Real-Time Fault Detection and Diagnosis Using Intelligent Monitoring and Supervision Systems

In monitoring and supervision schemes, fault detection and diagnosis characterize high efficiency and quality production systems. To achieve such properties, these structures are based on techniques that allow detection and diagnosis of failures in real time. Detection signals faults and diagnostics provide the root cause and location. Fault detection is based on signal and process mathematical models, while fault diagnosis is focused on systems theory and process modeling. Monitoring and supervision complement each other in fault management, thus enabling normal and continuous operation. Its application avoids stopping productive processes by early detection of failures and by applying real-time actions to eliminate them, such as predictive and proactive maintenance based on process conditions. The integration of all these methodologies enables intelligent monitoring and supervision systems, enabling real-time fault detection and diagnosis. Their high performance is associated with statistical decision-making techniques, expert systems, artificial neural networks, fuzzy logic and computational procedures, making them efficient and fully autonomous in making decisions in the real-time operation of a production system

State of AI-based monitoring in smart manufacturing and introduction to focused section

Over the past few decades, intelligentization, supported by artificial intelligence (AI) technologies, has become an important trend for industrial manufacturing, accelerating the development of smart manufacturing. In modern industries, standard AI has been endowed with additional attributes, yielding the so-called industrial artificial intelligence (IAI) that has become the technical core of smart manufacturing. AI-powered manufacturing brings remarkable improvements in many aspects of closed-loop production chains from manufacturing processes to end product logistics. In particular, IAI incorporating domain knowledge has benefited the area of production monitoring considerably. Advanced AI methods such as deep neural networks, adversarial training, and transfer learning have been widely used to support both diagnostics and predictive maintenance of the entire production process. It is generally believed that IAI is the critical technologies needed to drive the future evolution of industrial manufacturing. This article offers a comprehensive overview of AI-powered manufacturing and its applications in monitoring. More specifically, it summarizes the key technologies of IAI and discusses their typical application scenarios with respect to three major aspects of production monitoring: fault diagnosis, remaining useful life prediction, and quality inspection. In addition, the existing problems and future research directions of IAI are also discussed. This article further introduces the papers in this focused section on AI-based monitoring in smart manufacturing by weaving them into the overview, highlighting how they contribute to and extend the body of literature in this area

A data mining approach to incremental adaptive functional diagnosis

This paper presents a novel approach to functional fault diagnosis adopting data mining to exploit knowledge extracted from the system model. Such knowledge puts into relation test outcomes with components failures, to define an incremental strategy for identifying the candidate faulty component. The diagnosis procedure is built upon a set of sorted, possibly approximate, rules that specify given a (set of) failing test, which is the faulty candidate. The procedure iterative selects the most promising rules and requests the execution of the corresponding tests, until a component is identified as faulty, or no diagnosis can be performed. The proposed approach aims at limiting the number of tests to be executed in order to reduce the time and cost of diagnosis. Results on a set of examples show that the proposed approach allows for a significant reduction of the number of executed tests (the average improvement ranges from 32% to 88%)

Paper Session III-A - Artificial Expertise in Systems Engineering

As technology development and engineering problems have grown in complexity, technical systems have evolved to meet these challenges. This evolution has occurred within a foundation of traditional engineering analysis and work processes originating prior to current computer technology. These processes were designed to improvise and compensate for ambiguous design or analysis information. Systems engineering optimization of computer technology applications can eliminate or redesign engineering processes such that the unified system function focuses on innovation, flexibility, speed, and quality. Artificial Expertise for systems engineering refers to the application of artificial intelligence expert systems and shared data bases to promote the integration of cross-functional engineering groups through technical interchange and control mechanisms. This paper presents some conceptual applications and examples for implementing artificial expertise in system development

