Characterization of interconnection networks in CMPs using full-system simulation

Los computadores más recientes incluyen complejos chips compuestos de varios procesadores y una cantidad significativa de memoria cache. La tendencia actual consiste en conectar varios nodos, cada uno de ellos con un procesador y uno o más niveles de cache privada y/o compartida, utilizando una red de interconexión. La importancia de esta red está aumentando a medida que crece el número de nodos que se integran en un chip, ya que pueden aparecer cuellos de botella en la comunicación que reduzcan las prestaciones. Además, la red contribuye en gran medida al consumo de energía y área del chip. En este proyecto, comparamos el comportamiento de tres topologías: el anillo bidireccional, la malla y el toro. El anillo es una topología mínima con bajo coste en energía pero peor rendimiento debido a la mayor latencia de comunicación entre nodos. Por otro lado, el toro tiene mayor número de enlaces entre nodos y ofrece mejores prestaciones. La malla ha sido incluida como una opción intermedia altamente popular. Analizaremos también dos topologías de anillo adicionales que aprovechan la reducida área y complejidad del mismo: una con mayor ancho de banda y otra con routers de menor número de ciclos. Modelamos cuidadosamente todos los componentes del sistema (procesadores, jerarquía de memoria y red de interconexión) utilizando simulación de sistema completo. Ejecutamos aplicaciones reales en arquitecturas con 16 y 64 nodos, incluyendo tanto cargas paralelas como multiprogramadas (ejecución de varias aplicaciones independientes). Demostramos que la topología de la red afecta en gran medida al rendimiento en sistemas con 64 nodos. Con las topologías de anillo, los tiempos de ejecución son mucho mayores debido al aumento del número de saltos que le cuesta a un mensaje atravesar la red. El toro es la topología que ofrece mejor rendimiento, pero la elección más óptima sería la malla si tenemos en cuenta también energía y área. Por otro lado, para chips con 16 nodos, las diferencias en rendimiento son menores y un anillo con routers de 3 cyclos ofrece un tiempo de ejecución aceptable con el menor coste en área y energía. Nuestra aportación más significativa está relacionada con la distribución del tráfico en la red. Vemos que el tráfico no está distribuido uniformemente y que los nodos con mayores tasas de inyección varían con la aplicación. Hasta donde nosotros sabemos, no hay ningún trabajo de investigación previo que destaque este comportamiento

Embedded dynamic programming networks for networks-on-chip

PhD ThesisRelentless technology downscaling and recent technological advancements in three dimensional integrated circuit (3D-IC) provide a promising prospect to realize heterogeneous system-on-chip (SoC) and homogeneous chip multiprocessor (CMP) based on the networks-onchip (NoCs) paradigm with augmented scalability, modularity and performance. In many cases in such systems, scheduling and managing communication resources are the major design and implementation challenges instead of the computing resources. Past research efforts were mainly focused on complex design-time or simple heuristic run-time approaches to deal with the on-chip network resource management with only local or partial information about the network. This could yield poor communication resource utilizations and amortize the benefits of the emerging technologies and design methods. Thus, the provision for efficient run-time resource management in large-scale on-chip systems becomes critical. This thesis proposes a design methodology for a novel run-time resource management infrastructure that can be realized efficiently using a distributed architecture, which closely couples with the distributed NoC infrastructure. The proposed infrastructure exploits the global information and status of the network to optimize and manage the on-chip communication resources at run-time. There are four major contributions in this thesis. First, it presents a novel deadlock detection method that utilizes run-time transitive closure (TC) computation to discover the existence of deadlock-equivalence sets, which imply loops of requests in NoCs. This detection scheme, TC-network, guarantees the discovery of all true-deadlocks without false alarms in contrast to state-of-the-art approximation and heuristic approaches. Second, it investigates the advantages of implementing future on-chip systems using three dimensional (3D) integration and presents the design, fabrication and testing results of a TC-network implemented in a fully stacked three-layer 3D architecture using a through-silicon via (TSV) complementary metal-oxide semiconductor (CMOS) technology. Testing results demonstrate the effectiveness of such a TC-network for deadlock detection with minimal computational delay in a large-scale network. Third, it introduces an adaptive strategy to effectively diffuse heat throughout the three dimensional network-on-chip (3D-NoC) geometry. This strategy employs a dynamic programming technique to select and optimize the direction of data manoeuvre in NoC. It leads to a tool, which is based on the accurate HotSpot thermal model and SystemC cycle accurate model, to simulate the thermal system and evaluate the proposed approach. Fourth, it presents a new dynamic programming-based run-time thermal management (DPRTM) system, including reactive and proactive schemes, to effectively diffuse heat throughout NoC-based CMPs by routing packets through the coolest paths, when the temperature does not exceed chip’s thermal limit. When the thermal limit is exceeded, throttling is employed to mitigate heat in the chip and DPRTM changes its course to avoid throttled paths and to minimize the impact of throttling on chip performance. This thesis enables a new avenue to explore a novel run-time resource management infrastructure for NoCs, in which new methodologies and concepts are proposed to enhance the on-chip networks for future large-scale 3D integration.Iraqi Ministry of Higher Education and Scientific Research (MOHESR)

