Quantum transport through MoS2_2 constrictions defined by photodoping

We present a device scheme to explore mesoscopic transport through molybdenum disulfide (MoS$_2$) constrictions using photodoping. The devices are based on van-der-Waals heterostructures where few-layer MoS$_2$ flakes are partially encapsulated by hexagonal boron nitride (hBN) and covered by a few-layer graphene flake to fabricate electrical contacts. Since the as-fabricated devices are insulating at low temperatures, we use photo-induced remote doping in the hBN substrate to create free charge carriers in the MoS$_2$ layer. On top of the device, we place additional metal structures, which define the shape of the constriction and act as shadow masks during photodoping of the underlying MoS$_2$/hBN heterostructure. Low temperature two- and four-terminal transport measurements show evidence of quantum confinement effects.Comment: 9 pages, 6 figure

Memristor MOS Content Addressable Memory (MCAM): Hybrid Architecture for Future High Performance Search Engines

Large-capacity Content Addressable Memory (CAM) is a key element in a wide variety of applications. The inevitable complexities of scaling MOS transistors introduce a major challenge in the realization of such systems. Convergence of disparate technologies, which are compatible with CMOS processing, may allow extension of Moore's Law for a few more years. This paper provides a new approach towards the design and modeling of Memristor (Memory resistor) based Content Addressable Memory (MCAM) using a combination of memristor MOS devices to form the core of a memory/compare logic cell that forms the building block of the CAM architecture. The non-volatile characteristic and the nanoscale geometry together with compatibility of the memristor with CMOS processing technology increases the packing density, provides for new approaches towards power management through disabling CAM blocks without loss of stored data, reduces power dissipation, and has scope for speed improvement as the technology matures.Comment: 10 pages, 11 figure

RTS amplitudes in decananometer MOSFETs: 3-D simulation study

In this paper we study the amplitudes of random telegraph signals (RTS) associated with the trapping of a single electron in defect states at the Si/SiO/sub 2/ interface of sub-100-nm (decananometer) MOSFETs employing three-dimensional (3-D) "atomistic" simulations. Both continuous doping charge and random discrete dopants in the active region of the MOSFETs are considered in the simulations. The dependence of the RTS amplitudes on the position of the trapped charge in the channel and on device design parameters such as dimensions, oxide thickness and channel doping concentration is studied in detail. The 3-D simulations offer a natural explanation for the large variation in the RTS amplitudes measured experimentally in otherwise identical MOSFETs. The random discrete dopant simulations result in RTS amplitudes several times higher compared to continuous charge simulations. They also produce closer to the experimentally observed distributions of the RTS amplitudes. The results highlight the significant impact of single charge trapping in the next generation decananometer MOSFETs

Oxidation of gallium arsenide in a plasma multipole device. Study of the MOS structures obtained

The oxygen plasma oxidation of GaAs was studied in order to obtain extremely high frequency responses with MOS devices. In the multipole system a homogeneous oxygen plasma of high density can easily be obtained in a large volume. This system is thus convenient for the study of plasma oxidation of GaAs. The electrical properties of the MOS diodes obtained in this way are controlled by interface states, located mostly in the upper half of the band gap where densities in the 10 to the 13th power/(sq cm) (eV) range can be estimated. Despite these interface states the possibility of fabricating MOSFET transistors working mostly in the depletion mode for a higher frequency cut-off still exists

Electron Mobility and Magneto Transport Study of Ultra-Thin Channel Double-Gate Si MOSFETs

We report on detailed room temperature and low temperature transport properties of double-gate Si MOSFETs with the Si well thickness in the range 7-17 nm. The devices were fabricated on silicon-on-insulator wafers utilizing wafer bonding, which enabled us to use heavily doped metallic back gate. We observe mobility enhancement effects at symmetric gate bias at room temperature, which is the finger print of the volume inversion/accumulation effect. An asymmetry in the mobility is detected at 300 K and at 1.6 K between the top and back interfaces of the Si well, which is interpreted to arise from different surface roughnesses of the interfaces. Low temperature peak mobilities of the reported devices scale monotonically with Si well thickness and the maximum low temperature mobility was 1.9 m2/Vs, which was measured from a 16.5 nm thick device. In the magneto transport data we observe single and two sub-band Landau level filling factor behavior depending on the well thickness and gate biasing

Engineering study for a mass memory system for advanced spacecrafts Final report, 1 Dec. 1969 - 1 Jul. 1970

Mass memory system for advanced spacecraf

Increase in the random dopant induced threshold fluctuations and lowering in sub-100 nm MOSFETs due to quantum effects: a 3-D density-gradient simulation study

In this paper, we present a detailed simulation study of the influence of quantum mechanical effects in the inversion layer on random dopant induced threshold voltage fluctuations and lowering in sub-100 mn MOSFETs. The simulations have been performed using a three-dimensional (3-D) implementation of the density gradient (DG) formalism incorporated in our established 3-D atomistic simulation approach. This results in a self-consistent 3-D quantum mechanical picture, which implies not only the vertical inversion layer quantization but also the lateral confinement effects related to current filamentation in the “valleys” of the random potential fluctuations. We have shown that the net result of including quantum mechanical effects, while considering statistical dopant fluctuations, is an increase in both threshold voltage fluctuations and lowering. At the same time, the random dopant induced threshold voltage lowering partially compensates for the quantum mechanical threshold voltage shift in aggressively scaled MOSFETs with ultrathin gate oxides