Innovative Techniques for Testing and Diagnosing SoCs

We rely upon the continued functioning of many electronic devices for our everyday welfare, usually embedding integrated circuits that are becoming even cheaper and smaller with improved features. Nowadays, microelectronics can integrate a working computer with CPU, memories, and even GPUs on a single die, namely System-On-Chip (SoC). SoCs are also employed on automotive safety-critical applications, but need to be tested thoroughly to comply with reliability standards, in particular the ISO26262 functional safety for road vehicles. The goal of this PhD. thesis is to improve SoC reliability by proposing innovative techniques for testing and diagnosing its internal modules: CPUs, memories, peripherals, and GPUs. The proposed approaches in the sequence appearing in this thesis are described as follows: 1. Embedded Memory Diagnosis: Memories are dense and complex circuits which are susceptible to design and manufacturing errors. Hence, it is important to understand the fault occurrence in the memory array. In practice, the logical and physical array representation differs due to an optimized design which adds enhancements to the device, namely scrambling. This part proposes an accurate memory diagnosis by showing the efforts of a software tool able to analyze test results, unscramble the memory array, map failing syndromes to cell locations, elaborate cumulative analysis, and elaborate a final fault model hypothesis. Several SRAM memory failing syndromes were analyzed as case studies gathered on an industrial automotive 32-bit SoC developed by STMicroelectronics. The tool displayed defects virtually, and results were confirmed by real photos taken from a microscope. 2. Functional Test Pattern Generation: The key for a successful test is the pattern applied to the device. They can be structural or functional; the former usually benefits from embedded test modules targeting manufacturing errors and is only effective before shipping the component to the client. The latter, on the other hand, can be applied during mission minimally impacting on performance but is penalized due to high generation time. However, functional test patterns may benefit for having different goals in functional mission mode. Part III of this PhD thesis proposes three different functional test pattern generation methods for CPU cores embedded in SoCs, targeting different test purposes, described as follows: a. Functional Stress Patterns: Are suitable for optimizing functional stress during I Operational-life Tests and Burn-in Screening for an optimal device reliability characterization b. Functional Power Hungry Patterns: Are suitable for determining functional peak power for strictly limiting the power of structural patterns during manufacturing tests, thus reducing premature device over-kill while delivering high test coverage c. Software-Based Self-Test Patterns: Combines the potentiality of structural patterns with functional ones, allowing its execution periodically during mission. In addition, an external hardware communicating with a devised SBST was proposed. It helps increasing in 3% the fault coverage by testing critical Hardly Functionally Testable Faults not covered by conventional SBST patterns. An automatic functional test pattern generation exploiting an evolutionary algorithm maximizing metrics related to stress, power, and fault coverage was employed in the above-mentioned approaches to quickly generate the desired patterns. The approaches were evaluated on two industrial cases developed by STMicroelectronics; 8051-based and a 32-bit Power Architecture SoCs. Results show that generation time was reduced upto 75% in comparison to older methodologies while increasing significantly the desired metrics. 3. Fault Injection in GPGPU: Fault injection mechanisms in semiconductor devices are suitable for generating structural patterns, testing and activating mitigation techniques, and validating robust hardware and software applications. GPGPUs are known for fast parallel computation used in high performance computing and advanced driver assistance where reliability is the key point. Moreover, GPGPU manufacturers do not provide design description code due to content secrecy. Therefore, commercial fault injectors using the GPGPU model is unfeasible, making radiation tests the only resource available, but are costly. In the last part of this thesis, we propose a software implemented fault injector able to inject bit-flip in memory elements of a real GPGPU. It exploits a software debugger tool and combines the C-CUDA grammar to wisely determine fault spots and apply bit-flip operations in program variables. The goal is to validate robust parallel algorithms by studying fault propagation or activating redundancy mechanisms they possibly embed. The effectiveness of the tool was evaluated on two robust applications: redundant parallel matrix multiplication and floating point Fast Fourier Transform

Second CLIPS Conference Proceedings, volume 1

Topics covered at the 2nd CLIPS Conference held at the Johnson Space Center, September 23-25, 1991 are given. Topics include rule groupings, fault detection using expert systems, decision making using expert systems, knowledge representation, computer aided design and debugging expert systems

Uses and applications of artificial intelligence in manufacturing

The purpose of the THESIS is to provide engineers and personnels with a overview of the concepts that underline Artificial Intelligence and Expert Systems. Artificial Intelligence is concerned with the developments of theories and techniques required to provide a computational engine with the abilities to perceive, think and act, in an intelligent manner in a complex environment. Expert system is branch of Artificial Intelligence where the methods of reasoning emulate those of human experts. Artificial Intelligence derives it\u27s power from its ability to represent complex forms of knowledge, some of it common sense, heuristic and symbolic, and the ability to apply the knowledge in searching for solutions. The Thesis will review : The components of an intelligent system, The basics of knowledge representation, Search based problem solving methods, Expert system technologies, Uses and applications of AI in various manufacturing areas like Design, Process Planning, Production Management, Energy Management, Quality Assurance, Manufacturing Simulation, Robotics, Machine Vision etc. Prime objectives of the Thesis are to understand the basic concepts underlying Artificial Intelligence and be able to identify where the technology may be applied in the field of Manufacturing Engineering