Built-In Self-Test Quality Assessment Using Hardware Fault Emulation in FPGAs

This paper addresses the problem of test quality assessment, namely of BIST solutions, implemented in FPGA and/or in ASIC, through Hardware Fault Emulation (HFE). A novel HFE methodology and tool is proposed, that, using partial reconfiguration, efficiently measures the quality of the BIST solution. The proposed HFE methodology uses Look-Up Tables (LUTs) fault models and is performed using local partial reconfiguration for fault injection on Xilinx(TM) Virtex and/or Spartan FPGA components, with small binary files. For ASIC cores, HFE is used to validate test vector selection to achieve high fault coverage on the physical structure. The methodology is fully automated. Results on ISCAS benchmarks and on an ARM core show that HFE can be orders of magnitude faster than software fault simulation or fully reconfigurable hardware fault emulation

A 64-Channel Mixed-Signal Data Acquisition System for a Solid-State High Efficiency Neutron Detector Array

This thesis presents the design of multiple analog and digital blocks required to implement a desired solid-state data acquisition system for the High Efficiency Neutron Detector Array (HENDA) project under the Spallation Neutron Source (SNS) at Oak Ridge National Laboratory (ORNL). This system encloses and is an extension of prior work described in [1] and [2]. The first prototype chip, named Patara, contained a charge sensitive front-end amplifier [2], and a semi-Gaussian shaper with baseline restore circuitry [1]. Patara III, described in this thesis, involved the addition of the following system components; two comparators, a selectable synchronous/asynchronous digital backend, priority and binary encoders, nine LVDS drivers/receivers, three 8-bit current driven calibration DAC’s, two BGR’s, and a 99-bit serial shift register with channel test-mode circuitry. The design approach for all major blocks will be discussed along with overall system simulations. In addition, the testing procedure and associated measured results will be summarized illustrating a successful system design. This ASIC was fabricated using the Taiwan Semiconductor Manufacturing Company (TSMC) 0.35-μm process available through MOSIS

Low-Overhead Built-In Self-Test for Advanced RF Transceiver Architectures

abstract: Due to high level of integration in RF System on Chip (SOC), the test access points are limited to the baseband and RF inputs/outputs of the system. This limited access poses a big challenge particularly for advanced RF architectures where calibration of internal parameters is necessary and ensure proper operation. Therefore low-overhead built-in Self-Test (BIST) solution for advanced RF transceiver is proposed. In this dissertation. Firstly, comprehensive BIST solution for RF polar transceivers using on-chip resources is presented. In the receiver, phase and gain mismatches degrade sensitivity and error vector magnitude (EVM). In the transmitter, delay skew between the envelope and phase signals and the finite envelope bandwidth can create intermodulation distortion (IMD) that leads to violation of spectral mask requirements. Characterization and calibration of these parameters with analytical model would reduce the test time and cost considerably. Hence, a technique to measure and calibrate impairments of the polar transceiver in the loop-back mode is proposed. Secondly, robust amplitude measurement technique for RF BIST application and BIST circuits for loop-back connection are discussed. Test techniques using analytical model are explained and BIST circuits are introduced. Next, a self-compensating built-in self-test solution for RF Phased Array Mismatch is proposed. In the proposed method, a sinusoidal test signal with unknown amplitude is applied to the inputs of two adjacent phased array elements and measure the baseband output signal after down-conversion. Mathematical modeling of the circuit impairments and phased array behavior indicates that by using two distinct input amplitudes, both of which can remain unknown, it is possible to measure the important parameters of the phased array, such as gain and phase mismatch. In addition, proposed BIST system is designed and fabricated using IBM 180nm process and a prototype four-element phased-array PCB is also designed and fabricated for verifying the proposed method. Finally, process independent gain measurement via BIST/DUT co-design is explained. Design methodology how to reduce performance impact significantly is discussed. Simulation and hardware measurements results for the proposed techniques show that the proposed technique can characterize the targeted impairments accurately.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

Phase Locking Authentication for Scan Architecture

Scan design is a widely used Design for Testability (DfT) approach for digital circuits. It provides a high level of controllability and observability resulting in a high fault coverage. To achieve a high level of testability, scan architecture must provide access to the internal nodes of the circuit-under-test (CUT). This access however leads to vulnerability in the security of the CUT. If an unrestricted access is provided through a scan architecture, unlimited test vectors can be applied to the CUT and its responses can be captured. Such an unrestricted access to the CUT can potentially undermine the security of the critical information stored in the CUT. There is a need to secure scan architecture to prevent hardware attacks however a secure solution may limit the CUT testability. There is a trade-off between security and testability, therefore, a secure scan architecture without hindering its controllability and observability is required. Three solutions to secure scan architecture have been proposed in this thesis. In the first method, the tester is authenticated and the number of authentication attempts has been limited. In the second method, a Phase Locked Loop (PLL) is utilized to secure scan architecture. In the third method, the scan architecture is secured through a clock and data recovery (CDR) technique. This is a manuscript based thesis and the results of this study have been published in two conference proceedings. The latest results have also been prepared as an article for submission to a high rank conference

