Metodologia Per la Caratterizzazione di amplificatori a basso rumore per UMTS

In questo lavoro si presenta una metodologia di progettazione elettronica a livello di sistema, affrontando il problema della caratterizzazione dello spazio di progetto dell' amplificatore a basso rumore costituente il primo stadio di un front end a conversione diretta per UMTS realizzato in tecnologia CMOS con lunghezza di canale .18u. La metodologia è sviluppata al fine di valutare in modo quantititativo le specifiche ottime di sistema per il front-end stesso e si basa sul concetto di Piattaforma Analogica, che prevede la costruzione di un modello di prestazioni per il blocco analogico basato su campionamento statistico di indici di prestazioni del blocco stesso, misurati tramite simulazione di dimensionamenti dei componenti attivi e passivi soddisfacenti un set di equazioni specifico della topologia circuitale. Gli indici di prestazioni vengono successivamente ulizzati per parametrizzare modelli comportamentali utilizzati nelle fasi di ottimizzazione a livello di sistema. Modelli comportamentali atti a rappresentare i sistemi RF sono stati pertanto studiati per ottimizzare la scelta delle metriche di prestazioni. L'ottimizzazione dei set di equazioni atti a selezionare le configurazione di interesse per il campionamento ha al tempo stesso richiesto l'approfondimento dei modelli di dispositivi attivi validi in tutte le regioni di funzionamento, e lo studio dettagliato della progettazione degli amplificatori a basso rumore basati su degenerazione induttiva. Inoltre, il problema della modellizzazione a livello di sistema degli effetti della comunicazione tra LNA e Mixer è stato affrontato proponendo e analizzando diverse soluzioni. Il lavoro ha permesso di condurre un'ottimizzazione del front-end UMTS, giungendo a specifiche ottime a livello di sistema per l'amplificatore stesso

LC-VCO design optimization methodology based on the gm/ID ratio for nanometer CMOS technologies

In this paper, an LC voltage-controlled oscillator (LC-VCO) design optimization methodology based on the gm/ID technique and on the exploration of all inversion regions of the MOS transistor (MOST) is presented. An in-depth study of the compromises between phase noise and current consumption permits optimization of the design for given specifications. Semiempirical models of MOSTs and inductors, obtained by simulation, jointly with analytical phase noise models, allow to get a design space map where the design tradeoffs are easily identified. Four LC-VCO designs in different inversion regions in a 90-nm CMOS process are obtained with the proposed methodology and verified with electrical simulations. Finally, the implementation and measurements are presented for a 2.4-GHz VCO operating in moderate inversion. The designed VCO draws 440 μA from a 1.2-V power supply and presents a phase noise of -106.2 dBc/Hz at 400 kHz from the carrier

Development and Analysis of Non-Delay-Line Constant-Fraction Discriminator Timing Circuits, Including a Fully-Monolithic CMOS Implementation

