8) Vm-1 in the micromotor air gaps. Salient-pole and wobble micromotors have been reported to operate at speeds as high as 15000 rpm and 700 rpm, respectively. Micromotor lifetimes of at least many millions of cycles over a period of several days have been reported

Beyond Power over Ethernet : the development of Digital Energy Networks for buildings

Alternating current power distribution using analogue control and safety devices has been the dominant process of power distribution within our buildings since the electricity industry began in the late 19th century. However, with advances in digital technology, the seeds of change have been growing over the last decade. Now, with the simultaneous dramatic fall in power requirements of digital devices and corresponding rise in capability of Power over Ethernet, an entire desktop environment can be powered by a single direct current (dc) Ethernet cable. Going beyond this, it will soon be possible to power entire office buildings using dc networks. This means the logic of “one-size fits all” from the existing ac system is no longer relevant and instead there is an opportunity to redesign the power topology to be appropriate for different applications, devices and end-users throughout the building. This paper proposes a 3-tier classification system for the topology of direct current microgrids in commercial buildings – called a Digital Energy Network or DEN. The first tier is power distribution at a full building level (otherwise known as the microgrid); the second tier is power distribution at a room level (the nanogrid); and the third tier is power distribution at a desktop or appliance level (the picogrid). An important aspect of this classification system is how the design focus changes for each grid. For example; a key driver of the picogrid is the usability of the network – high data rates, and low power requirements; however, in the microgrid, the main driver is high power and efficiency at low cost

Concentrated Ground Plane Booster Antenna Technology for Multiband Operation in Handset Devices

The current demand in the handset antenna field requires multiband antennas due to the existence of multiple communication standards and the emergence of new ones. At the same time, antennas with reduced dimensions are strongly required in order to be easily integrated. In this sense, the paper proposes a compact radiating system that uses two non-resonant elements to properly excite the ground plane to solve the abovementioned shortcomings by minimizing the required Printed Circuit Board (PCB) area while ensuring a multiband performance. These non-resonant elements are called here ground plane boosters since they excite an efficient mode of the ground plane. The proposed radiating system comprises two ground plane boosters of small dimensions of 5 mm x 5 mm x 5 mm. One is in charge of the low frequency region (0.824-0.960 GHz) and the other is in charge of the high frequency region (1.710-2.170 GHz). With the aim of achieving a compact configuration, the two boosters are placed close to each other in a corner of the ground plane of a handset device (concentrated architecture). Several experiments related to the coupling between boosters have been carried out in two different platforms (barphone and smartphone), and the best position and the required matching network are presented. The novel proposal achieves multiband performance at GSM850/900/1800/1900 and UMTS

Automatic synthesis of analog layout : a survey

A review of recent research in the automatic synthesis of physical geometry for analog integrated circuits is presented. On introduction, an explanation of the difficulties involved in analog layout as opposed to digital layout is covered. Review of the literature then follows. Emphasis is placed on the exposition of general methods for addressing problems specific to analog layout, with the details of specific systems only being given when they surve to illustrate these methods well. The conclusion discusses problems remaining and offers a prediction as to how technology will evolve to solve them. It is argued that although progress has been and will continue to be made in the automation of analog IC layout, due to fundamental differences in the nature of analog IC design as opposed to digital design, it should not be expected that the level of automation of the former will reach that of the latter any time soon

Passband flattening and rejection band broadening of a periodic Mach-Zehnder wavelength filter by adding a tuned ring resonator

A thermo-optically tuneable periodic wavelength filter having a rectangular wavelength response with a 50 GHz free spectral range, based on a Mach-Zehnder interferometer with ring resonator has been fabricated in SiON waveguide technology

Nanoscale integration of single cell biologics discovery processes using optofluidic manipulation and monitoring.

The new and rapid advancement in the complexity of biologics drug discovery has been driven by a deeper understanding of biological systems combined with innovative new therapeutic modalities, paving the way to breakthrough therapies for previously intractable diseases. These exciting times in biomedical innovation require the development of novel technologies to facilitate the sophisticated, multifaceted, high-paced workflows necessary to support modern large molecule drug discovery. A high-level aspiration is a true integration of "lab-on-a-chip" methods that vastly miniaturize cellulmical experiments could transform the speed, cost, and success of multiple workstreams in biologics development. Several microscale bioprocess technologies have been established that incrementally address these needs, yet each is inflexibly designed for a very specific process thus limiting an integrated holistic application. A more fully integrated nanoscale approach that incorporates manipulation, culture, analytics, and traceable digital record keeping of thousands of single cells in a relevant nanoenvironment would be a transformative technology capable of keeping pace with today's rapid and complex drug discovery demands. The recent advent of optical manipulation of cells using light-induced electrokinetics with micro- and nanoscale cell culture is poised to revolutionize both fundamental and applied biological research. In this review, we summarize the current state of the art for optical manipulation techniques and discuss emerging biological applications of this technology. In particular, we focus on promising prospects for drug discovery workflows, including antibody discovery, bioassay development, antibody engineering, and cell line development, which are enabled by the automation and industrialization of an integrated optoelectronic single-cell manipulation and culture platform. Continued development of such platforms will be well positioned to overcome many of the challenges currently associated with fragmented, low-throughput bioprocess workflows in biopharma and life science research