Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems

Modern computing: vision and challenges

Over the past six decades, the computing systems field has experienced significant transformations, profoundly impacting society with transformational developments, such as the Internet and the commodification of computing. Underpinned by technological advancements, computer systems, far from being static, have been continuously evolving and adapting to cover multifaceted societal niches. This has led to new paradigms such as cloud, fog, edge computing, and the Internet of Things (IoT), which offer fresh economic and creative opportunities. Nevertheless, this rapid change poses complex research challenges, especially in maximizing potential and enhancing functionality. As such, to maintain an economical level of performance that meets ever-tighter requirements, one must understand the drivers of new model emergence and expansion, and how contemporary challenges differ from past ones. To that end, this article investigates and assesses the factors influencing the evolution of computing systems, covering established systems and architectures as well as newer developments, such as serverless computing, quantum computing, and on-device AI on edge devices. Trends emerge when one traces technological trajectory, which includes the rapid obsolescence of frameworks due to business and technical constraints, a move towards specialized systems and models, and varying approaches to centralized and decentralized control. This comprehensive review of modern computing systems looks ahead to the future of research in the field, highlighting key challenges and emerging trends, and underscoring their importance in cost-effectively driving technological progress

Modern computing: Vision and challenges

Over the past six decades, the computing systems field has experienced significant transformations, profoundly impacting society with transformational developments, such as the Internet and the commodification of computing. Underpinned by technological advancements, computer systems, far from being static, have been continuously evolving and adapting to cover multifaceted societal niches. This has led to new paradigms such as cloud, fog, edge computing, and the Internet of Things (IoT), which offer fresh economic and creative opportunities. Nevertheless, this rapid change poses complex research challenges, especially in maximizing potential and enhancing functionality. As such, to maintain an economical level of performance that meets ever-tighter requirements, one must understand the drivers of new model emergence and expansion, and how contemporary challenges differ from past ones. To that end, this article investigates and assesses the factors influencing the evolution of computing systems, covering established systems and architectures as well as newer developments, such as serverless computing, quantum computing, and on-device AI on edge devices. Trends emerge when one traces technological trajectory, which includes the rapid obsolescence of frameworks due to business and technical constraints, a move towards specialized systems and models, and varying approaches to centralized and decentralized control. This comprehensive review of modern computing systems looks ahead to the future of research in the field, highlighting key challenges and emerging trends, and underscoring their importance in cost-effectively driving technological progress

Self-healing concepts involving fine-grained redundancy for electronic systems

The start of the digital revolution came through the metal-oxide-semiconductor field-effect transistor (MOSFET) in 1959 followed by massive integration onto a silicon die by means of constant down scaling of individual components. Digital systems for certain applications require fault-tolerance against faults caused by temporary or permanent influence. The most widely used technique is triple module redundancy (TMR) in conjunction with a majority voter, which is regarded as a passive fault mitigation strategy. Design by functional resilience has been applied to circuit structures for increased fault-tolerance and towards self-diagnostic triggered self-healing. The focus of this thesis is therefore to develop new design strategies for fault detection and mitigation within transistor, gate and cell design levels. The research described in this thesis makes three contributions. The first contribution is based on adding fine-grained transistor level redundancy to logic gates in order to accomplish stuck-at fault-tolerance. The objective is to realise maximum fault-masking for a logic gate with minimal added redundant transistors. In the case of non-maskable stuck-at faults, the gate structure generates an intrinsic indication signal that is suitable for autonomous self-healing functions. As a result, logic circuitry utilising this design is now able to differentiate between gate faults and faults occurring in inter-gate connections. This distinction between fault-types can then be used for triggering selective self-healing responses. The second contribution is a logic matrix element which applies the three core redundancy concepts of spatial- temporal- and data-redundancy. This logic structure is composed of quad-modular redundant structures and is capable of selective fault-masking and localisation depending of fault-type at the cell level, which is referred to as a spatiotemporal quadded logic cell (QLC) structure. This QLC structure has the capability of cellular self-healing. Through the combination of fault-tolerant and masking logic features the QLC is designed with a fault-behaviour that is equal to existing quadded logic designs using only 33.3% of the equivalent transistor resources. The inherent self-diagnosing feature of QLC is capable of identifying individual faulty cells and can trigger self-healing features. The final contribution is focused on the conversion of finite state machines (FSM) into memory to achieve better state transition timing, minimal memory utilisation and fault protection compared to common FSM designs. A novel implementation based on content-addressable type memory (CAM) is used to achieve this. The FSM is further enhanced by creating the design out of logic gates of the first contribution by achieving stuck-at fault resilience. Applying cross-data parity checking, the FSM becomes equipped with single bit fault detection and correction

Design Space Exploration and Resource Management of Multi/Many-Core Systems

The increasing demand of processing a higher number of applications and related data on computing platforms has resulted in reliance on multi-/many-core chips as they facilitate parallel processing. However, there is a desire for these platforms to be energy-efficient and reliable, and they need to perform secure computations for the interest of the whole community. This book provides perspectives on the aforementioned aspects from leading researchers in terms of state-of-the-art contributions and upcoming trends

Self-adaptivity of applications on network on chip multiprocessors: the case of fault-tolerant Kahn process networks