A constant-fraction discriminator (CFD) is a time pick-off circuit providing time derivation that is insensitive to input-signal amplitude and, in some cases, input-signal rise time. CFD time pick-off circuits are useful in Positron Emission Tomography (PET) systems where Bismuth Germanate (BGO)/photomultiplier scintillation detectors detect coincident, 511-keV annihilation gamma rays. Time walk and noise-induced timing jitter in time pick-off circuits are discussed along with optimal and sub-optimal timing filters designed to minimize timing jitter. Additionally, the effects of scintillation-detector statistics on timing performance are discussed, and Monte Carlo analysis is developed to provide estimated timing and energy spectra for selected detector and time pick-off circuit configurations. The traditional delay-line CFD is then described with a discussion of deterministic (non statistical) performance and statistical Monte Carlo timing performance. A new class of non-delay-line CFD circuits utilizing lowpass- and/or allpass-filter delay-line approximations is then presented. The timing performance of these non-delay-line CFD circuits is shown to be comparable to traditional delay-line CFD circuits. Following the development and analysis of non-delay-line CFD circuits, a fully-monolithic, non-delay-line CFD circuit is presented which was fabricated in a standard digital, 2-μ, double-meta], double-poly, n-well CMOS process. The CMOS circuits developed include a low time walk comparator having a time walk of approximately 175 ps for input signals with amplitudes between 10-mV to 2000-mV and a rise time (10 - 90%) of 10 ns. Additionally, a fifth-order, continuous-time filter having a bandwidth of over 100 MHz was developed to provide CFD signal shaping without a delay line. The measured timing resolution (3.26 ns FWITh1, 6.50 ns FWTM) of the fully-monolithic, CMOS CFD is comparable to measured resolution (3.30 ns FWHM, 6.40 ns FWTM) of a commercial, discrete, bipolar CFD containing an external delay line. Each CFD was tested with a PET EGO/photomultiplier scintillation detector and a preamplifier having a 10-ns (10 - 90%) rise-time. The development of a fully-monolithic, CMOS CFD circuit, believed to be the first such reported development, is significant for PET and other systems that employ many front-end CFD time pick-off circuits

The design of active resistors and transductors in a CMOS technology

Merged with duplicate record 10026.1/2618 on 07.20.2017 by CS (TIS)This thesis surveys linearisation techniques for implementing monolithic MOS active resistors and transconductors, and investigates the design of linear tunable resistors and transconductors. Improving linearity and tunability in the presence of non-ideal factors such as bulk modulation, mobility-degradation effects and mismatch of transistors is a principal objective. A family of new non-saturation-mode resistors and two novel saturation-mode transconductors are developed. Where possible, approximate analytical expressions are derived to explain the principles of operation. Performance comparisons of the new structures are made with other well-known circuits and their relative advantages and disadvantages evaluated. Experimental and simulation results are presented which validate the proposed linearisation techniques. It is shown that the proposed family of resistors offers improved linearity whilst the transconductors combine extended tunability with low distortion. Continuous-time filter examples are given to demonstrate the potential of these circuits for application in analogue signal-processing tasks.GEC Plessey Semiconductors, Plymout

Aging-Aware Design Methods for Reliable Analog Integrated Circuits using Operating Point-Dependent Degradation

The focus of this thesis is on the development and implementation of aging-aware design methods, which are suitable to satisfy current needs of analog circuit design. Based on the well known \gm/\ID sizing methodology, an innovative tool-assisted aging-aware design approach is proposed, which is able to estimate shifts in circuit characteristics using mostly hand calculation schemes. The developed concept of an operating point-dependent degradation leads to the definition of an aging-aware sensitivity, which is compared to currently available degradation simulation flows and proves to be efficient in the estimation of circuit degradation. Using the aging-aware sensitivity, several analog circuits are investigated and optimized towards higher reliability. Finally, results are presented for numerous target specifications

Low-Voltage Analog Circuit Design Using the Adaptively Biased Body-Driven Circuit Technique

The scaling of MOSFET dimensions and power supply voltage, in conjunction with an increase in system- and circuit-level performance requirements, are the most important factors driving the development of new technologies and design techniques for analog and mixed-signal integrated circuits. Though scaling has been a fact of life for analog circuit designers for many years, the approaching 1-V and sub-1-V power supplies, combined with applications that have increasingly divergent technology requirements, means that the analog and mixed-signal IC designs of the future will probably look quite different from those of the past. Foremost among the challenges that analog designers will face in highly scaled technologies are low power supply voltages, which limit dynamic range and even circuit functionality, and ultra-thin gate oxides, which give rise to significant levels of gate leakage current. The goal of this research is to develop novel analog design techniques which are commensurate with the challenges that designers will face in highly scaled CMOS technologies. To that end, a new and unique body-driven design technique called adaptive gate biasing has been developed. Adaptive gate biasing is a method for guaranteeing that MOSFETs in a body-driven simple current mirror, cascode current mirror, or regulated cascode current source are biased in saturation—independent of operating region, temperature, or supply voltage—and is an enabling technology for high-performance, low-voltage analog circuits. To prove the usefulness of the new design technique, a body-driven operational amplifier that heavily leverages adaptive gate biasing has been developed. Fabricated on a 3.3-V/0.35-μm partially depleted silicon-onv-insulator (PD-SOI) CMOS process, which has nMOS and pMOS threshold voltages of 0.65 V and 0.85 V, respectively, the body-driven amplifier displayed an open-loop gain of 88 dB, bandwidth of 9 MHz, and PSRR greater than 50 dB at 1-V power supply

