Platform-based design, test and fast verification flow for mixed-signal systems on chip

This research is providing methodologies to enhance the design phase from architectural space exploration and system study to verification of the whole mixed-signal system. At the beginning of the work, some innovative digital IPs have been designed to develop efficient signal conditioning for sensor systems on-chip that has been included in commercial products. After this phase, the main focus has been addressed to the creation of a re-usable and versatile test of the device after the tape-out which is close to become one of the major cost factor for ICs companies, strongly linking it to model’s test-benches to avoid re-design phases and multi-environment scenarios, producing a very effective approach to a single, fast and reliable multi-level verification environment. All these works generated different publications in scientific literature. The compound scenario concerning the development of sensor systems is presented in Chapter 1, together with an overview of the related market with a particular focus on the latest MEMS and MOEMS technology devices, and their applications in various segments. Chapter 2 introduces the state of the art for sensor interfaces: the generic sensor interface concept (based on sharing the same electronics among similar applications achieving cost saving at the expense of area and performance loss) versus the Platform Based Design methodology, which overcomes the drawbacks of the classic solution by keeping the generality at the highest design layers and customizing the platform for a target sensor achieving optimized performances. An evolution of Platform Based Design achieved by implementation into silicon of the ISIF (Intelligent Sensor InterFace) platform is therefore presented. ISIF is a highly configurable mixed-signal chip which allows designers to perform an effective design space exploration and to evaluate directly on silicon the system performances avoiding the critical and time consuming analysis required by standard platform based approach. In chapter 3 we describe the design of a smart sensor interface for conditioning next generation MOEMS. The adoption of a new, high performance and high integrated technology allow us to integrate not only a versatile platform but also a powerful ARM processor and various IPs providing the possibility to use the platform not only as a conditioning platform but also as a processing unit for the application. In this chapter a description of the various blocks is given, with a particular emphasis on the IP developed in order to grant the highest grade of flexibility with the minimum area occupation. The architectural space evaluation and the application prototyping with ISIF has enabled an effective, rapid and low risk development of a new high performance platform achieving a flexible sensor system for MEMS and MOEMS monitoring and conditioning. The platform has been design to cover very challenging test-benches, like a laser-based projector device. In this way the platform will not only be able to effectively handle the sensor but also all the system that can be built around it, reducing the needed for further electronics and resulting in an efficient test bench for the algorithm developed to drive the system. The high costs in ASIC development are mainly related to re-design phases because of missing complete top-level tests. Analog and digital parts design flows are separately verified. Starting from these considerations, in the last chapter a complete test environment for complex mixed-signal chips is presented. A semi-automatic VHDL-AMS flow to provide totally matching top-level is described and then, an evolution for fast self-checking test development for both model and real chip verification is proposed. By the introduction of a Python interface, the designer can easily perform interactive tests to cover all the features verification (e.g. calibration and trimming) into the design phase and check them all with the same environment on the real chip after the tape-out. This strategy has been tested on a consumer 3D-gyro for consumer application, in collaboration with SensorDynamics AG

Quality assessment technique for ubiquitous software and middleware

The new paradigm of computing or information systems is ubiquitous computing systems. The technology-oriented issues of ubiquitous computing systems have made researchers pay much attention to the feasibility study of the technologies rather than building quality assurance indices or guidelines. In this context, measuring quality is the key to developing high-quality ubiquitous computing products. For this reason, various quality models have been defined, adopted and enhanced over the years, for example, the need for one recognised standard quality model (ISO/IEC 9126) is the result of a consensus for a software quality model on three levels: characteristics, sub-characteristics, and metrics. However, it is very much unlikely that this scheme will be directly applicable to ubiquitous computing environments which are considerably different to conventional software, trailing a big concern which is being given to reformulate existing methods, and especially to elaborate new assessment techniques for ubiquitous computing environments. This paper selects appropriate quality characteristics for the ubiquitous computing environment, which can be used as the quality target for both ubiquitous computing product evaluation processes ad development processes. Further, each of the quality characteristics has been expanded with evaluation questions and metrics, in some cases with measures. In addition, this quality model has been applied to the industrial setting of the ubiquitous computing environment. These have revealed that while the approach was sound, there are some parts to be more developed in the future

Behavioural simulation of mixed analogue/digital circuits.

