(Invited) mm-wave silicon ICs: An opportunity for holistic design

Millimeter-waves integrated circuits offer a unique opportunity for a holistic design approach encompassing RF, analog, and digital, as well as radiation and electromagnetics. The ability to deal with the complete system from the digital circuitry to on-chip antennas and everything in between offers unparalleled opportunities for completely new architectures and topologies, previously impossible due the traditional partitioning of various blocks in conventional design. This opens a plethora of new architectural and system level innovation within the integrated circuit platform. This paper reviews some of the challenges and opportunities for mm-wave ICs and presents several solutions to them

Millimeter-Wave and Terahertz Transceivers in SiGe BiCMOS Technologies

This invited paper reviews the progress of silicon–germanium (SiGe) bipolar-complementary metal–oxide–semiconductor (BiCMOS) technology-based integrated circuits (ICs) during the last two decades. Focus is set on various transceiver (TRX) realizations in the millimeter-wave range from 60 GHz and at terahertz (THz) frequencies above 300 GHz. This article discusses the development of SiGe technologies and ICs with the latter focusing on the commercially most important applications of radar and beyond 5G wireless communications. A variety of examples ranging from 77-GHz automotive radar to THz sensing as well as the beginnings of 60-GHz wireless communication up to THz chipsets for 100-Gb/s data transmission are recapitulated. This article closes with an outlook on emerging fields of research for future advancement of SiGe TRX performance

Compact Millimeter-Wave Bandpass Filters Using Quasi-Lumped Elements in 0.13-um (Bi)-CMOS Technology for 5G Wireless Systems

© 2019 IEEE.A design methodology for a compact millimeter-wave on-chip bandpass filter (BPF) is presented in this paper. Unlike the previously published works in the literature, the presented method is based on quasi-lumped elements, which consists of a resonator with enhanced self-coupling and metal-insulator-metal capacitors. Thus, this approach provides inherently compact designs comparing with the conventional distributed elements-based ones. To fully understand the insight of the approach, simplified LC-equivalent circuit models are developed. To further demonstrate the feasibility of using this approach in practice, the resonator and two compact BPFs are designed using the presented models. All three designs are fabricated in a standard 0.13- \mu \text{m} (Bi)-CMOS technology. The measured results show that the resonator can generate a notch at 47 GHz with the attenuation better than 28 dB due to the enhanced self-coupling. The chip size, excluding the pads, is only 0.096 \times 0.294 mm 2. In addition, using the resonator for BPF designs, the first BPF has one transmission zero at 58 GHz with a peak attenuation of 23 dB. The center frequency of this filter is 27 GHz with an insertion loss of 2.5 dB, while the return loss is better than 10 dB from 26 to 31 GHz. The second BPF has two transmission zeros, and a minimum insertion loss of 3.5 dB is found at 29 GHz, while the return loss is better than 10 dB from 26 GHz to 34 GHz. Also, more than 20-dB stopband attenuation is achieved from dc to 20.5 GHz and from 48 to 67 GHz. The chip sizes of these two BPFs, excluding the pads, are only 0.076\times 0.296 mm 2 and 0.096\times 0.296 mm 2, respectively.Peer reviewe

Integrated Circuits Based on 300 GHz fT Metamorphic HEMT Technology for Millimeter-Wave and Mixed-Signal Applications

Advanced circuits based on metamorphic HEMT (MHEMT)technologies on 4 ”GaAs substrates for both millimeter-wave,and mixed- signal applications are presented.Extrinsic cut-off frequencies of ft =293 GHz and fmax =337 GHz were achieved for a 70 nm gate length metamorphic HEMT echnology.The MMIC process obtains high yield on transistor and circuit level.Single-stage low-noise amplifiers demonstrate a small signal gain of 13 dB and a noise figure of 2.8 dB at 94 GHz.An amplifier MMIC developed for D-Band operation features a gain of 15 dB at 160 GHz.The achieved results are comparable to state- of-the-art InP-based HEMT technologies.In order to realize 80 Gbit/s digital circuits,a process with 100 nm gate length enhancement type HEMTs with a transit frequency of 200 GHz is used.Three metalization layers are available for interconnects.The parasitic capacitance of the interconnects is kept low by using BCB and plated air bridge technology.Based on this process,static and dynamic frequency dividers achieve a maximu toggle frequency of 70 GHz and 108 GHz,respectively