MOSFET zero-temperature-coefficient (ZTC) effect modeling anda analysis for low thermal sensitivity analog applications

Continuing scaling of Complementary Metal-Oxide-Semiconductor (CMOS) technologies brings more integration and consequently temperature variation has become more aggressive into a single die. Besides, depending on the application, room ambient temperature may also vary. Therefore, procedures to decrease thermal dependencies of eletronic circuit performances become an important issue to include in both digital and analog Integrated Circuits (IC) design flow. The main purpose of this thesis is to present a design methodology for a typical CMOS Analog design flow to make circuits as insensitivity as possible to temperature variation. MOSFET Zero Temperature Coefficient (ZTC) and Transconductance Zero Temperature Coefficient (GZTC) bias points are modeled to support it. These are used as reference to deliver a set of equations that explains to analog designers how temperature will change transistor operation and hence the analog circuit behavior. The special bias conditions are analyzed using a MOSFET model that is continuous from weak to strong inversion, and both are proven to occur always from moderate to strong inversion operation in any CMOS fabrication process. Some circuits are designed using proposed methodology: two new ZTC-based current references, two new ZTC-based voltage references and four classical Gm-C circuits biased at GZTC bias point (or defined here as GZTC-C filters). The first current reference is a Self-biased CMOS Current Reference (ZSBCR), which generates a current reference of 5 A. It is designed in an 180 nm process, operating with a supply voltage from 1.4V to 1.8 V and occupying around 0:010mm2 of silicon area. From circuit simulations the reference shows an effective temperature coefficient (TCeff ) of 15 ppm/oC from 45 to +85oC, and a fabrication process sensitivity of = = 4:5%, including average process and local mismatch. Simulated power supply sensitivity is estimated around 1%/V. The second proposed current reference is a Resistorless Self-Biased ZTC Switched Capacitor Current Reference (ZSCCR). It is also designed in an 180 nm process, resulting a reference current of 5.88 A under a supply voltage of 1.8 V, and occupying a silicon area around 0:010mm2. Results from circuit simulation show an TCeff of 60 ppm/oC from -45 to +85 oC and a power consumption of 63 W. The first proposed voltage reference is an EMI Resisting MOSFET-Only Voltage Reference (EMIVR), which generates a voltage reference of 395 mV. The circuit is designed in a 130 nm process, occupying around 0.0075 mm2 of silicon area while consuming just 10.3 W. Post-layout simulations present a TCeff of 146 ppm/oC, for a temperature range from 55 to +125oC. An EMI source of 4 dBm (1 Vpp amplitude) injected into the power supply of circuit, according to Direct Power Injection (DPI) specification results in a maximum DC Shift and Peak-to-Peak ripple of -1.7 % and 35.8m Vpp, respectively. The second proposed voltage reference is a 0.5V Schottky-based Voltage Reference (SBVR). It provides three voltage reference outputs, each one utilizing different threshold voltage MOSFETs (standard-VT , low-VT , and zero-VT ), all available in adopted 130 nm CMOS process. This design results in three different and very low reference voltages: 312, 237, and 51 mV, presenting a TCeff of 214, 372, and 953 ppm/oC in a temperature range from -55 to 125oC, respectively. It occupies around 0.014 mm2 of silicon area for a total power consumption of 5.9 W. Lastly, a few example Gm-C circuits are designed using GZTC technique: a single-ended resistor emulator, an impedance inverter, a first order and a second order filter. These circuits are simulated in a 130 nm CMOS commercial process, resulting improved thermal stability in the main performance parameters, in the range from 27 to 53 ppm/°C.A contínua miniaturização das tecnologias CMOS oferece maior capacidade de integração e, consequentemente, as