Built-in-self-test of RF front-end circuitry

Fuelled by the ever increasing demand for wireless products and the advent of deep submicron CMOS, RF ICs have become fairly commonplace in the semiconductor market. This has given rise to a new breed of Systems-On-Chip (SOCs) with RF front-ends tightly integrated along with digital, analog and mixed signal circuitry. However, the reliability of the integrated RF front-end continues to be a matter of significant concern and considerable research. A major challenge to the reliability of RF ICs is the fact that their performance is also severely degraded by wide tolerances in on-chip passives and package parasitics, in addition to process related faults. Due to the absence of contact based testing solutions in embedded RF SOCs (because the very act of probing may affect the performance of the RF circuit), coupled with the presence of very few test access nodes, a Built In Self Test approach (BiST) may prove to be the most efficient test scheme. However due to the associated challenges, a comprehensive and low-overhead BiST methodology for on-chip testing of RF ICs has not yet been reported in literature. In the current work, an approach to RF self-test that has hitherto been unexplored both in literature and in the commercial arena is proposed. A sensitive current monitor has been used to extract variations in the supply current drawn by the circuit-under-test (CUT). These variations are then processed in time and frequency domain to develop signatures. The acquired signatures can then be mapped to specific behavioral anomalies and the locations of these anomalies. The CUT is first excited by simple test inputs that can be generated on-chip. The current monitor extracts the corresponding variations in the supply current of the CUT, thereby creating signatures that map to various performance metrics of the circuit. These signatures can then be post-processed by low overhead on-chip circuitry and converted into an accessible form. To be successful in the RF domain any BIST architecture must be minimally invasive, reliable, offer good fault coverage and present low real estate and power overheads. The current-based self-test approach successfully addresses all these concerns. The technique has been applied to RF Low Noise Amplifiers, Mixers and Voltage Controlled Oscillators. The circuitry and post-processing techniques have also been demonstrated in silicon (using the IBM 0.25 micron RF CMOS process). The entire self-test of the RF front-end can be accomplished with a total test time of approximately 30µs, which is several orders of magnitude better than existing commercial test schemes

Innovative Techniques for Testing and Diagnosing SoCs

We rely upon the continued functioning of many electronic devices for our everyday welfare, usually embedding integrated circuits that are becoming even cheaper and smaller with improved features. Nowadays, microelectronics can integrate a working computer with CPU, memories, and even GPUs on a single die, namely System-On-Chip (SoC). SoCs are also employed on automotive safety-critical applications, but need to be tested thoroughly to comply with reliability standards, in particular the ISO26262 functional safety for road vehicles. The goal of this PhD. thesis is to improve SoC reliability by proposing innovative techniques for testing and diagnosing its internal modules: CPUs, memories, peripherals, and GPUs. The proposed approaches in the sequence appearing in this thesis are described as follows: 1. Embedded Memory Diagnosis: Memories are dense and complex circuits which are susceptible to design and manufacturing errors. Hence, it is important to understand the fault occurrence in the memory array. In practice, the logical and physical array representation differs due to an optimized design which adds enhancements to the device, namely scrambling. This part proposes an accurate memory diagnosis by showing the efforts of a software tool able to analyze test results, unscramble the memory array, map failing syndromes to cell locations, elaborate cumulative analysis, and elaborate a final fault model hypothesis. Several SRAM memory failing syndromes were analyzed as case studies gathered on an industrial automotive 32-bit SoC developed by STMicroelectronics. The tool displayed defects virtually, and results were confirmed by real photos taken from a microscope. 2. Functional Test Pattern Generation: The key for a successful test is the pattern applied to the device. They can be structural or functional; the former usually benefits from embedded test modules targeting manufacturing errors and is only effective before shipping the component to the client. The latter, on the other hand, can be applied during mission minimally impacting on performance but is penalized due to high generation time. However, functional test patterns may benefit for having different goals in functional mission mode. Part III of this PhD thesis proposes three different functional test pattern generation methods for CPU cores embedded in SoCs, targeting different test purposes, described as follows: a. Functional Stress Patterns: Are suitable for optimizing functional stress during I Operational-life Tests and Burn-in Screening for an optimal device reliability characterization b. Functional Power Hungry Patterns: Are suitable for determining functional peak power for strictly limiting the power of structural patterns during manufacturing tests, thus reducing premature device over-kill while delivering high test coverage c. Software-Based Self-Test Patterns: Combines the potentiality of structural patterns with functional ones, allowing its execution periodically during mission. In addition, an external hardware communicating with a devised SBST was proposed. It helps increasing in 3% the fault coverage by testing critical Hardly Functionally Testable Faults not covered by conventional SBST patterns. An automatic functional test pattern generation exploiting an evolutionary algorithm maximizing metrics related to stress, power, and fault coverage was employed in the above-mentioned approaches to quickly generate the desired patterns. The approaches were evaluated on two industrial cases developed by STMicroelectronics; 8051-based and a 32-bit Power Architecture SoCs. Results show that generation time was reduced upto 75% in comparison to older methodologies while increasing significantly the desired metrics. 3. Fault Injection in GPGPU: Fault injection mechanisms in semiconductor devices are suitable for generating structural patterns, testing and activating mitigation techniques, and validating robust hardware and software applications. GPGPUs are known for fast parallel computation used in high performance computing and advanced driver assistance where reliability is the key point. Moreover, GPGPU manufacturers do not provide design description code due to content secrecy. Therefore, commercial fault injectors using the GPGPU model is unfeasible, making radiation tests the only resource available, but are costly. In the last part of this thesis, we propose a software implemented fault injector able to inject bit-flip in memory elements of a real GPGPU. It exploits a software debugger tool and combines the C-CUDA grammar to wisely determine fault spots and apply bit-flip operations in program variables. The goal is to validate robust parallel algorithms by studying fault propagation or activating redundancy mechanisms they possibly embed. The effectiveness of the tool was evaluated on two robust applications: redundant parallel matrix multiplication and floating point Fast Fourier Transform