High performance communication on reconfigurable clusters

High Performance Computing (HPC) has matured to where it is an essential third pillar, along with theory and experiment, in most domains of science and engineering. Communication latency is a key factor that is limiting the performance of HPC, but can be addressed by integrating communication into accelerators. This integration allows accelerators to communicate with each other without CPU interactions, and even bypassing the network stack. Field Programmable Gate Arrays (FPGAs) are the accelerators that currently best integrate communication with computation. The large number of Multi-gigabit Transceivers (MGTs) on most high-end FPGAs can provide high-bandwidth and low-latency inter-FPGA connections. Additionally, the reconfigurable FPGA fabric enables tight coupling between computation kernel and network interface. Our thesis is that an application-aware communication infrastructure for a multi-FPGA system makes substantial progress in solving the HPC communication bottleneck. This dissertation aims to provide an application-aware solution for communication infrastructure for FPGA-centric clusters. Specifically, our solution demonstrates application-awareness across multiple levels in the network stack, including low-level link protocols, router microarchitectures, routing algorithms, and applications. We start by investigating the low-level link protocol and the impact of its latency variance on performance. Our results demonstrate that, although some link jitter is always present, we can still assume near-synchronous communication on an FPGA-cluster. This provides the necessary condition for statically-scheduled routing. We then propose two novel router microarchitectures for two different kinds of workloads: a wormhole Virtual Channel (VC)-based router for workloads with dynamic communication, and a statically-scheduled Virtual Output Queueing (VOQ)-based router for workloads with static communication. For the first (VC-based) router, we propose a framework that generates application-aware router configurations. Our results show that, by adding application-awareness into router configuration, the network performance of FPGA clusters can be substantially improved. For the second (VOQ-based) router, we propose a novel offline collective routing algorithm. This shows a significant advantage over a state-of-the-art collective routing algorithm. We apply our communication infrastructure to a critical strong-scaling HPC kernel, the 3D FFT. The experimental results demonstrate that the performance of our design is faster than that on CPUs and GPUs by at least one order of magnitude (achieving strong scaling for the target applications). Surprisingly, the FPGA cluster performance is similar to that of an ASIC-cluster. We also implement the 3D FFT on another multi-FPGA platform: the Microsoft Catapult II cloud. Its performance is also comparable or superior to CPU and GPU HPC clusters. The second application we investigate is Molecular Dynamics Simulation (MD). We model MD on both FPGA clouds and clusters. We find that combining processing and general communication in the same device leads to extremely promising performance and the prospect of MD simulations well into the us/day range with a commodity cloud

SpiNNaker: Fault tolerance in a power- and area- constrained large-scale neuromimetic architecture