variações de temperatura dentro de uma pastilha de silício têm se apresentado cada vez mais agressivas. Ademais, dependendo da aplicação, a temperatura ambiente a qual o CHIP está inserido pode variar. Dessa maneira, procedimentos para diminuir o impacto dessas variações no desempenho do circuito são imprescindíveis. Tais métodos devem ser incluídos em ambos fluxos de projeto CMOS, analógico e digital, de maneira que o desempenho do sistema se mantenha estável quando a temperatura oscilar. A ideia principal desta dissertação é propor uma metodologia de projeto CMOS analógico que possibilite circuitos com baixa dependência térmica. Como base fundamental desta metodologia, o efeito de coeficiente térmico nulo no ponto de polarização da corrente de dreno (ZTC) e da transcondutância (GZTC) do MOSFET são analisados e modelados. Tal modelamento é responsável por entregar ao projetista analógico um conjunto de equações que esclarecem como a temperatura influencia o comportamento do transistor e, portanto, o comportamento do circuito. Essas condições especiais de polarização são analisadas usando um modelo de MOSFET que é contínuo da inversão fraca para forte. Além disso, é mostrado que as duas condições ocorrem em inversão moderada para forte em qualquer processo CMOS. Algumas aplicações são projetadas usando a metodologia proposta: duas referências de corrente baseadas em ZTC, duas referências de tensão baseadas em ZTC, e quatro circuitos gm-C polarizados em GZTC. A primeira referência de corrente é uma Corrente de Referência CMOS Auto-Polarizada (ZSBCR), que gera uma referência de 5uA. Projetada em CMOS 180 nm, a referência opera com uma tensão de alimentação de 1.4 à 1.8 V, ocupando uma área em torno de 0:010mm2. Segundo as simulações, o circuito apresenta um coeficiente de temperatura efetivo (TCeff ) de 15 ppm/oC para -45 à +85 oC e uma sensibilidade à variação de processo de = = 4:5% incluindo efeitos de variabilidade dos tipos processo e descasamento local. A sensibilidade de linha encontrada nas simulações é de 1%=V . A segunda referência de corrente proposta é uma Corrente de Referência Sem Resistor Auto-Polarizada com Capacitor Chaveado (ZSCCR). O circuito é projetado também em 180 nm, resultando em uma corrente de referência de 5.88 A, para uma tensão de alimentação de 1.8 V, e ocupando uma área de 0:010mm2. Resultados de simulações mostram um TCeff de 60 ppm/oC para um intervalo de temperatura de -45 à +85 oC e um consumo de potência de 63 W. A primeira referência de tensão proposta é uma Referência de Tensão resistente à pertubações eletromagnéticas contendo apenas MOSFETs (EMIVR), a qual gera um valor de referência de 395 mV. O circuito é projetado no processo CMOS 130 nm, ocupando em torno de 0.0075 mm2 de área de silício, e consumindo apenas 10.3 W. Simulações pós-leiaute apresentam um TCeff de 146 ppm/oC, para um intervalo de temperatura de 55 à +125oC. Uma fonte EMI de 4 dBm (1 Vpp de amplitude) aplicada na alimentação do circuito, de acordo com o padrão Direct Power Injection (DPI), resulta em um máximo de desvio DC e ondulação Pico-à-Pico de -1.7 % e 35.8m Vpp, respectivamente. A segunda referência de tensão é uma Tensão de Referência baseada em diodo Schottky com 0.5V de alimentação (SBVR). Ela gera três saídas, cada uma utilizando MOSFETs com diferentes tensões de limiar (standard-VT , low-VT , e zero-VT ). Todos disponíveis no processo adotado CMOS 130 nm. Este projeto resulta em três diferentes voltages de referências: 312, 237, e 51 mV, apresentando um TCeff de 214, 372, e 953 ppm/oC no intervalo de temperatura de -55 à 125oC, respectivamente. O circuito ocupa em torno de 0.014 mm2, consumindo um total de 5.9 W. Por último, circuitos gm-C são projetados usando o conceito GZTC: um emulador de resistor, um inversor de impedância, um filtro de primeira ordem e um filtro de segunda ordem. Os circuitos também são simulados no processo CMOS 130 nm, resultando em uma melhora na estabilidade térmica dos seus principais parâmetros, indo de 27 à 53 ppm/°C

