Analog Performance Prediction Based on Archimedean Copulas Generation Algorithm

International audienceTesting analog circuits is a complex and very time consuming task. In contrary to digital circuits, testing analog circuits needs different configurations, each of them targets a certain set of output parameters which are the performances and the test measures. One of the solutions to simplify the test task and optimize test time is the reduction of the number of to-be-tested performances by eliminating redundant ones. However, the main problem with such a solution is the identification of redundant performances. Traditional methods based on calculation of the correlation between different performances or on the defect level are shown to be not sufficient. This paper presents a new method based on the Archimedean copula generation algorithm. It predicts the performance value from each output parameter value based on the dependence (copula) between the two values. Therefore, different performances can be represented by a single output parameter; as a result, less test configurations are required. To validate the proposed approach, a CMOS imager with two performances and one test measure is used. The simulation results show that the two performances can be replaced by a single test measure. Industrial results are also reported to prove the superiority of the proposed approach

Analog Defect Injection and Fault Simulation Techniques: A Systematic Literature Review

Since the last century, the exponential growth of the semiconductor industry has led to the creation of tiny and complex integrated circuits, e.g., sensors, actuators, and smart power. Innovative techniques are needed to ensure the correct functionality of analog devices that are ubiquitous in every smart system. The ISO 26262 standard for functional safety in the automotive context specifies that fault injection is necessary to validate all electronic devices. For decades, standardization of defect modeling and injection mainly focused on digital circuits and, in a minor part, on analog ones. An initial attempt is being made with the IEEE P2427 draft standard that started to give a structured and formal organization to the analog testing field. Various methods have been proposed in the literature to speed up the fault simulation of the defect universe for an analog circuit. A more limited number of papers seek to reduce the overall simulation time by reducing the number of defects to be simulated. This literature survey describes the state-of-the-art of analog defect injection and fault simulation methods. The survey is based on the Preferred Reporting Items for Systematic Reviews and Meta-Analyses (PRISMA) methodological flow, allowing for a systematic and complete literature survey. Each selected paper has been categorized and presented to provide an overview of all the available approaches. In addition, the limitations of the various approaches are discussed by showing possible future directions

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

A Methodology for Implementing RF BiSTs in Production Testing to Replace RF Conventional Tests

Production testing of Radio Frequency (RF) devices is challenging due to the complex nature of the tests that have to be performed to verify functionality. In this dissertation a methodology to replace the complex and expensive RF functional tests with defect-oriented Built-in Self Tests (BiSTs) is detailed. If a design has sufficient margin to RF specifications then RF tests can be replaced with structural tests using a new data analysis technique called quadrant analysis, which is presented. Data from the analysis of over one million production units of said System on Chip (SoC) is presented along with the results of the analysis. The BiST techniques that have been used are discussed and a Texas Instruments 65 nm RF SoC with a Bluetooth and a FM core was used as a case study. The defect models that were used to develop the BiSTs are discussed as well. The scenario in which a design does not have sufficient margin to specification is also discussed. The data analysis method required in such a case is a regression analysis and the data from such an analysis is shown. The results prove that it is possible to replace expensive RF conventional tests with structural tests and that modern RFCMOS process technology and advances in design like the Digital Radio Processor (DRPTM) technology enable this. The Defective Parts Per Million (DPPM) impact of making this replacement is 27 units and is acceptable for RFCMOS high volume products. Finally, data showing test cost reduction of about 38% that resulted from the elimination of RF conventional tests is presented

Cost modelling and concurrent engineering for testable design

This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.As integrated circuits and printed circuit boards increase in complexity, testing becomes a major cost factor of the design and production of the complex devices. Testability has to be considered during the design of complex electronic systems, and automatic test systems have to be used in order to facilitate the test. This fact is now widely accepted in industry. Both design for testability and the usage of automatic test systems aim at reducing the cost of production testing or, sometimes, making it possible at all. Many design for testability methods and test systems are available which can be configured into a production test strategy, in order to achieve high quality of the final product. The designer has to select from the various options for creating a test strategy, by maximising the quality and minimising the total cost for the electronic system. This thesis presents a methodology for test strategy generation which is based on consideration of the economics during the life cycle of the electronic system. This methodology is a concurrent engineering approach which takes into account all effects of a test strategy on the electronic system during its life cycle by evaluating its related cost. This objective methodology is used in an original test strategy planning advisory system, which allows for test strategy planning for VLSI circuits as well as for digital electronic systems. The cost models which are used for evaluating the economics of test strategies are described in detail and the test strategy planning system is presented. A methodology for making decisions which are based on estimated costing data is presented. Results of using the cost models and the test strategy planning system for evaluating the economics of test strategies for selected industrial designs are presented