AbstractSpiNNaker is a biologically-inspired massively-parallel computer designed to model up to a billion spiking neurons in real-time. A full-fledged implementation of a SpiNNaker system will comprise more than 105 integrated circuits (half of which are SDRAMs and half multi-core systems-on-chip). Given this scale, it is unavoidable that some components fail and, in consequence, fault-tolerance is a foundation of the system design. Although the target application can tolerate a certain, low level of failures, important efforts have been devoted to incorporate different techniques for fault tolerance. This paper is devoted to discussing how hardware and software mechanisms collaborate to make SpiNNaker operate properly even in the very likely scenario of component failures and how it can tolerate system-degradation levels well above those expected

Doctor of Philosophy

dissertationCommunication surpasses computation as the power and performance bottleneck in forthcoming exascale processors. Scaling has made transistors cheap, but on-chip wires have grown more expensive, both in terms of latency as well as energy. Therefore, the need for low energy, high performance interconnects is highly pronounced, especially for long distance communication. In this work, we examine two aspects of the global signaling problem. The first part of the thesis focuses on a high bandwidth asynchronous signaling protocol for long distance communication. Asynchrony among intellectual property (IP) cores on a chip has become necessary in a System on Chip (SoC) environment. Traditional asynchronous handshaking protocol suffers from loss of throughput due to the added latency of sending the acknowledge signal back to the sender. We demonstrate a method that supports end-to-end communication across links with arbitrarily large latency, without limiting the bandwidth, so long as line variation can be reliably controlled. We also evaluate the energy and latency improvements as a result of the design choices made available by this protocol. The use of transmission lines as a physical interconnect medium shows promise for deep submicron technologies. In our evaluations, we notice a lower energy footprint, as well as vastly reduced wire latency for transmission line interconnects. We approach this problem from two sides. Using field solvers, we investigate the physical design choices to determine the optimal way to implement these lines for a given back-end-of-line (BEOL) stack. We also approach the problem from a system designer's viewpoint, looking at ways to optimize the lines for different performance targets. This work analyzes the advantages and pitfalls of implementing asynchronous channel protocols for communication over long distances. Finally, the innovations resulting from this work are applied to a network-on-chip design example and the resulting power-performance benefits are reported