Continuing improvements in integrated circuit technology have made possible the implementation of complex electronic systems on a single chip. This often requires both analogue and digital signal processing. It is essential to simulate such IC's during the design process to detect errors at an early stage. Unfortunately, the simulators that are currently available are not well-suited to large mixed-signal circuits. This thesis describes the design and development of a new methodology for simulating analogue and digital components in a single, integrated environment. The methodology represents components as behavioural models that are more efficient than the circuit models used in conventional simulators. The signals that flow between models are all represented as piecewise-linear (PWL) waveforms. Since models representing digital and analogue components use the same format to represent their signals, they can be directly connected together. An object-oriented approach was used to create a class hierarchy to implement the component models. This supports rapid development of new models since all models are derived from a common base class and inherit the methods and attributes defined in their parentc lassesT. he signal objectsa re implementedw ith a similar class hierarchy. The development and validation of models representing various digital, analogue and mixed-signal components are described. Comparisons are made between the accuracy and performance of the proposed methodology and several commercial simulators. The development of a Windows-based demonstrations imulation tool called POISE is also described. This permitted models to be tested independently and multiple models to be connected together to form structural models of complex circuits

Re-use of tests and arguments for assesing dependable mixed-critically systems

The safety assessment of mixed-criticality systems (MCS) is a challenging activity due to system heterogeneity, design constraints and increasing complexity. The foundation for MCSs is the integrated architecture paradigm, where a compact hardware comprises multiple execution platforms and communication interfaces to implement concurrent functions with different safety requirements. Besides a computing platform providing adequate isolation and fault tolerance mechanism, the development of an MCS application shall also comply with the guidelines defined by the safety standards. A way to lower the overall MCS certification cost is to adopt a platform-based design (PBD) development approach. PBD is a model-based development (MBD) approach, where separate models of logic, hardware and deployment support the analysis of the resulting system properties and behaviour. The PBD development of MCSs benefits from a composition of modular safety properties (e.g. modular safety cases), which support the derivation of mixed-criticality product lines. The validation and verification (V&V) activities claim a substantial effort during the development of programmable electronics for safety-critical applications. As for the MCS dependability assessment, the purpose of the V&V is to provide evidences supporting the safety claims. The model-based development of MCSs adds more V&V tasks, because additional analysis (e.g., simulations) need to be carried out during the design phase. During the MCS integration phase, typically hardware-in-the-loop (HiL) plant simulators support the V&V campaigns, where test automation and fault-injection are the key to test repeatability and thorough exercise of the safety mechanisms. This dissertation proposes several V&V artefacts re-use strategies to perform an early verification at system level for a distributed MCS, artefacts that later would be reused up to the final stages in the development process: a test code re-use to verify the fault-tolerance mechanisms on a functional model of the system combined with a non-intrusive software fault-injection, a model to X-in-the-loop (XiL) and code-to-XiL re-use to provide models of the plant and distributed embedded nodes suited to the HiL simulator, and finally, an argumentation framework to support the automated composition and staged completion of modular safety-cases for dependability assessment, in the context of the platform-based development of mixed-criticality systems relying on the DREAMS harmonized platform.La dificultad para evaluar la seguridad de los sistemas de criticidad mixta (SCM) aumenta con la heterogeneidad del sistema, las restricciones de diseño y una complejidad creciente. Los SCM adoptan el paradigma de arquitectura integrada, donde un hardware embebido compacto comprende múltiples plataformas de ejecución e interfaces de comunicación para implementar funciones concurrentes y con diferentes requisitos de