REDUCING POWER DURING MANUFACTURING TEST USING DIFFERENT ARCHITECTURES

Power during manufacturing test can be several times higher than power consumption in functional mode. Excessive power during test can cause IR drop, over-heating, and early aging of the chips. In this dissertation, three different architectures have been introduced to reduce test power in general cases as well as in certain scenarios, including field test. In the first architecture, scan chains are divided into several segments. Every segment needs a control bit to enable capture in a segment when new faults are detectable on that segment for that pattern. Otherwise, the segment should be disabled to reduce capture power. We group the control bits together into one or more control chains. To address the extra pin(s) required to shift data into the control chain(s) and significant post processing in the first architecture, we explored a second architecture. The second architecture stitches the control bits into the chains they control as EECBs (embedded enable capture bits) in between the segments. This allows an ATPG software tool to automatically generate the appropriate EECB values for each pattern to maintain the fault coverage. This also works in the presence of an on-chip decompressor. The last architecture focuses primarily on the self-test of a device in a 3D stacked IC when an existing FPGA in the stack can be programmed as a tester. We show that the energy expended during test is significantly less than would be required using low power patterns fed by an on-chip decompressor for the same very short scan chains

A novel scan segmentation design method for avoiding shift timing failure in scan testing

ITC : 2011 IEEE International Test Conference , 20-22 Sep. 2011 , Anaheim, CA, USAHigh power consumption in scan testing can cause undue yield loss which has increasingly become a serious problem for deep-submicron VLSI circuits. Growing evidence attributes this problem to shift timing failures, which are primarily caused by excessive switching activity in the proximities of clock paths that tends to introduce severe clock skew due to IR-drop-induced delay increase. This paper is the first of its kind to address this critical issue with a novel layout-aware scheme based on scan segmentation design, called LCTI-SS (Low-Clock-Tree-Impact Scan Segmentation). An optimal combination of scan segments is identified for simultaneous clocking so that the switching activity in the proximities of clock trees is reduced while maintaining the average power reduction effect on conventional scan segmentation. Experimental results on benchmark and industrial circuits have demonstrated the advantage of the LCTI-SS scheme

Test Strategies for Low Power Devices

Ultra low-power devices are being developed for embedded applications in bio-medical electronics, wireless sensor networks, environment monitoring and protection, etc. The testing of these low-cost, low-power devices is a daunting task. Depending on the target application, there are stringent guidelines on the number of defective parts per million shipped devices. At the same time, since such devices are cost-sensitive, test cost is a major consideration. Since system-level power-management techniques are employed in these devices, test generation must be power-management-aware to avoid stressing the power distribution infrastructure in the test mode. Structural test techniques such as scan test, with or without compression, can result in excessive heat dissipation during testing and damage the package. False failures may result due to the electrical and thermal stressing of the device in the test mode of operation, leading to yield loss. This paper considers different aspects of testing low-power devices and some new techniques to address these problems.Design, Automation and Test in Europe (DATE \u2708), 10-14 March 2008, Munich, German

Scalable Approach for Power Droop Reduction During Scan-Based Logic BIST

The generation of significant power droop (PD) during at-speed test performed by Logic Built-In Self Test (LBIST) is a serious concern for modern ICs. In fact, the PD originated during test may delay signal transitions of the circuit under test (CUT): an effect that may be erroneously recognized as delay faults, with consequent erroneous generation of test fails and increase in yield loss. In this paper, we propose a novel scalable approach to reduce the PD during at-speed test of sequential circuits with scan-based LBIST using the launch-on-capture scheme. This is achieved by reducing the activity factor of the CUT, by proper modification of the test vectors generated by the LBIST of sequential ICs. Our scalable solution allows us to reduce PD to a value similar to that occurring during the CUT in field operation, without increasing the number of test vectors required to achieve a target fault coverage (FC). We present a hardware implementation of our approach that requires limited area overhead. Finally, we show that, compared with recent alternative solutions providing a similar PD reduction, our approach enables a significant reduction of the number of test vectors (by more than 50%), thus the test time, to achieve a target FC

Low-Cost and High-Reduction Approaches for Power Droop during Launch-On-Shift Scan-Based Logic BIST