Efficient bypass mechanisms for low latency networks on-chip

RESUMEN: La importancia de las redes en-chip en los procesadores multi-núcleo es cada vez mayor. Los routers con baipás son una solución eficiente para reducir la latencia de estas redes. Existen dos tipos de redes con baipás: single-hop y multi-hop. Las redes con baipás single-hop minimizan la latencia individual de cada router al asignar los recursos del router con antelación a la recepción de los paquetes. Las redes con baipás multi-hop, conocidas como SMART, permiten que los paquetes atraviesen múltiples routers en un único ciclo. La primera propuesta de esta tesis es Non-Empty Buffer Bypass (NEBB), un mecanismo que incrementa la utilización del baipás de tipo single-hop, eliminando la necesidad de usar canales virtuales. Para redes con baipás multi-hop propone SMART++ y S-SMART++. SMART++ elimina la necesidad de SMART de usar una gran cantidad de canales virtuales para aprovechar el ancho de banda de la red, permitiendo el diseño de configuraciones de bajo coste. S-SMART++ hace uso de la asignación de recursos de forma especulativa para preparar el baipás de tipo multi-hop. Este mecanismo reduce la latencia y su dependencia con la longitud máxima de los saltos de tipo multi-hop, aspecto clave para su viabilidad en diseños reales. La contribución final es un conjunto de herramientas de código abierto llamada Bypass Simulation Toolset (BST) compuesto por versiones extendidas de BookSim y OpenSMART, una API para integrar BookSim en otros simuladores y una serie de scripts para facilitar el diseño y evaluación de este tipo de redes.ABSTRACT: Networks on-Chip (NoCs) are becoming more important in many-core processors as the number of cores grows. Bypass routers are an efficient solution that skips pipeline stages. There are two types of bypass mechanisms: single-hop and multi-hop bypass. Single-hop bypass minimizes the router delay by skipping allocation stages in each hop. Multi-hop bypass, called SMART, minimizes the effective number of hops by traversing multiple routers in a single cycle. The first proposal of this dissertation is Non-Empty Buffer Bypass (NEBB) for single-hop bypass, which increases the bypass utilization without requiring VCs to match traditional bypass routers. It proposes SMART++ and S-SMART++ for multi-hop bypass. SMART++ removes the requirement of using multiple VCs of SMART to exploit the bandwidth of the network, enabling low-cost configurations. S-SMART++ relies on speculative allocation to set up multi-hop bypass paths. Thus, it reduces latency and its dependency with the maximum length of multi-hops, relaxing the requirements to integrate multi-hop bypass in real designs. The final contribution is an open-source set of tools to simulate bypass NoCs called Bypass Simulation Toolset (BST) conformed by extended versions of BookSim and OpenSMART, an API to integrate BookSim in other simulators, and scripts to simplify the designing and evaluation of such NoCs.This work was supported by the Spanish Ministry of Science, Innovation and Universities, FPI grant BES-2017-079971, and contracts TIN2010-21291-C02-02, TIN2013- 46957-C2-2-P, TIN2015-65316-P, TIN2016-76635-C2-2-R (AEI/FEDER, UE) and TIC PID2019-105660RB-C22; the European HiPEAC Network of Excellence; the European Community's Seventh Framework Programme (FP7/2007-2013), under the Mont-Blanc 1 and 2 projects (grant agreements n 288777 and 610402); the European Union's Horizon 2020 research and innovation programme under the Mont-Blanc 3 project (grant agreement nº 671697). Bluespec Inc. provided access to Bluespec tools

Cost Effective Routing Implementations for On-chip Networks

Arquitecturas de múltiples núcleos como multiprocesadores (CMP) y soluciones multiprocesador para sistemas dentro del chip (MPSoCs) actuales se basan en la eficacia de las redes dentro del chip (NoC) para la comunicación entre los diversos núcleos. Un diseño eficiente de red dentro del chip debe ser escalable y al mismo tiempo obtener valores ajustados de área, latencia y consumo de energía. Para diseños de red dentro del chip de propósito general se suele usar topologías de malla 2D ya que se ajustan a la distribución del chip. Sin embargo, la aparición de nuevos retos debe ser abordada por los diseñadores. Una mayor probabilidad de defectos de fabricación, la necesidad de un uso optimizado de los recursos para aumentar el paralelismo a nivel de aplicación o la necesidad de técnicas eficaces de ahorro de energía, puede ocasionar patrones de irregularidad en las topologías. Además, el soporte para comunicación colectiva es una característica buscada para abordar con eficacia las necesidades de comunicación de los protocolos de coherencia de caché. En estas condiciones, un encaminamiento eficiente de los mensajes se convierte en un reto a superar. El objetivo de esta tesis es establecer las bases de una nueva arquitectura para encaminamiento distribuido basado en lógica que es capaz de adaptarse a cualquier topología irregular derivada de una estructura de malla 2D, proporcionando así una cobertura total para cualquier caso resultado de soportar los retos mencionados anteriormente. Para conseguirlo, en primer lugar, se parte desde una base, para luego analizar una evolución de varios mecanismos, y finalmente llegar a una implementación, que abarca varios módulos para alcanzar el objetivo mencionado anteriormente. De hecho, esta última implementación tiene por nombre eLBDR (effective Logic-Based Distributed Routing). Este trabajo cubre desde el primer mecanismo, LBDR, hasta el resto de mecanismos que han surgido progresivamente.Rodrigo Mocholí, S. (2010). Cost Effective Routing Implementations for On-chip Networks [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/8962Palanci