seguridad. Además de una plataforma de computación que provea un aislamiento y mecanismos de tolerancia a fallos adecuados, el desarrollo de una aplicación SCM además debe cumplir con las directrices definidas por las normas de seguridad. Una forma de reducir el coste global de la certificación de un SCM es adoptar un enfoque de desarrollo basado en plataforma (DBP). DBP es un enfoque de desarrollo basado en modelos (DBM), en el que modelos separados de lógica, hardware y despliegue soportan el análisis de las propiedades y el comportamiento emergente del sistema diseñado. El desarrollo DBP de SCMs se beneficia de una composición modular de propiedades de seguridad (por ejemplo, casos de seguridad modulares), que facilitan la definición de líneas de productos de criticidad mixta. Las actividades de verificación y validación (V&V) representan un esfuerzo sustancial durante el desarrollo de aplicaciones basadas en electrónica confiable. En la evaluación de la seguridad de un SCM el propósito de las actividades de V&V es obtener las evidencias que apoyen las aseveraciones de seguridad. El desarrollo basado en modelos de un SCM incrementa las tareas de V&V, porque permite realizar análisis adicionales (por ejemplo, simulaciones) durante la fase de diseño. En las campañas de pruebas de integración de un SCM habitualmente se emplean simuladores de planta hardware-in-the-loop (HiL), en donde la automatización de pruebas y la inyección de faltas son la clave para la repetitividad de las pruebas y para ejercitar completamente los mecanismos de tolerancia a fallos. Esta tesis propone diversas estrategias de reutilización de artefactos de V&V para la verificación temprana de un MCS distribuido, artefactos que se emplearán en ulteriores fases del desarrollo: la reutilización de código de prueba para verificar los mecanismos de tolerancia a fallos sobre un modelo funcional del sistema combinado con una inyección de fallos de software no intrusiva, la reutilización de modelo a X-in-the-loop (XiL) y código a XiL para obtener modelos de planta y nodos distribuidos aptos para el simulador HiL y, finalmente, un marco de argumentación para la composición automatizada y la compleción escalonada de casos de seguridad modulares, en el contexto del desarrollo basado en plataformas de sistemas de criticidad mixta empleando la plataforma armonizada DREAMS.Kritikotasun nahastuko sistemen segurtasun ebaluazioa jarduera neketsua da beraien heterogeneotasuna dela eta. Sistema hauen oinarria arkitektura integratuen paradigman datza, non hardware konpaktu batek exekuzio plataforma eta komunikazio interfaze ugari integratu ahal dituen segurtasun baldintza desberdineko funtzio konkurrenteak inplementatzeko. Konputazio plataformek isolamendu eta akatsen aurkako mekanismo egokiak emateaz gain, segurtasun arauek definituriko jarraibideak jarraitu behar dituzte kritikotasun mistodun aplikazioen garapenean. Sistema hauen zertifikazio prozesuaren kostua murrizteko aukera bat plataformetan oinarritutako garapenean (PBD) datza. Garapen planteamendu hau modeloetan oinarrituriko garapena da (MBD) non modeloaren logika, hardware eta garapen desberdinak sistemaren propietateen eta portaeraren aurka aztertzen diren. Kritikotasun mistodun sistemen PBD garapenak etekina ateratzen dio moduluetan oinarrituriko segurtasun propietateei, adibidez: segurtasun kasu modularrak (MSC). Modulu hauek kritikotasun mistodun produktu-lerroak ere hartzen dituzte kontutan. Berifikazio eta balioztatze (V&V) jarduerek esfortzu kontsideragarria eskatzen dute segurtasun-kiritikoetarako elektronika programagarrien garapenean. Kritikotasun mistodun sistemen konfiantzaren ebaluazioaren eta V&V jardueren helburua segurtasun eskariak jasotzen dituzten frogak proportzionatzea da. Kritikotasun mistodun sistemen modelo bidezko garapenek zeregin gehigarriak atxikitzen dizkio V&V jarduerari, fase honetan analisi gehigarriak (hots, simulazioak) zehazten direlako. Bestalde, kritikotasun mistodun sistemen integrazio fasean, hardware-in-the-loop (Hil) simulazio plantek V&V iniziatibak sostengatzen dituzte non testen automatizazioan eta akatsen txertaketan funtsezko jarduerak diren. Jarduera hauek frogen errepikapena eta segurtasun mekanismoak egiaztzea ahalbidetzen dute. Tesi honek V&V artefaktuen berrerabilpenerako estrategiak proposatzen ditu, kritikotasun mistodun sistemen egiaztatze azkarrerako sistema mailan eta garapen prozesuko azken faseetaraino erabili daitezkeenak. Esate baterako, test kodearen berrabilpena akats aurkako mekanismoak egiaztatzeko, modelotik X-in-the-loop (XiL)-ra eta kodetik XiL-rako konbertsioa HiL simulaziorako eta argumentazio egitura bat DREAMS Europear proiektuan definituriko arkitektura estiloan oinarrituriko segurtasun kasu modularrak automatikoki eta gradualki sortzeko

