1,979 research outputs found

    Comprehensive Evaluation of Supply Voltage Underscaling in FPGA on-Chip Memories

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    In this work, we evaluate aggressive undervolting, i.e., voltage scaling below the nominal level to reduce the energy consumption of Field Programmable Gate Arrays (FPGAs). Usually, voltage guardbands are added by chip vendors to ensure the worst-case process and environmental scenarios. Through experimenting on several FPGA architectures, we measure this voltage guardband to be on average 39% of the nominal level, which in turn, delivers more than an order of magnitude power savings. However, further undervolting below the voltage guardband may cause reliability issues as the result of the circuit delay increase, i.e., start to appear faults. We extensively characterize the behavior of these faults in terms of the rate, location, type, as well as sensitivity to environmental temperature, with a concentration of on-chip memories, or Block RAMs (BRAMs). Finally, we evaluate a typical FPGA-based Neural Network (NN) accelerator under low-voltage BRAM operations. In consequence, the substantial NN energy savings come with the cost of NN accuracy loss. To attain power savings without NN accuracy loss, we propose a novel technique that relies on the deterministic behavior of undervolting faults and can limit the accuracy loss to 0.1% without any timing-slack overhead.Peer ReviewedPostprint (author's final draft

    Power efficient resilient microarchitectures for PVT variability mitigation

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    Nowadays, the high power density and the process, voltage, and temperature variations became the most critical issues that limit the performance of the digital integrated circuits because of the continuous scaling of the fabrication technology. Dynamic voltage and frequency scaling technique is used to reduce the power consumption while different time relaxation techniques and error recovery microarchitectures are used to tolerate the process, voltage, and temperature variations. These techniques reduce the throughput by scaling down the frequency or flushing and restarting the errant pipeline. This thesis presents a novel resilient microarchitecture which is called ERSUT-based resilient microarchitecture to tolerate the induced delays generated by the voltage scaling or the process, voltage, and temperature variations. The resilient microarchitecture detects and recovers the induced errors without flushing the pipeline and without scaling down the operating frequency. An ERSUT-based resilient 16 × 16 bit MAC unit, implemented using Global Foundries 65 nm technology and ARM standard cells library, is introduced as a case study with 18.26% area overhead and up to 1.5x speedup. At the typical conditions, the maximum frequency of the conventional MAC unit is about 375 MHz while the resilient MAC unit operates correctly at a frequency up to 565 MHz. In case of variations, the resilient MAC unit tolerates induced delays up to 50% of the clock period while keeping its throughput equal to the conventional MAC unit’s maximum throughput. At 375 MHz, the resilient MAC unit is able to scale down the supply voltage from 1.2 V to 1.0 V saving about 29% of the power consumed by the conventional MAC unit. A double-edge-triggered microarchitecture is also introduced to reduce the power consumption extremely by reducing the frequency of the clock tree to the half while preserving the same maximum throughput. This microarchitecture is applied to different ISCAS’89 benchmark circuits in addition to the 16x16 bit MAC unit and the average power reduction of all these circuits is 63.58% while the average area overhead is 31.02%. All these circuits are designed using Global Foundries 65nm technology and ARM standard cells library. Towards the full automation of the ERSUT-based resilient microarchitecture, an ERSUT-based algorithm is introduced in C++ to accelerate the design process of the ERSUT-based microarchitecture. The developed algorithm reduces the design-time efforts dramatically and allows the ERSUT-based microarchitecture to be adopted by larger industrial designs. Depending on the ERSUT-based algorithm, a validation study about applying the ERSUT-based microarchitecture on the MAC unit and different ISCAS’89 benchmark circuits with different complexity weights is introduced. This study shows that 72% of these circuits tolerates more than 14% of their clock periods and 54.5% of these circuits tolerates more than 20% while 27% of these circuits tolerates more than 30%. Consequently, the validation study proves that the ERSUT-based resilient microarchitecture is a valid applicable solution for different circuits with different complexity weights

    Approximate and timing-speculative hardware design for high-performance and energy-efficient video processing