Millimeter-wave Wireless LAN and its Extension toward 5G Heterogeneous Networks

Millimeter-wave (mmw) frequency bands, especially 60 GHz unlicensed band, are considered as a promising solution for gigabit short range wireless communication systems. IEEE standard 802.11ad, also known as WiGig, is standardized for the usage of the 60 GHz unlicensed band for wireless local area networks (WLANs). By using this mmw WLAN, multi-Gbps rate can be achieved to support bandwidth-intensive multimedia applications. Exhaustive search along with beamforming (BF) is usually used to overcome 60 GHz channel propagation loss and accomplish data transmissions in such mmw WLANs. Because of its short range transmission with a high susceptibility to path blocking, multiple number of mmw access points (APs) should be used to fully cover a typical target environment for future high capacity multi-Gbps WLANs. Therefore, coordination among mmw APs is highly needed to overcome packet collisions resulting from un-coordinated exhaustive search BF and to increase the total capacity of mmw WLANs. In this paper, we firstly give the current status of mmw WLANs with our developed WiGig AP prototype. Then, we highlight the great need for coordinated transmissions among mmw APs as a key enabler for future high capacity mmw WLANs. Two different types of coordinated mmw WLAN architecture are introduced. One is the distributed antenna type architecture to realize centralized coordination, while the other is an autonomous coordination with the assistance of legacy Wi-Fi signaling. Moreover, two heterogeneous network (HetNet) architectures are also introduced to efficiently extend the coordinated mmw WLANs to be used for future 5th Generation (5G) cellular networks.Comment: 18 pages, 24 figures, accepted, invited paper

MIDAS: Automated Approach to Design Microwave Integrated Inductors and Transformers on Silicon

The design of modern radiofrequency integrated circuits on silicon operating at microwave and millimeter-waves requires the integration of several spiral inductors and transformers that are not commonly available in the process design-kits of the technologies. In this work we present an auxiliary CAD tool for Microwave Inductor (and transformer) Design Automation on Silicon (MIDAS) that exploits commercial simulators and allows the implementation of an automatic design flow, including three-dimensional layout editing and electromagnetic simulations. In detail, MIDAS allows the designer to derive a preliminary sizing of the inductor (transformer) on the bases of the design entries (specifications). It draws the inductor (transformer) layers for the specific process design kit, including vias and underpasses, with or without patterned ground shield, and launches the electromagnetic simulations, achieving effective design automation with respect to the traditional design flow for RFICs. With the present software suite the complete design time is reduced significantly (typically 1 hour on a PC based on Intel® Pentium® Dual 1.80GHz CPU with 2-GB RAM). Afterwards both the device equivalent circuit and the layout are ready to be imported in the Cadence environment

Microwave device investigations Semiannual progress report, 1 Oct. 1968 - 1 Apr. 1969

Beam plasma amplification, harmonic generation, and coupling scheme

Very high performance 50 nm T-gate III-V HEMTs enabled by robust nanofabrication technologies

In this paper, we review a range of nanofabrication techniques which enable the realization of uniform, high yield, high performance 50 nm T-gate III-V high electron mobility transistors (HEMTs). These technologies have been applied in the fabrication of a range of lattice matched and pseudomorphic InP HEMTs and GaAs metamorphic HEMTs with functional yields in excess of 95%, threshold voltage uniformity of 5 mV, DC transconductance of up to 1600 mS/mm and f/sub T/ of up to 480 GHz. These technologies and device demonstrators are key to enabling a wide range of millimeter-wave imaging and sensing applications beyond 100 GHz, particularly where array-based multi-channel solutions are required