Subthreshold Modeling and Simulation of Silicon Nanotube Field Effect Transistors (SiNTFETs)

The MOS technologies with low device geometry and new architectures have accelerated the pace of computational technology. In order to uphold the challenges of scaling in sub 20nm regime and meet the aggressive specifications of ITRS, a novel and non-conventional devices have to intervene. So came the ultimate solution- Silicon Nanotube Field Effect Transistor (SiNTFET) with its unique architecture which enhances the electrical characteristics of the device and the performance. In this work, an analytical model of surface potential and threshold voltage for SiNTFETs are developed. The two dimensional poisson’s equation with a cylindrical coordinate system, has been evaluated to find surface potential. The concentration of the inversion charge has been evaluated in the channel in subthreshold regime using the surface potential equation and the Boltzmann equation. The threshold voltage of the device is stated as the gate voltage for which the calculated inversion charge equals the threshold charge. Assuming this definition, the threshold voltage of the device for different channel lengths is mathematically modeled. The effect on threshold voltage by the variation of physical parameters is detailed analysed. The physical parameters include gate oxide thickness, tube thickness and core thickness. The effects of DIBL and voltage roll-off are discussed. The model results are verified with the simulation results obtained by using device simulator, ATLASTM. It is observed that for short channel lengths (<30nm), the model values vary from the simulated data; that is because the quantum mechanical effects are neglected during modeling which are vital in those channel lengths. The objective of the work is to provide a basic model for threshold voltage of the SiNTFET. The electrical characteristics show that device has a potential to set a new technology road map and meet the ULSI application

Downscaling of 0.35 J.lm to 0.25 J.lm CMOS Transistor by Simulation

Silicon (Si) based integrated circuit (IC) has become the backbone of today's semiconductor world with MOS transistors as its fundamental building blocks. The integrated circuit complexity has moved from the early small-scale integration (SSI) to ultra-large-scale integration (ULSI) that can accommodate millions of transistors on a single chip. This evolution is primarily attributed to the concept of device miniaturization. The resulting scaledown devices do not only improve the packing density but also exhibit enhanced performance in terms of faster switching speed and lower power dissipation. The objective of this work is to perform downscaling of 0.35 Jll11 to 0.25 Jll11 CMOS transistor using Silvaco 2-D ATHENA and ATLAS simulation tool. A "two-step design" approach is proposed in this work to study the feasibility of miniaturization process by scaling method. A scaling factor, K of 1.4 (derived from direct division of 0.35 with 0.25) is adopted for selected parameters. The first design step involves a conversion of the physical data of 0.35 Jll11 CMOS technology to the simulated environment, where process recipe acquired from UC Berkeley Microfabrication Lab serves as the design basis. The electrical data for the simulated structure of 0.35 11m CMOS was extracted with the use of the device simulator. Using the simulated, optimized 0.35 Jll11 structure, downscaling to a smaller geometry of 0.25 Jll11 CMOS transistor was carried out and subsequent electrical characterization was performed in order to evaluate its performance. Parameters that are monitored to evaluate the performance of the designed 0.25 Jll11 CMOS transistor include threshold voltage (VtJJ, saturation current (ldsaJ, off-state leakage current (Ion) and subthreshold swing (SJ. From the simulation, the V1h obtained is of 0.51 V and -0.4 V for NMOS and PMOS respectively, with a difference of 15%-33% as compared to other reported work. However, for results of Idsat. the values obtained which is of 296 ~-tAIJll11 for NMOS and 181 J.lA/Jll11 for PMOS is much lower than other reported work by 28%-50%. This is believed to be due to direct scaling of 0.25 Jll11 transistor from the 0.35 11m geometry without alterations on the existing structure. For Ioffand St. both results show a much better value as compared to other work. I off obtained which is of <1 0 pA/J.lm is about 80%-96% lower than the maximum allowable specification. As for S1, the values obtained which is <90 mY/dec is only within 5% differences as compared to specification. In overall, these results (except for Idsat) accepted values for the particular 0.25 J..Lm technology. From this work, the capability to perform device miniaturization from 0.35 J..Lffi to 0.25 J..Lffi has been developed. This is achieved by acquiring the technical know-how on the important aspects of simulation required for successful simulation of 0.35 J..Lffi technology. Ultimately, the outcome of this work which is a simulated 0.25 J..Lm CMOS transistor can be used as a basis for scaling down to a much smaller device, namely towards 90-nrn geometry

Tunnel Field Effect Transistors:from Steep-Slope Electronic Switches to Energy Efficient Logic Applications