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    Since the end of transistor scaling in 2-D appeared on the horizon, innovative circuit design paradigms have been on the rise to go beyond the well-established and ultraconservative exact computing. Many compute-intensive applications – such as video processing – exhibit an intrinsic error resilience and do not necessarily require perfect accuracy in their numerical operations. Approximate computing (AxC) is emerging as a design alternative to improve the performance and energy-efficiency requirements for many applications by trading its intrinsic error tolerance with algorithm and circuit efficiency. Exact computing also imposes a worst-case timing to the conventional design of hardware accelerators to ensure reliability, leading to an efficiency loss. Conversely, the timing-speculative (TS) hardware design paradigm allows increasing the frequency or decreasing the voltage beyond the limits determined by static timing analysis (STA), thereby narrowing pessimistic safety margins that conventional design methods implement to prevent hardware timing errors. Timing errors should be evaluated by an accurate gate-level simulation, but a significant gap remains: How these timing errors propagate from the underlying hardware all the way up to the entire algorithm behavior, where they just may degrade the performance and quality of service of the application at stake? This thesis tackles this issue by developing and demonstrating a cross-layer framework capable of performing investigations of both AxC (i.e., from approximate arithmetic operators, approximate synthesis, gate-level pruning) and TS hardware design (i.e., from voltage over-scaling, frequency over-clocking, temperature rising, and device aging). The cross-layer framework can simulate both timing errors and logic errors at the gate-level by crossing them dynamically, linking the hardware result with the algorithm-level, and vice versa during the evolution of the application’s runtime. Existing frameworks perform investigations of AxC and TS techniques at circuit-level (i.e., at the output of the accelerator) agnostic to the ultimate impact at the application level (i.e., where the impact is truly manifested), leading to less optimization. Unlike state of the art, the framework proposed offers a holistic approach to assessing the tradeoff of AxC and TS techniques at the application-level. This framework maximizes energy efficiency and performance by identifying the maximum approximation levels at the application level to fulfill the required good enough quality. This thesis evaluates the framework with an 8-way SAD (Sum of Absolute Differences) hardware accelerator operating into an HEVC encoder as a case study. Application-level results showed that the SAD based on the approximate adders achieve savings of up to 45% of energy/operation with an increase of only 1.9% in BD-BR. On the other hand, VOS (Voltage Over-Scaling) applied to the SAD generates savings of up to 16.5% in energy/operation with around 6% of increase in BD-BR. The framework also reveals that the boost of about 6.96% (at 50°) to 17.41% (at 75° with 10- Y aging) in the maximum clock frequency achieved with TS hardware design is totally lost by the processing overhead from 8.06% to 46.96% when choosing an unreliable algorithm to the blocking match algorithm (BMA). We also show that the overhead can be avoided by adopting a reliable BMA. This thesis also shows approximate DTT (Discrete Tchebichef Transform) hardware proposals by exploring a transform matrix approximation, truncation and pruning. The results show that the approximate DTT hardware proposal increases the maximum frequency up to 64%, minimizes the circuit area in up to 43.6%, and saves up to 65.4% in power dissipation. The DTT proposal mapped for FPGA shows an increase of up to 58.9% on the maximum frequency and savings of about 28.7% and 32.2% on slices and dynamic power, respectively compared with stat

    Hard X-ray polarimetry with Caliste, a high performance CdTe based imaging spectrometer

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    Since the initial exploration of soft gamma-ray sky in the 60's, high-energy celestial sources have been mainly characterized through imaging, spectroscopy and timing analysis. Despite tremendous progress in the field, the radiation mechanisms at work in sources such as neutrons stars and black holes are still unclear. The polarization state of the radiation is an observational parameter which brings key additional information about the physical process. This is why most of the projects for the next generation of space missions covering the tens of keV to the MeV region require a polarization measurement capability. A key element enabling this capability is a detector system allowing the identification and characterization of Compton interactions as they are the main process at play. The hard X-ray imaging spectrometer module, developed in CEA with the generic name of Caliste module, is such a detector. In this paper, we present experimental results for two types of Caliste-256 modules, one based on a CdTe crystal, the other one on a CdZnTe crystal, which have been exposed to linearly polarized beams at the European Synchrotron Radiation Facility. These results, obtained at 200-300 keV, demonstrate their capability to give an accurate determination of the polarization parameters (polarization angle and fraction) of the incoming beam. Applying a selection to our data set, equivalent to select 90 degrees Compton scattered interactions in the detector plane, we find a modulation factor Q of 0.78. The polarization angle and fraction are derived with accuracies of approximately 1 degree and 5%. The modulation factor remains larger than 0.4 when essentially no selection is made at all on the data. These results prove that the Caliste-256 modules have performances allowing them to be excellent candidates as detectors with polarimetric capabilities, in particular for future space missions.Comment: 17 pages, 14 figures, 2 tables in Experimental Astronomy, 201