Technology scaling accompanied with higher operating frequencies and the ability to integrate more functionality in the same chip has been the driving force behind delivering higher performance computing systems at lower costs. Embedded computing systems, which have been riding the same wave of success, have evolved into complex architectures encompassing a high number of cores interconnected by an on-chip network (usually identified as Multiprocessor System-on-Chip). However these trends are hindered by issues that arise as technology scaling continues towards deep submicron scales. Firstly, growing complexity of these systems and the variability introduced by process technologies make it ever harder to perform a thorough optimization of the system at design time. Secondly, designers are faced with a reliability wall that emerges as age-related degradation reduces the lifetime of transistors, and as the probability of defects escaping post-manufacturing testing is increased. In this thesis, we take on these challenges within the context of streaming applications running in network-on-chip based parallel (not necessarily homogeneous) systems-on-chip that adopt the no-remote memory access model. In particular, this thesis tackles two main problems: (1) fault-aware online task remapping, (2) application-level self-adaptation for quality management. For the former, by viewing fault tolerance as a self-adaptation aspect, we adopt a cross-layer approach that aims at graceful performance degradation by addressing permanent faults in processing elements mostly at system-level, in particular by exploiting redundancy available in multi-core platforms. We propose an optimal solution based on an integer linear programming formulation (suitable for design time adoption) as well as heuristic-based solutions to be used at run-time. We assess the impact of our approach on the lifetime reliability. We propose two recovery schemes based on a checkpoint-and-rollback and a rollforward technique. For the latter, we propose two variants of a monitor-controller- adapter loop that adapts application-level parameters to meet performance goals. We demonstrate not only that fault tolerance and self-adaptivity can be achieved in embedded platforms, but also that it can be done without incurring large overheads. In addressing these problems, we present techniques which have been realized (depending on their characteristics) in the form of a design tool, a run-time library or a hardware core to be added to the basic architecture

Factories of the Future

Engineering; Industrial engineering; Production engineerin

Smart Manufacturing

This book is a collection of 11 articles that are published in the corresponding Machines Special Issue “Smart Manufacturing”. It represents the quality, breadth and depth of the most updated study in smart manufacturing (SM); in particular, digital technologies are deployed to enhance system smartness by (1) empowering physical resources in production, (2) utilizing virtual and dynamic assets over the Internet to expand system capabilities, (3) supporting data-driven decision-making activities at various domains and levels of businesses, or (4) reconfiguring systems to adapt to changes and uncertainties. System smartness can be evaluated by one or a combination of performance metrics such as degree of automation, cost-effectiveness, leanness, robustness, flexibility, adaptability, sustainability, and resilience. This book features, firstly, the concepts digital triad (DT-II) and Internet of digital triad things (IoDTT), proposed to deal with the complexity, dynamics, and scalability of complex systems simultaneously. This book also features a comprehensive survey of the applications of digital technologies in space instruments; a systematic literature search method is used to investigate the impact of product design and innovation on the development of space instruments. In addition, the survey provides important information and critical considerations for using cutting edge digital technologies in designing and manufacturing space instruments

Cross-layer fault tolerance in networks-on-chip

The design of Networks-on-Chip follows the Open Systems Interconnection (OSI) reference model. The OSI model defines strictly separated network abstraction layers and specifies their functionality. Each layer has layer-specific information about the network that can be exclusively accessed by the methods of the layer. Adhering to the strict layer boundaries, however, leads to methods of the individual layers working in isolation from each other. This lack of interaction between methods is disadvantageous for fault diagnosis and fault tolerance in Networks-on-Chip as it results in solutions that have a high effort in terms of the time and implementation costs required to deal with faults. For Networks-on-Chip cross-layer design is considered as a promising method to remedy these shortcomings. It removes the strict layer boundaries by the exchange of information between layers. This interaction enables methods of different layers to cooperate, and thus, deal with faults more efficiently. Furthermore, providing lower layer information to the software allows hardware methods to be implemented as software tasks resulting in a reduction of the hardware complexity. The goal of this dissertation is the investigation of cross-layer design for fault diagnosis and fault tolerance in Networks-on-Chip. For fault diagnosis a scheme is proposed that allows the interaction of protocol-based diagnosis of the transport layer with functional diagnosis of the network layer and structural diagnosis of the physical layer by exchanging diagnostic information. The techniques use this information for optimizing their own diagnosis process. For protocol-based diagnosis on the transport layer, a diagnosis protocol is proposed that is able to locate faulty links, switches, and crossbar connections. For this purpose, the technique utilizes available information of lower layers. As proof of concept for the proposed interaction scheme, the diagnosis protocol is combined with a functional and a structural diagnosis approach and the performance and diagnosis quality of the resulting combinations is investigated. The results show that the combinations of the diagnosis protocol with one of the lower layer techniques have a considerably reduced fault localization latency compared to the functional and the structural standalone techniques. This reduction, however, comes at the expense of a reduced diagnosis quality. In terms of fault tolerance, the focus of this dissertation is on the design and implementation of cross-layer approaches utilizing software methods to provide fault tolerance for network layer routings. Two approaches for different routings are presented. The requirements to provide information of lower layers to the software using the available Network-on-Chip resources and interfaces for data communication are discussed. The concepts of two mechanisms of the data link layer are presented for converting status information into communicable units and for preventing communication resources from being blocked. In the first approach, software-based packet rerouting is proposed. By incorporating information from different layers, this approach provides fault tolerance for deterministic network layer routings. As specialization of software-based rerouting, dimension-order XY rerouting is presented. In the second approach, a reconfigurable routing for Networks-on-Chip with logical hierarchy is proposed in which cross-layer interaction is used to enable hierarchical units to manage themselves autonomously and to reconfigure the routing. Both approaches are evaluated regarding their performance as well as their implementation costs. In a final study, the cross-layer diagnosis technique and cross-layer fault tolerance approaches are combined. The information obtained by the diagnosis technique is used by the fault tolerance approaches for packet rerouting or for routing reconfiguration. The combinations are evaluated regarding their impact on Networks-on-Chip performance. The results show that the crosslayer information exchange with software has a considerable impact on performance when the amount of information becomes too large. In case of crosslayer diagnosis, however, the impact on Networks-on-Chip performance is significantly lower compared to functional and structural diagnosis