The aim of this work has been the investigation of homo-junction Tunnel Field Effect Transistors starting from a compact modelling perspective to its possible applications. Firstly a TCAD based simulation study is done to explain the main device characteristics. The main differences of a Tunnel FET with respect to a conventional MOSFET is pointed out and the differences have been explained. A compact DC/AC model has been developed which is capable of describing the I-V characteristics in all regimes of operation. The model takes in to account ambi-polarity, drain side breakdown and all tunneling related physics. A temperature dependence is also added to the model to study the temperature independent behavior of tunneling. The model was further implemented in a Verilog-A based circuit simulator. Following calibration to experimental results of Silicon and strained-Silicon TFETs, the model has been also used to benchmark against a standard CMOS node for digital and analog applications. The circuits built with Tunnel FETs showed interesting temperature behavior which was superior to the compared CMOS node. In the same work, we also explore and propose solutions for using TFETs for low power memory applications. Both volatile and non-volatile memory concepts are investigated and explored. The application of a Tunnel FET as a capacitor-less memory has been experimentally demonstrated for the first time. New device concepts have been proposed and process flows for the same are developed to realize them in the clean room in EPFL

Spin-On Glass: Materials and Applications in Advanced IC Technologies

This thesis deals with the study of shallow PN junction formation by dopant diffusion from Spin-On Glass (SOG) for future deep sub-micron BiCMOS technology. With the advantages of no transient enhanced diffusion and no metal contamination, diffusion from highly doped SOG (also called spin-on dopant - SOD) is a good technology for shallow junction formation. In this thesis, diffusion of impurities from SOD into Si and polysilicon on silicon structure has been studied. This shallow junction formation technique using SOD has been applied in realisation of two important devices, i.e. high frequency bipolar transistor and deep sub-micron elevated source/drain MOSFET

Journal of Telecommunications and Information Technology, 2000, nr 3,4

kwartalni

Simulation study of scaling design, performance characterization, statistical variability and reliability of decananometer MOSFETs

This thesis describes a comprehensive, simulation based scaling study – including device design, performance characterization, and the impact of statistical variability – on deca-nanometer bulk MOSFETs. After careful calibration of fabrication processes and electrical characteristics for n- and p-MOSFETs with 35 nm physical gate length, 1 nm EOT and stress engineering, the simulated devices closely match the performance of contemporary 45 nm CMOS technologies. Scaling to 25 nm, 18 nm and 13 nm gate length n and p devices follows generalized scaling rules, augmented by physically realistic constraints and the introduction of high-k/metal-gate stacks. The scaled devices attain the performance stipulated by the ITRS. Device a.c. performance is analyzed, at device and circuit level. Extrinsic parasitics become critical to nano-CMOS device performance. The thesis describes device capacitance components, analyzes the CMOS inverter, and obtains new insights into the inverter propagation delay in nano-CMOS. The projection of a.c. performance of scaled devices is obtained. The statistical variability of electrical characteristics, due to intrinsic parameter fluctuation sources, in contemporary and scaled decananometer MOSFETs is systematically investigated for the first time. The statistical variability sources: random discrete dopants, gate line edge roughness and poly-silicon granularity are simulated, in combination, in an ensemble of microscopically different devices. An increasing trend in the standard deviation of the threshold voltage as a function of scaling is observed. The introduction of high-k/metal gates improves electrostatic integrity and slows this trend. Statistical evaluations of variability in Ion and Ioff as a function of scaling are also performed. For the first time, the impact of strain on statistical variability is studied. Gate line edge roughness results in areas of local channel shortening, accompanied by locally increased strain, both effects increasing the local current. Variations are observed in both the drive current, and in the drive current enhancement normally expected from the application of strain. In addition, the effects of shallow trench isolation (STI) on MOSFET performance and on its statistical variability are investigated for the first time. The inverse-narrow-width effect of STI enhances the current density adjacent to it. This leads to a local enhancement of the influence of junction shapes adjacent to the STI. There is also a statistical impact on the threshold voltage due to random STI induced traps at the silicon/oxide interface

Statistical compact model strategies for nano CMOS transistors subject of atomic scale variability

One of the major limiting factors of the CMOS device, circuit and system simulation in sub 100nm regimes is the statistical variability introduced by the discreteness of charge and granularity of matter. The statistical variability cannot be eliminated by tuning the layout or by tightening fabrication process control. Since the compact models are the key bridge between technology and design, it is necessary to transfer reliably the MOSFET statistical variability information into compact models to facilitate variability aware design practice. The aim of this project is the development of a statistical extraction methodology essential to capture statistical variability with optimum set of parameters particularly in industry standard compact model BSIM. This task is accomplished by using a detailed study on the sensitivity analysis of the transistor current in respect to key parameters in compact model in combination with error analysis of the fitted Id-Vg characteristics. The key point in the developed direct statistical compact model strategy is that the impacts of statistical variability can be captured in device characteristics by tuning a limited number of parameters and keeping the values for remaining major set equal to their default values obtained from the “uniform” MOSFET compact model extraction. However, the statistical compact model extraction strategies will accurately represent the distribution and correlation of the electrical MOSFET figures of merit. Statistical compact model parameters are generated using statistical parameter generation techniques such as uncorrelated parameter distributions, principal component analysis and nonlinear power method. The accuracy of these methods is evaluated in comparison with the results obtained from ‘atomistic’ simulations. The impact of the correlations in the compact model parameters has been analyzed along with the corresponding transistor figures of merit. The accuracy of the circuit simulations with different statistical compact model libraries has been studied. Moreover, the impact of the MOSFET width/length on the statistical trend of the optimum set of statistical compact model parameters and electrical figures of merit has been analyzed with two methods to capture geometry dependencies in proposed statistical models