Physical parameter-aware Networks-on-Chip design

PhD ThesisNetworks-on-Chip (NoCs) have been proposed as a scalable, reliable and power-efficient communication fabric for chip multiprocessors (CMPs) and multiprocessor systems-on-chip (MPSoCs). NoCs determine both the performance and the reliability of such systems, with a significant power demand that is expected to increase due to developments in both technology and architecture. In terms of architecture, an important trend in many-core systems architecture is to increase the number of cores on a chip while reducing their individual complexity. This trend increases communication power relative to computation power. Moreover, technology-wise, power-hungry wires are dominating logic as power consumers as technology scales down. For these reasons, the design of future very large scale integration (VLSI) systems is moving from being computation-centric to communication-centric. On the other hand, chip’s physical parameters integrity, especially power and thermal integrity, is crucial for reliable VLSI systems. However, guaranteeing this integrity is becoming increasingly difficult with the higher scale of integration due to increased power density and operating frequencies that result in continuously increasing temperature and voltage drops in the chip. This is a challenge that may prevent further shrinking of devices. Thus, tackling the challenge of power and thermal integrity of future many-core systems at only one level of abstraction, the chip and package design for example, is no longer sufficient to ensure the integrity of physical parameters. New designtime and run-time strategies may need to work together at different levels of abstraction, such as package, application, network, to provide the required physical parameter integrity for these large systems. This necessitates strategies that work at the level of the on-chip network with its rising power budget. This thesis proposes models, techniques and architectures to improve power and thermal integrity of Network-on-Chip (NoC)-based many-core systems. The thesis is composed of two major parts: i) minimization and modelling of power supply variations to improve power integrity; and ii) dynamic thermal adaptation to improve thermal integrity. This thesis makes four major contributions. The first is a computational model of on-chip power supply variations in NoCs. The proposed model embeds a power delivery model, an NoC activity simulator and a power model. The model is verified with SPICE simulation and employed to analyse power supply variations in synthetic and real NoC workloads. Novel observations regarding power supply noise correlation with different traffic patterns and routing algorithms are found. The second is a new application mapping strategy aiming vii to minimize power supply noise in NoCs. This is achieved by defining a new metric, switching activity density, and employing a force-based objective function that results in minimizing switching density. Significant reductions in power supply noise (PSN) are achieved with a low energy penalty. This reduction in PSN also results in a better link timing accuracy. The third contribution is a new dynamic thermal-adaptive routing strategy to effectively diffuse heat from the NoC-based threedimensional (3D) CMPs, using a dynamic programming (DP)-based distributed control architecture. Moreover, a new approach for efficient extension of two-dimensional (2D) partially-adaptive routing algorithms to 3D is presented. This approach improves three-dimensional networkon- chip (3D NoC) routing adaptivity while ensuring deadlock-freeness. Finally, the proposed thermal-adaptive routing is implemented in field-programmable gate array (FPGA), and implementation challenges, for both thermal sensing and the dynamic control architecture are addressed. The proposed routing implementation is evaluated in terms of both functionality and performance. The methodologies and architectures proposed in this thesis open a new direction for improving the power and thermal integrity of future NoC-based 2D and 3D many-core architectures

Fail-in-Place Network Design: Interaction Between Topology, Routing Algorithm and Failures

Abstract—The growing system size of high performance com-puters results in a steady decrease of the mean time between failures. Exchanging network components often requires whole system downtime which increases the cost of failures. In this work, we study a fail-in-place strategy where broken network elements remain untouched. We show, that a fail-in-place strategy is feasible for todays networks and the degradation is manageable, and provide guidelines for the design. Our network failure simulation toolchain allows system designers to extrapolate the performance degradation based on expected failure rates, and it can be used to evaluate the current state of a system. In a case study of real-world HPC systems, we will analyze the performance degradation throughout the systems lifetime under the assumption that faulty network components are not repaired, which results in a recommendation to change the used routing algorithm to improve the network performance as well as the fail-in-place characteristic. Keywords—Network design, network simulations, network man-agement, fail-in-place, routing protocols, fault tolerance, availability I