    Within-Die Delay Variation Measurement And Analysis For Emerging Technologies Using An Embedded Test Structure

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    Both random and systematic within-die process variations (PV) are growing more severe with shrinking geometries and increasing die size. Escalation in the variations in delay and power with reductions in feature size places higher demands on the accuracy of variation models. Their availability can be used to improve yield, and the corresponding profitability and product quality of the fabricated integrated circuits (ICs). Sources of within-die variations include optical source limitations, and layout-based systematic effects (pitch, line-width variability, and microscopic etch loading). Unfortunately, accurate models of within-die PVs are becoming more difficult to derive because of their increasingly sensitivity to design-context. Embedded test structures (ETS) continue to play an important role in the development of models of PVs and as a mechanism to improve correlations between hardware and models. Variations in path delays are increasing with scaling, and are increasingly affected by neighborhood\u27 interactions. In order to fully characterize within-die variations, delays must be measured in the context of actual core-logic macros. Doing so requires the use of an embedded test structure, as opposed to traditional scribe line test structures such as ring oscillators (RO). Accurate measurements of within-die variations can be used, e.g., to better tune models to actual hardware (model-to-hardware correlations). In this research project, I propose an embedded test structure called REBEL (Regional dELay BEhavior) that is designed to measure path delays in a minimally invasive fashion; and its architecture measures the path delays more accurately. Design for manufacture-ability (DFM) analysis is done on the on 90 nm ASIC chips and 28nm Zynq 7000 series FPGA boards. I present ASIC results on within-die path delay variations in a floating-point unit (FPU) fabricated in IBM\u27s 90 nm technology, with 5 pipeline stages, used as a test vehicle in chip experiments carried out at nine different temperature/voltage (TV) corners. Also experimental data has been analyzed for path delay variations in short vs long paths. FPGA results on within-die variation and die-to-die variations on Advanced Encryption System (AES) using single pipelined stage are also presented. Other analysis that have been performed on the calibrated path delays are Flip Flop propagation delays for both rising and falling edge (tpHL and tpLH), uncertainty analysis, path distribution analysis, short versus long path variations and mid-length path within-die variation. I also analyze the impact on delay when the chips are subjected to industrial-level temperature and voltage variations. From the experimental results, it has been established that the proposed REBEL provides capabilities similar to an off-chip logic analyzer, i.e., it is able to capture the temporal behavior of the signal over time, including any static and dynamic hazards that may occur on the tested path. The ASIC results further show that path delays are correlated to the launch-capture (LC) interval used to time them. Therefore, calibration as proposed in this work must be carried out in order to obtain an accurate analysis of within-die variations. Results on ASIC chips show that short paths can vary up to 35% on average, while long paths vary up to 20% at nominal temperature and voltage. A similar trend occurs for within-die variations of mid-length paths where magnitudes reduced to 20% and 5%, respectively. The magnitude of delay variations in both these analyses increase as temperature and voltage are changed to increase performance. The high level of within-die delay variations are undesirable from a design perspective, but they represent a rich source of entropy for applications that make use of \u27secrets\u27 such as authentication, hardware metering and encryption. Physical unclonable functions (PUFs) are a class of primitives that leverage within-die-variations as a means of generating random bit strings for these types of applications, including hardware security and trust. Zynq FPGAs Die-to-Die and within-die variation study shows that on average there is 5% of within-Die variation and the range of die-to-Die variation can go upto 3ns. The die-to-Die variations can be explored in much further detail to study the variations spatial dependance. Additionally, I also carried out research in the area data mining to cater for big data by focusing the work on decision tree classification (DTC) to speed-up the classification step in hardware implementation. For this purpose, I devised a pipelined architecture for the implementation of axis parallel binary decision tree classification for meeting up with the requirements of execution time and minimal resource usage in terms of area. The motivation for this work is that analyzing larger data-sets have created abundant opportunities for algorithmic and architectural developments, and data-mining innovations, thus creating a great demand for faster execution of these algorithms, leading towards improving execution time and resource utilization. Decision trees (DT) have since been implemented in software programs. Though, the software implementation of DTC is highly accurate, the execution times and the resource utilization still require improvement to meet the computational demands in the ever growing industry. On the other hand, hardware implementation of DT has not been thoroughly investigated or reported in detail. Therefore, I propose a hardware acceleration of pipelined architecture that incorporates the parallel approach in acquiring the data by having parallel engines working on different partitions of data independently. Also, each engine is processing the data in a pipelined fashion to utilize the resources more efficiently and reduce the time for processing all the data records/tuples. Experimental results show that our proposed hardware acceleration of classification algorithms has increased throughput, by reducing the number of clock cycles required to process the data and generate the results, and it requires minimal resources hence it is area efficient. This architecture also enables algorithms to scale with increasingly large and complex data sets. We developed the DTC algorithm in detail and explored techniques for adapting it to a hardware implementation successfully. This system is 3.5 times faster than the existing hardware implementation of classification.\u2