Downscaling of 0.35 J.lm to 0.25 J.lm CMOS Transistor by Simulation

Silicon (Si) based integrated circuit (IC) has become the backbone of today's semiconductor world with MOS transistors as its fundamental building blocks. The integrated circuit complexity has moved from the early small-scale integration (SSI) to ultra-large-scale integration (ULSI) that can accommodate millions of transistors on a single chip. This evolution is primarily attributed to the concept of device miniaturization. The resulting scaledown devices do not only improve the packing density but also exhibit enhanced performance in terms of faster switching speed and lower power dissipation. The objective of this work is to perform downscaling of 0.35 Jll11 to 0.25 Jll11 CMOS transistor using Silvaco 2-D ATHENA and ATLAS simulation tool. A "two-step design" approach is proposed in this work to study the feasibility of miniaturization process by scaling method. A scaling factor, K of 1.4 (derived from direct division of 0.35 with 0.25) is adopted for selected parameters. The first design step involves a conversion of the physical data of 0.35 Jll11 CMOS technology to the simulated environment, where process recipe acquired from UC Berkeley Microfabrication Lab serves as the design basis. The electrical data for the simulated structure of 0.35 11m CMOS was extracted with the use of the device simulator. Using the simulated, optimized 0.35 Jll11 structure, downscaling to a smaller geometry of 0.25 Jll11 CMOS transistor was carried out and subsequent electrical characterization was performed in order to evaluate its performance. Parameters that are monitored to evaluate the performance of the designed 0.25 Jll11 CMOS transistor include threshold voltage (VtJJ, saturation current (ldsaJ, off-state leakage current (Ion) and subthreshold swing (SJ. From the simulation, the V1h obtained is of 0.51 V and -0.4 V for NMOS and PMOS respectively, with a difference of 15%-33% as compared to other reported work. However, for results of Idsat. the values obtained which is of 296 ~-tAIJll11 for NMOS and 181 J.lA/Jll11 for PMOS is much lower than other reported work by 28%-50%. This is believed to be due to direct scaling of 0.25 Jll11 transistor from the 0.35 11m geometry without alterations on the existing structure. For Ioffand St. both results show a much better value as compared to other work. I off obtained which is of <1 0 pA/J.lm is about 80%-96% lower than the maximum allowable specification. As for S1, the values obtained which is <90 mY/dec is only within 5% differences as compared to specification. In overall, these results (except for Idsat) accepted values for the particular 0.25 J..Lm technology. From this work, the capability to perform device miniaturization from 0.35 J..Lffi to 0.25 J..Lffi has been developed. This is achieved by acquiring the technical know-how on the important aspects of simulation required for successful simulation of 0.35 J..Lffi technology. Ultimately, the outcome of this work which is a simulated 0.25 J..Lm CMOS transistor can be used as a basis for scaling down to a much smaller device, namely towards 90-nrn geometry

Compact modeling of gate tunneling leakage current in advanced nanoscale soi mosfets

En esta tesis se han desarrollado modelos compactos de corriente de fuga por túnel de puerta en SOI MOSFET (de simple y doble puerta) avanzados basados en una aproximación WKB de la probabilidad de túnel. Se han estudiado los materiales dieléctricos high-k más prometedores para los diferentes requisitos de nodos tecnológicos de acuerdo ala hoja de ruta ITRS de miniaturización de dispositivos electrónicos. Hemos presentado un modelo compacto de particionamiento de la corriente de fuga de puerta para un MOSFET nanométrico de doble puerta (DG MOSFET), utilizando modelos analíticos de la corriente de fuga por el túnel directo de puerta. Se desarrollaron también Los modelos analíticos dependientes de la temperatura de la corriente de túnel en la región de inversión y de la corriente túnel asistido por trampas en régimen subumbral. Finalmente, se desarrolló una técnica de extracción automática de parámetros de nuestro modelo compacto en DG MOSFET incluyendo efectos de canal corto. La corriente de la puerta por túnel directo y asistido por trampas modelada mediante los parámetros extraídos se verificó exitosamente mediante comparación con medidas experimentales