Point-to-point connectivity between neuromorphic chips using address events

This paper discusses connectivity between neuromorphic chips, which use the timing of fixed-height fixed-width pulses to encode information. Address-events (log2 (N)-bit packets that uniquely identify one of N neurons) are used to transmit these pulses in real time on a random-access time-multiplexed communication channel. Activity is assumed to consist of neuronal ensembles--spikes clustered in space and in time. This paper quantifies tradeoffs faced in allocating bandwidth, granting access, and queuing, as well as throughput requirements, and concludes that an arbitered channel design is the best choice.The arbitered channel is implemented with a formal design methodology for asynchronous digital VLSI CMOS systems, after introducing the reader to this top-down synthesis technique. Following the evolution of three generations of designs, it is shown how the overhead of arbitrating, and encoding and decoding, can be reduced in area (from N to √N) by organizing neurons into rows and columns, and reduced in time (from log2 (N) to 2) by exploiting locality in the arbiter tree and in the row–column architecture, and clustered activity. Throughput is boosted by pipelining and by reading spikes in parallel. Simple techniques that reduce crosstalk in these mixed analog–digital systems are described

Multipath Router Architectures to Reduce Latency in Network-on-Chips

The low latency is a prime concern for large Network-on-Chips (NoCs) typically used in chip-multiprocessors (CMPs) and multiprocessor system-on-chips (MPSoCs). A significant component of overall latency is the serialization delay for applications which have long packets such as typical video stream traffic. To address the serialization latency, we propose to exploit the inherent path diversity available in a typical 2-D Mesh with our two novel router architectures, Dual-path router and Dandelion router. We observe that, in a 2-D mesh, for any source-destination pair, there are two minimal paths along the edges of the bounding box. We call it XY Dimension Order Routing (DOR) and YX DOR. There are also two non-minimal paths which are non-coinciding and out of the bounding box created by XY and YX DOR paths. Dual-path Router implements two injection and two ejection ports for parallel packet injection through two minimal paths. Packets are split into two halves and injected simultaneously into the network. Dandelion router implements four injection and ejection ports for parallel packet injection. Packets are split into smaller sub-packets and are injected simultaneously in all possible directions which typically include two minimal paths and two non-minimal paths. When all the sub-packets reach the destination, they are eventually recombined. We find that our technique significantly increases the throughput and reduces the serialization latency and hence overall latency of long packets. We explore the impact of Dual-path and Dandelion on various packet lengths in order to prove the advantage of our routers over the baseline. We further implement different deadlock free disjoint path models for Dandelion and develop a switching mechanism between Dual-path and Dandelion based on the traffic congestion

Design and modelling of variability tolerant on-chip communication structures for future high performance system on chip designs

The incessant technology scaling has enabled the integration of functionally complex System-on-Chip (SoC) designs with a large number of heterogeneous systems on a single chip. The processing elements on these chips are integrated through on-chip communication structures which provide the infrastructure necessary for the exchange of data and control signals, while meeting the strenuous physical and design constraints. The use of vast amounts of on chip communications will be central to future designs where variability is an inherent characteristic. For this reason, in this thesis we investigate the performance and variability tolerance of typical on-chip communication structures. Understanding of the relationship between variability and communication is paramount for the designers; i.e. to devise new methods and techniques for designing performance and power efficient communication circuits in the forefront of challenges presented by deep sub-micron (DSM) technologies. The initial part of this work investigates the impact of device variability due to Random Dopant Fluctuations (RDF) on the timing characteristics of basic communication elements. The characterization data so obtained can be used to estimate the performance and failure probability of simple links through the methodology proposed in this work. For the Statistical Static Timing Analysis (SSTA) of larger circuits, a method for accurate estimation of the probability density functions of different circuit parameters is proposed. Moreover, its significance on pipelined circuits is highlighted. Power and area are one of the most important design metrics for any integrated circuit (IC) design. This thesis emphasises the consideration of communication reliability while optimizing for power and area. A methodology has been proposed for the simultaneous optimization of performance, area, power and delay variability for a repeater inserted interconnect. Similarly for multi-bit parallel links, bandwidth driven optimizations have also been performed. Power and area efficient semi-serial links, less vulnerable to delay variations than the corresponding fully parallel links are introduced. Furthermore, due to technology scaling, the coupling noise between the link lines has become an important issue. With ever decreasing supply voltages, and the corresponding reduction in noise margins, severe challenges are introduced for performing timing verification in the presence of variability. For this reason an accurate model for crosstalk noise in an interconnection as a function of time and skew is introduced in this work. This model can be used for the identification of skew condition that gives maximum delay noise, and also for efficient design verification

Driving the Network-on-Chip Revolution to Remove the Interconnect Bottleneck in Nanoscale Multi-Processor Systems-on-Chip