    Improving Cadmium Zinc Telluride Spectrometer Performance and Capabilities.

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    CdZnTe is the premier semiconductor material for room-temperature gamma-ray spectroscopy and imaging. The high effective atomic number of 52 and high density of 6 grams per centimeter cubed yield excellent detection efficiency; a pixelated detector design allows for 3D position sensitivity and material non-uniformity corrections resulting in <1% FWHM energy resolution at 662 keV; the wide bandgap of 1.61 eV permits room temperature operation. Fabrication improvements and the feasibility of floating-temperature operation are analyzed in this work. Several fabrication changes are tested to mitigate gain nonuniformity in some pixels during operation. Changing the substrate from printed circuit board to ceramic improves operation, maintains spectroscopic performance, and is adopted. Switching the electrode contacts from gold to platinum drastically raises the leakage current and is rejected. Two proprietary fabrication techniques are proposed. The first, fabrication A, raises the leakage, degrades spectroscopic performance, and is rejected. The second, fabrication B, causes greater gain nonuniformity, degrades resolution, and is also rejected. To reduce system power consumption, a temperature correction algorithm is developed that allows data collection at operating temperatures different from the calibration temperature without performance degradation. This begins with isolating the temperature effects to the detector rather than the readout electronics, and demonstrating the accuracy of the electronic baseline as a surrogate for temperature. Considering the temperature effects, linear gain corrections only partially recover spectroscopic performance and cannot account for pixel nonuniformity or energy nonlinearity. Parametric corrections pinpoint specific aspects of system operation susceptible to change with temperature. Peak hold drop, depth of interaction, and gain as a function of depth are individually corrected and recover spectroscopic performance almost entirely. To reduce data requirements, the corrections are reapplied assuming separability between the temperature and original parameter domains, with minimal resolution degradation.PHDNuclear Engineering & Radiological SciencesUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/135749/1/mileman_1.pd

    High Temperature Electronics Design for Aero Engine Controls and Health Monitoring

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    There is a growing desire to install electronic power and control systems in high temperature harsh environments to improve the accuracy of critical measurements, reduce the amount of cabling and to eliminate cooling systems. Typical target applications include electronics for energy exploration, power generation and control systems. Technical topics presented in this book include:• High temperature electronics market• High temperature devices, materials and assembly processes• Design, manufacture and testing of multi-sensor data acquisition system for aero-engine control• Future applications for high temperature electronicsHigh Temperature Electronics Design for Aero Engine Controls and Health Monitoring contains details of state of the art design and manufacture of electronics targeted towards a high temperature aero-engine application. High Temperature Electronics Design for Aero Engine Controls and Health Monitoring is ideal for design, manufacturing and test personnel in the aerospace and other harsh environment industries as well as academic staff and master/research students in electronics engineering, materials science and aerospace engineering
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