59 research outputs found
Analysis and Characterization of Single-Poly Floating Gate Devices in 0.35um PDSOI Process
The purpose of this thesis is to demonstrate a single-poly Floating Gate Device (FGD) in 0.35 m Partially Depleted Silicon On Insulator (PDSOI) process for use in analog circuits for post process trimming. Floating gate devices with different aspect ratios have been fabricated to facilitate this behavioral study in PDSOI process. Fundamentals of floating gate devices, the advantages and disadvantages of PDSOI compared to bulk CMOS with respect to single-poly floating gate devices are discussed. Various experiments on behavior and performance of threshold voltage have been conducted and its variation with programming/erasing time and amplitude has been analyzed. The single-poly FGD’s on-resistance variation and hysteresis behavior with threshold voltage has been documented. A mathematical relation between FGD’s on-resistance and threshold voltage has been experimentally derived. Intrinsic data retention has been estimated through extrapolation of experimental data. A process independent MATLAB simulation model has been successfully developed for understanding the threshold voltage time dependence characteristics. And finally, this work has shown that programmable or post-process trimmable analog circuits can be implemented in SOI using single-poly FGDs as programmable resistive elements. A SOI programmable beta-multiplier current reference has been successfully demonstrated using the singlepoly FGD as a resistive element
An FPGA Based Testbench for Reliability and Endurance Characterization of Nonvolatile Memory
Coordinated Science Laboratory was formerly known as Control Systems LaboratoryJet Propulsion Laboratory / JPL 122991Ope
Optimization and evaluation of variability in the programming window of a flash cell with molecular metal-oxide storage
We report a modeling study of a conceptual nonvolatile memory cell based on inorganic molecular metal-oxide clusters as a storage media embedded in the gate dielectric of a MOSFET. For the purpose of this paper, we developed a multiscale simulation framework that enables the evaluation of variability in the programming window of a flash cell with sub-20-nm gate length. Furthermore, we studied the threshold voltage variability due to random dopant fluctuations and fluctuations in the distribution of the molecular clusters in the cell. The simulation framework and the general conclusions of our work are transferrable to flash cells based on alternative molecules used for a storage media
High dielectric constant materials in SONOS-type non- volatile memory structures
Ph.DDOCTOR OF PHILOSOPH
High performance floating gate memories using graphene as charge storage medium and atomic layer deposited high-k dielectric layers as tunnel barrier
Ankara : Materials Science and Nanotechnology Program of the Graduate School of Engineering and Science of Bilkent Univerity, 2013.Thesis (Master's) -- Bilkent University, 2013.Includes bibliographical references leaves 87-98.With the ongoing development in portable electronic devices, low power
consumption, improved data retention rate and higher operation speed are the
merits demanded by modern non-volatile memory technology. Flash memory
devices with discrete charge-trapping media are regarded as an alternative
solution to conventional floating gate technology. Flash memories utilizing Sinitride
as charge storage media dominate due to enhanced endurance, better
scaling capability and simple fabrication. The use of high-k dielectrics as tunnel
layer and control layer is also crucial in charge-trap flash memory devices since
they allow further scaling and enhanced charge injection without data retention
degradation. Atomic layer deposition (ALD) is a powerful technique for the
growth of pinhole-free high-k dielectrics with precisely controlled thickness and
high conformality. The application of graphene as charge trapping medium in
flash memory devices is promising to obtain improved charge storage capability
with miniaturization. Graphene acts as an effective charge storage medium due
to high density of states in deep energy levels.
In this thesis, we fabricate graphene flash memory devices with ALD-grown
HfO2/AlN as tunnel layer and Al2O3 as control layer. Graphene oxide nanosheets
are derived from the acid exfoliation of natural graphite by Hummers Method.
The graphene layer is obtained by spin-coating of water soluble graphene oxide
suspension followed by a thermal annealing process. Memory performance
including hysteresis window, data retention rate and program transient
characteristics for both electron and hole storage mechanisms are determined by
performing high frequency capacitance-voltage measurements. For comparing
the memory effect of graphene on device performance, we also fabricate and
characterize identical flash capacitors with Si-rich SiN layer as charge storage
medium and HfO2 as tunnel oxide layer. The Si-nitride films are deposited with
high SiH4/NH3 gas flow ratio by plasma-enhanced chemical vapor deposition
system.
Graphene flash memory devices exhibit superior memory performance.
Compared with Si-nitride based cells, hysteresis window, retention performance
and programming speed are both significantly enhanced with the use of
graphene. For electron storage, graphene flash memory provides a saturated flat
band shift of 1.2 V at a write-pulse duration of 100 ns with a voltage bias of 5 V.
The high density of states and high work function of graphene improve the
memory performance, leading to increased charge storage capability, enhanced
retention rate and faster programming operation at low voltages.
The use of graphene as charge storage medium and ALD-grown high-k
dielectrics as tunnel and control layers improves the existing flash technology
and satisfies the requirements including scalability, at least 10-year retention,
low voltage operation, faster write performance and CMOS-compatible
fabrication.Kocaay, DenizM.S
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