The sustained demand for faster, more powerful chips has been met by the availability of chip manufacturing processes allowing for the integration of increasing numbers of computation units onto a single die. The resulting outcome, especially in the embedded domain, has often been called SYSTEM-ON-CHIP (SoC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MP-SoC). MPSoC design brings to the foreground a large number of challenges, one of the most prominent of which is the design of the chip interconnection. With a number of on-chip blocks presently ranging in the tens, and quickly approaching the hundreds, the novel issue of how to best provide on-chip communication resources is clearly felt. NETWORKS-ON-CHIPS (NoCs) are the most comprehensive and scalable answer to this design concern. By bringing large-scale networking concepts to the on-chip domain, they guarantee a structured answer to present and future communication requirements. The point-to-point connection and packet switching paradigms they involve are also of great help in minimizing wiring overhead and physical routing issues. However, as with any technology of recent inception, NoC design is still an evolving discipline. Several main areas of interest require deep investigation for NoCs to become viable solutions: • The design of the NoC architecture needs to strike the best tradeoff among performance, features and the tight area and power constraints of the onchip domain. • Simulation and verification infrastructure must be put in place to explore, validate and optimize the NoC performance. • NoCs offer a huge design space, thanks to their extreme customizability in terms of topology and architectural parameters. Design tools are needed to prune this space and pick the best solutions. • Even more so given their global, distributed nature, it is essential to evaluate the physical implementation of NoCs to evaluate their suitability for next-generation designs and their area and power costs. This dissertation performs a design space exploration of network-on-chip architectures, in order to point-out the trade-offs associated with the design of each individual network building blocks and with the design of network topology overall. The design space exploration is preceded by a comparative analysis of state-of-the-art interconnect fabrics with themselves and with early networkon- chip prototypes. The ultimate objective is to point out the key advantages that NoC realizations provide with respect to state-of-the-art communication infrastructures and to point out the challenges that lie ahead in order to make this new interconnect technology come true. Among these latter, technologyrelated challenges are emerging that call for dedicated design techniques at all levels of the design hierarchy. In particular, leakage power dissipation, containment of process variations and of their effects. The achievement of the above objectives was enabled by means of a NoC simulation environment for cycleaccurate modelling and simulation and by means of a back-end facility for the study of NoC physical implementation effects. Overall, all the results provided by this work have been validated on actual silicon layout

On Energy Efficient Computing Platforms

In accordance with the Moore's law, the increasing number of on-chip integrated transistors has enabled modern computing platforms with not only higher processing power but also more affordable prices. As a result, these platforms, including portable devices, work stations and data centres, are becoming an inevitable part of the human society. However, with the demand for portability and raising cost of power, energy efficiency has emerged to be a major concern for modern computing platforms. As the complexity of on-chip systems increases, Network-on-Chip (NoC) has been proved as an efficient communication architecture which can further improve system performances and scalability while reducing the design cost. Therefore, in this thesis, we study and propose energy optimization approaches based on NoC architecture, with special focuses on the following aspects. As the architectural trend of future computing platforms, 3D systems have many bene ts including higher integration density, smaller footprint, heterogeneous integration, etc. Moreover, 3D technology can signi cantly improve the network communication and effectively avoid long wirings, and therefore, provide higher system performance and energy efficiency. With the dynamic nature of on-chip communication in large scale NoC based systems, run-time system optimization is of crucial importance in order to achieve higher system reliability and essentially energy efficiency. In this thesis, we propose an agent based system design approach where agents are on-chip components which monitor and control system parameters such as supply voltage, operating frequency, etc. With this approach, we have analysed the implementation alternatives for dynamic voltage and frequency scaling and power gating techniques at different granularity, which reduce both dynamic and leakage energy consumption. Topologies, being one of the key factors for NoCs, are also explored for energy saving purpose. A Honeycomb NoC architecture is proposed in this thesis with turn-model based deadlock-free routing algorithms. Our analysis and simulation based evaluation show that Honeycomb NoCs outperform their Mesh based counterparts in terms of network cost, system performance as well as energy efficiency.Siirretty Doriast

Quarc: an architecture for efficient on-chip communication

The exponential downscaling of the feature size has enforced a paradigm shift from computation-based design to communication-based design in system on chip development. Buses, the traditional communication architecture in systems on chip, are incapable of addressing the increasing bandwidth requirements of future large systems. Networks on chip have emerged as an interconnection architecture offering unique solutions to the technological and design issues related to communication in future systems on chip. The transition from buses as a shared medium to networks on chip as a segmented medium has given rise to new challenges in system on chip realm. By leveraging the shared nature of the communication medium, buses have been highly efficient in delivering multicast communication. The segmented nature of networks, however, inhibits the multicast messages to be delivered as efficiently by networks on chip. Relying on extensive research on multicast communication in parallel computers, several network on chip architectures have offered mechanisms to perform the operation, while conforming to resource constraints of the network on chip paradigm. Multicast communication in majority of these networks on chip is implemented by establishing a connection between source and all multicast destinations before the message transmission commences. Establishing the connections incurs an overhead and, therefore, is not desirable; in particular in latency sensitive services such as cache coherence. To address high performance multicast communication, this research presents Quarc, a novel network on chip architecture. The Quarc architecture targets an area-efficient, low power, high performance implementation. The thesis covers a detailed representation of the building blocks of the architecture, including topology, router and network interface. The cost and performance comparison of the Quarc architecture against other network on chip architectures reveals that the Quarc architecture is a highly efficient architecture. Moreover, the thesis introduces novel performance models of complex traffic patterns, including multicast and quality of service-aware communication