Fault-based Analysis of Industrial Cyber-Physical Systems

The fourth industrial revolution called Industry 4.0 tries to bridge the gap between traditional Electronic Design Automation (EDA) technologies and the necessity of innovating in many indus- trial fields, e.g., automotive, avionic, and manufacturing. This complex digitalization process in- volves every industrial facility and comprises the transformation of methodologies, techniques, and tools to improve the efficiency of every industrial process. The enhancement of functional safety in Industry 4.0 applications needs to exploit the studies related to model-based and data-driven anal- yses of the deployed Industrial Cyber-Physical System (ICPS). Modeling an ICPS is possible at different abstraction levels, relying on the physical details included in the model and necessary to describe specific system behaviors. However, it is extremely complicated because an ICPS is com- posed of heterogeneous components related to different physical domains, e.g., digital, electrical, and mechanical. In addition, it is also necessary to consider not only nominal behaviors but even faulty behaviors to perform more specific analyses, e.g., predictive maintenance of specific assets. Nevertheless, these faulty data are usually not present or not available directly from the industrial machinery. To overcome these limitations, constructing a virtual model of an ICPS extended with different classes of faults enables the characterization of faulty behaviors of the system influenced by different faults. In literature, these topics are addressed with non-uniformly approaches and with the absence of standardized and automatic methodologies for describing and simulating faults in the different domains composing an ICPS. This thesis attempts to overcome these state-of-the-art gaps by proposing novel methodologies, techniques, and tools to: model and simulate analog and multi-domain systems; abstract low-level models to higher-level behavioral models; and monitor industrial systems based on the Industrial Internet of Things (IIOT) paradigm. Specifically, the proposed contributions involve the exten- sion of state-of-the-art fault injection practices to improve the ICPSs safety, the development of frameworks for safety operations automatization, and the definition of a monitoring framework for ICPSs. Overall, fault injection in analog and digital models is the state of the practice to en- sure functional safety, as mentioned in the ISO 26262 standard specific for the automotive field. Starting from state-of-the-art defects defined for analog descriptions, new defects are proposed to enhance the IEEE P2427 draft standard for analog defect modeling and coverage. Moreover, dif- ferent techniques to abstract a transistor-level model to a behavioral model are proposed to speed up the simulation of faulty circuits. Therefore, unlike the electrical domain, there is no extensive use of fault injection techniques in the mechanical one. Thus, extending the fault injection to the mechanical and thermal fields allows for supporting the definition and evaluation of more reliable safety mechanisms. Hence, a taxonomy of mechanical faults is derived from the electrical domain by exploiting the physical analogies. Furthermore, specific tools are built for automatically instru- menting different descriptions with multi-domain faults. The entire work is proposed as a basis for supporting the creation of increasingly resilient and secure ICPS that need to preserve functional safety in any operating context

Symbolic tolerance and sensitivity analysis of large scale electronic circuits

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Design, Fabrication and Veri cation of a Mixed-Signal XY Zone Monitoring Circuit and its Application to a Phase Lock Loop Circuit

El presente proyecto de final de carrera se centra en el diseño, análisis e implementación en silicio de una metodología de test/diagnosis basada en la comparación de firmas digitales generadas a partir de curvas de Lissajous. Se muestra su aplicación para testar la etapa de filtro de un circuito de bucle de enganche de fase (phase lock loop, PLL), así como los resultados experimentales de su implementación en tecnología CMOS de 65 nm. La obtención de las firmas digitales se consigue mediante el uso de un circuito monitor, el cual, a partir de la composición de dos señales periódicas del circuito a analizar, genera, para cada punto de la curva de Lissajous, un valor digital. La utilización de varios monitores con gurados de la manera adecuada permite una completa teselación del plano en diferentes zonas y por tanto, la generación de distintos códigos digitales (firma) a medida que la curva de Lissajous evoluciona en el tiempo. El test del circuito y/o diagnosis del posible defecto se realiza mediante la comparación de la signatura golden o sin defecto y la signatura generada por el circuito testado. Para la comparación de firmas se emplea el concepto de distancia de Hamming entre códigos a modo de métrica de discrepancia. A partir de los valores precalculados de la métrica para cada posible valor del defecto se consigue realizar la diagnosis de este para el parámetro en estudio. El trabajo se enmarca en el diseño de circuitos integrados de muy alta escala de integración usando una tecnología CMOS de actualidad (65 nm). Es por ello que se requieren técnicas de diseño analógico específicas, como lo son las estrategias centroidales para la elaboración de layouts o el correcto modelado de transistores nanométricos. Para esto último se hace uso del modelo Berkeley, el cual, debidamente ajustado a la tecnología empleada, proporciona aproximaciones muy aceptables y con relativa facilidad de uso. Con el objetivo de verificar la metodología de test/diagnosis propuesta, se hace uso de una aplicación Matlab que permite simular el comportamiento del circuito a testar en diferentes situaciones. Es posible excitar el circuito con distintas entradas, cambiar los parámetros de este, introducir defectos, o emplear distintos conjuntos de curvas para teselar el plano. La aplicación resulta fundamental para efectuar el proceso de diagnosis pues relaciona la cantidad de defecto con los valores de discrepancia obtenidos con la métrica definida. Finalmente, se presentan los resultados experimentales obtenidos con el chip fabricado. Se constata el correcto comportamiento de este y la validez de la metodología de test/diagnosis propuesta

The Fifth NASA Symposium on VLSI Design

The fifth annual NASA Symposium on VLSI Design had 13 sessions including Radiation Effects, Architectures, Mixed Signal, Design Techniques, Fault Testing, Synthesis, Signal Processing, and other Featured Presentations. The symposium provides insights into developments in VLSI and digital systems which can be used to increase data systems performance. The presentations share insights into next generation advances that will serve as a basis for future VLSI design