The NASA SBIR product catalog

The purpose of this catalog is to assist small business firms in making the community aware of products emerging from their efforts in the Small Business Innovation Research (SBIR) program. It contains descriptions of some products that have advanced into Phase 3 and others that are identified as prospective products. Both lists of products in this catalog are based on information supplied by NASA SBIR contractors in responding to an invitation to be represented in this document. Generally, all products suggested by the small firms were included in order to meet the goals of information exchange for SBIR results. Of the 444 SBIR contractors NASA queried, 137 provided information on 219 products. The catalog presents the product information in the technology areas listed in the table of contents. Within each area, the products are listed in alphabetical order by product name and are given identifying numbers. Also included is an alphabetical listing of the companies that have products described. This listing cross-references the product list and provides information on the business activity of each firm. In addition, there are three indexes: one a list of firms by states, one that lists the products according to NASA Centers that managed the SBIR projects, and one that lists the products by the relevant Technical Topics utilized in NASA's annual program solicitation under which each SBIR project was selected

Photonic low-cost sensors for in-line fluid monitoring. Design methodology

779 p.The paradigm of process monitoring has evolved in the last years, driven by a clear need for improving efficiency, quality and safety of processes and products. Sectors as manufacturing, energy, food and beverages, etc. are fostering the adoption of innovative methods for controlling their processes and products, in a non-destructive, in-place, reliable, fast, accurate and cost-efficient manner. Furthermore, the parameters requested by the industry for the quality assessment are evolving from basic magnitudes as pressures, temperatures, humidity, etc. to complete chemical and physical fingerprints of these products and processes. In this situation, techniques based on the UV/VIS/NIR light-matter interaction appear to be optimum candidates to face the request of the industry. Moreover, at this moment, when we are witnessing a technological revolution in the field of optoelectronic components, which are required for setting up these light-based analyzers.However, being able to integrate these optoelectronic components with the rest of subsystems (electronics, optics, mechanics, hydraulics, data processing, etc.) is not straightforward. The development of these multi-domain and heterogeneous sensor products meeting not just technological but also market objectives poses a considerable technical and organizational challenge for any company.In this context, a methodological hybrid and agile integration of photonic components within the rest of subsystems towards a sensor product development is presented as the main outcome of the thesis. The methodology has been validated in several industrial scenarios, being three of them included in this thesis, which covers from hydraulic fluid quality control to real-time monitoring of alcoholic beverage fermentation process

Workshop on "Robotic assembly of 3D MEMS".

Proceedings of a workshop proposed in IEEE IROS'2007.The increase of MEMS' functionalities often requires the integration of various technologies used for mechanical, optical and electronic subsystems in order to achieve a unique system. These different technologies have usually process incompatibilities and the whole microsystem can not be obtained monolithically and then requires microassembly steps. Microassembly of MEMS based on micrometric components is one of the most promising approaches to achieve high-performance MEMS. Moreover, microassembly also permits to develop suitable MEMS packaging as well as 3D components although microfabrication technologies are usually able to create 2D and "2.5D" components. The study of microassembly methods is consequently a high stake for MEMS technologies growth. Two approaches are currently developped for microassembly: self-assembly and robotic microassembly. In the first one, the assembly is highly parallel but the efficiency and the flexibility still stay low. The robotic approach has the potential to reach precise and reliable assembly with high flexibility. The proposed workshop focuses on this second approach and will take a bearing of the corresponding microrobotic issues. Beyond the microfabrication technologies, performing MEMS microassembly requires, micromanipulation strategies, microworld dynamics and attachment technologies. The design and the fabrication of the microrobot end-effectors as well as the assembled micro-parts require the use of microfabrication technologies. Moreover new micromanipulation strategies are necessary to handle and position micro-parts with sufficiently high accuracy during assembly. The dynamic behaviour of micrometric objects has also to be studied and controlled. Finally, after positioning the micro-part, attachment technologies are necessary