During at-speed test of high performance sequential ICs using scan-based Logic BIST, the IC activity factor (AF) induced by the applied test vectors is significantly higher than that experienced during its in field operation. Consequently, power droop (PD) may take place during both shift and capture phases, which will slow down the circuit under test (CUT) signal transitions. At capture, this phenomenon is likely to be erroneously recognized as due to delay faults. As a result, a false test fail may be generated, with consequent increase in yield loss. In this paper, we propose two approaches to reduce the PD generated at capture during at-speed test of sequential circuits with scan-based Logic BIST using the Launch-On-Shift scheme. Both approaches increase the correlation between adjacent bits of the scan chains with respect to conventional scan-based LBIST. This way, the AF of the scan chains at capture is reduced. Consequently, the AF of the CUT at capture, thus the PD at capture, is also reduced compared to conventional scan-based LBIST. The former approach, hereinafter referred to as Low-Cost Approach (LCA), enables a 50% reduction in the worst case magnitude of PD during conventional logic BIST. It requires a small cost in terms of area overhead (of approximately 1.5% on average), and it does not increase the number of test vectors over the conventional scan-based LBIST to achieve the same Fault Coverage (FC). Moreover, compared to three recent alternative solutions, LCA features a comparable AF in the scan chains at capture, while requiring lower test time and area overhead. The second approach, hereinafter referred to as High-Reduction Approach (HRA), enables scalable PD reductions at capture of up to 87%, with limited additional costs in terms of area overhead and number of required test vectors for a given target FC, over our LCA approach. Particularly, compared to two of the three recent alternative solutions mentioned above, HRA enables a significantly lower AF in the scan chains during the application of test vectors, while requiring either a comparable area overhead or a significantly lower test time. Compared to the remaining alternative solutions mentioned above, HRA enables a similar AF in the scan chains at capture (approximately 90% lower than conventional scan-based LBIST), while requiring a significantly lower test time (approximately 4.87 times on average lower number of test vectors) and comparable area overhead (of approximately 1.9% on average)

A Novel Scan Segmentation Design Method for Avoiding Shift Timing Failure in Scan Testing

High power consumption in scan testing can cause undue yield loss which has increasingly become a serious problem for deep-submicron VLSI circuits. Growing evidence attributes this problem to shift timing failures, which are primarily caused by excessive switching activity in the proximities of clock paths that tends to introduce severe clock skew due to IR-drop-induced delay increase. This paper is the first of its kind to address this critical issue with a novel layout-aware scheme based on scan segmentation design, called LCTI-SS (Low-Clock-Tree-Impact Scan Segmentation). An optimal combination of scan segments is identified for simultaneous clocking so that the switching activity in the proximities of clock trees is reduced while maintaining the average power reduction effect on conventional scan segmentation. Experimental results on benchmark and industrial circuits have demonstrated the advantage of the LCTI-SS scheme.2011 IEEE International Test Conference, 20-22 September 2011, Anaheim, CA, US

Novel Front-end Electronics for Time Projection Chamber Detectors

Este trabajo ha sido realizado en la Organización Europea para la Investigación Nuclear (CERN) y forma parte del proyecto de investigación Europeo para futuros aceleradores lineales (EUDET). En física de partículas existen diferentes categorías de detectores de partículas. El diseño presentado esta centrado en un tipo particular de detector de trayectoria de partículas denominado TPC (Time Projection Chamber) que proporciona una imagen en tres dimensiones de las partículas eléctricamente cargadas que atraviesan su volumen gaseoso. La tesis incluye un estudio de los objetivos para futuros detectores, resumiendo los parámetros que un sistema de adquisición de datos debe cumplir en esos casos. Además, estos requisitos son comparados con los actuales sistemas de lectura utilizados en diferentes detectores TPC. Se concluye que ninguno de los sistemas cumple las restrictivas condiciones. Algunos de los principales objetivos para futuros detectores TPC son un altísimo nivel de integración, incremento del número de canales, electrónica más rápida y muy baja potencia. El principal inconveniente del estado del arte de los sistemas anteriores es la utilización de varios circuitos integrados en la cadena de adquisición. Este hecho hace imposible alcanzar el altísimo nivel de integración requerido para futuros detectores. Además, un aumento del número de canales y frecuencia de muestreo haría incrementar hasta valores no permitidos la potencia utilizada. Y en consecuencia, incrementar la refrigeración necesaria (en caso de ser posible). Una de las novedades presentadas es la integración de toda la cadena de adquisición (filtros analógicos de entrada, conversor analógico-digital (ADC) y procesado de señal digital) en un único circuito integrado en tecnología de 130nm. Este chip es el primero que realiza esta altísima integración para detectores TPC. Por otro lado, se presenta un análisis detallado de los filtros de procesado de señal. Los objetivos más importantes es la reduccióGarcía García, EJ. (2012). Novel Front-end Electronics for Time Projection Chamber Detectors [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/16980Palanci