DESIGN OF TWO STAGE BULK-DRIVEN OPERATIONAL TRANSCONDUCTANCE AMPLIFIER (OTA) WITH A HIGH GAIN FOR LOW VOLTAGE APPLICATION

An Operational Transconductance Amplifier (further abbreviated as OTA) is a voltage controlled current source used to produce an output current proportional to the input voltage. A schematic architecture for a 180nm OTA is presented in this thesis with the goal of improving the open-loop gain for a 0.9V supply voltage with a rail-to-rail bulk-driven input stage. Results show an open loop gain 97.14 dB with a power consumption of 3.33uW. An OTA with over 90 dB open loop gain and lower power consumption is highly suitable for low-voltage applications. The slew rate of the OTA is 0.05V/uS with a unity-gain bandwidth of 8.4MHz. A 10uA ideal bias current reference is utilized for the design. The phase margin is around 49.2 degrees. The threshold voltage for a 180nm N-channel Metal Oxide Semiconductor (also known as NMOS) device is around 400mV which restricts the low voltage applications in most amplifier circuits. The fourth terminal (bulk) of the MOS device is utilized to optimize the voltage headroom (Vds). The bulk terminal uses a much lesser source to drain voltage than the gate-driven transistors, and the transistors remain ON with an input voltage as low as 0.1V. A bulk-driven input stage ensures the amplification in the subthreshold region (input signal less than the threshold voltage of the MOS device). However, even with the bulk input MOS device, a rail-to-rail input stage is employed to improve the dynamic range for the input signal from 0V to 0.9V with a supply voltage of 0.9V. The fluctuation in open loop gain concerning the change in input signal in the published research is because of the constant instability in the intrinsic transconductance of the input devices. A possible solution is presented in this thesis by adding a second dominant pole to the circuit (i.e., second stage for the OTA), which reduces the dependency of intrinsic transconductance (bulk-driven device) on the total open loop gain of the amplifier. Thus, a significant gain of 97.14 dB with minimal fluctuations is achieved. Furthermore, adding a second stage improves the gain by distributing the dependency of the gain due to the first stage to both poles in the circuit. Hence, the problem of fluctuating transconductance of the input stage is resolved by the constant intrinsic transconductance of the MOS near the second pole (M19). To improve the gain, a folded cascoded amplifier connected with the input stage results in a better impedance (in the first stage) known as the gain stage. In the second stage, a large PMOS common source amplifier gives a good output current compared to the input stage to enhance the output swing and drive a purely capacitive load of 0.5pF. Furthermore, a miller capacitance is used to compensate for the frequency between the first and the second stage and improving the unity-gain bandwidth. An additional biasing circuit in the second stage amplifies the current output of the first stage and thus improving the slew rate of the entire device. In addition, the biasing circuit resolves the biasing issues for the second-stage common-source amplifier. It improves the output swing of the device to obtain a clean/undistorted output waveform. All the simulations are carried out in the LTSpice simulation tool to test the waveforms and bode plot for open loop gain and phase margin (49.2 degrees) at different processes (slow, typical, and fast), input voltages (0-0.9V), supply voltage (0.8V, 0.9V, 1.0V) and temperatures (-10 to 100 degree C)