KAPow: high-accuracy, low-overhead online per-module power estimation for FPGA designs

In an FPGA system-on-chip design, it is often insufficient to merely assess the power consumption of the entire circuit by compile-time estimation or runtime power measurement. Instead, to make better decisions, one must understand the power consumed by each module in the system. In this work, we combine measurements of register-level switching activity and system-level power to build an adaptive online model that produces live breakdowns of power consumption within the design. Online model refinement avoids time-consuming characterisation while also allowing the model to track long-term operating condition changes. Central to our method is an automated flow that selects signals predicted to be indicative of high power consumption, instrumenting them for monitoring. We named this technique KAPow, for 'K'ounting Activity for Power estimation, which we show to be accurate and to have low overheads across a range of representative benchmarks. We also propose a strategy allowing for the identification and subsequent elimination of counters found to be of low significance at runtime, reducing algorithmic complexity without sacrificing significant accuracy. Finally, we demonstrate an application example in which a module-level power breakdown can be used to determine an efficient mapping of tasks to modules and reduce system-wide power consumption by up to 7%

A Static Time Analysis of 1-bit to 32-page SCA architecture for Logic Test

This research proposes the Static Time Analysis  of  32  page  Single  cycle  access  (SCA)  architecture  for Logic test. The timing analysis of each and very path of Logic test are observed that is setup and hold timings are calculated.  It also eliminates the peak power consumption problem of conventional shift-based scan chains and reduces the activity during shift and capture cycles using Clock-Gating technique. This leads to more realistic circuit behavior during at-speed tests. It enables the complete test to run at much higher frequencies equal or close to the one in functional mode. It will be shown, that a lesser number of test cycles can be achieved compared to other published solutions. The test cycle per net based on a simple test pattern generator algorithm without test pattern compression is below 1 for larger designs and is independent of the design size. The structure allows an additional on-chip debugging signal visibility for each register. The method is backward compatible to full scan designs and existing test pattern generators and simulators can be used with a minor enhancement. It is shown how to combine the proposed solution with built-in self-test  (BIST)  and  massive parallel   scan   chains.   The   results   are   observed   on   Xilinx XC3s1600e-5fgg48

Design for pre-bond testability in 3D integrated circuits

In this dissertation we propose several DFT techniques specific to 3D stacked IC systems. The goal has explicitly been to create techniques that integrate easily with existing IC test systems. Specifically, this means utilizing scan- and wrapper-based techniques, two foundations of the digital IC test industry. First, we describe a general test architecture for 3D ICs. In this architecture, each tier of a 3D design is wrapped in test control logic that both manages tier test pre-bond and integrates the tier into the large test architecture post-bond. We describe a new kind of boundary scan to provide the necessary test control and observation of the partial circuits, and we propose a new design methodology for test hardcore that ensures both pre-bond functionality and post-bond optimality. We present the application of these techniques to the 3D-MAPS test vehicle, which has proven their effectiveness. Second, we extend these DFT techniques to circuit-partitioned designs. We find that boundary scan design is generally sufficient, but that some 3D designs require special DFT treatment. Most importantly, we demonstrate that the functional partitioning inherent in 3D design can potentially decrease the total test cost of verifying a circuit. Third, we present a new CAD algorithm for designing 3D test wrappers. This algorithm co-designs the pre-bond and post-bond wrappers to simultaneously minimize test time and routing cost. On average, our algorithm utilizes over 90% of the wires in both the pre-bond and post-bond wrappers. Finally, we look at the 3D vias themselves to develop a low-cost, high-volume pre-bond test methodology appropriate for production-level test. We describe the shorting probes methodology, wherein large test probes are used to contact multiple small 3D vias. This technique is an all-digital test method that integrates seamlessly into existing test flows. Our experimental results demonstrate two key facts: neither the large capacitance of the probe tips nor the process variation in the 3D vias and the probe tips significantly hinders the testability of the circuits. Taken together, this body of work defines a complete test methodology for testing 3D ICs pre-bond, eliminating one of the key hurdles to the commercialization of 3D technology.PhDCommittee Chair: Lee, Hsien-Hsin; Committee Member: Bakir, Muhannad; Committee Member: Lim, Sung Kyu; Committee Member: Vuduc, Richard; Committee Member: Yalamanchili, Sudhaka