Analysis and Life Cycle Assessment of Printed Antennas for Sustainable Wireless Systems

Siirretty Doriast

The 3rd International Conference on the Challenges, Opportunities, Innovations and Applications in Electronic Textiles

This reprint is a collection of papers from the E-Textiles 2021 Conference and represents the state-of-the-art from both academia and industry in the development of smart fabrics that incorporate electronic and sensing functionality. The reprint presents a wide range of applications of the technology including wearable textile devices for healthcare applications such as respiratory monitoring and functional electrical stimulation. Manufacturing approaches include printed smart materials, knitted e-textiles and flexible electronic circuit assembly within fabrics and garments. E-textile sustainability, a key future requirement for the technology, is also considered. Supplying power is a constant challenge for all wireless wearable technologies and the collection includes papers on triboelectric energy harvesting and textile-based water-activated batteries. Finally, the application of textiles antennas in both sensing and 5G wireless communications is demonstrated, where different antenna designs and their response to stimuli are presented

Sustainable 3D printed electronics with sheath conductors

Sustainable manufacturing practices have been an essential consideration in recent years. 3D printing will be a key technology in the transition towards sustainability because it minimizes material consumption and waste generation. One area that could benefit from 3D printing techniques would be the production of printed circuit boards and electronics in which most of the copper used is etched in subsequent steps. Comparatively, 3D printing minimizes waste by depositing conductive material only where desired. However, the conductive material used, commonly a silver-based printable material, is expensive and further reductions are required to ensure sustainability. In high frequency applications, owing to the skin effect, the core of a conductor carries little electrical current and thus could be replaced with a cheaper plastic. To accomplish this, custom nozzles capable of printing these sheath conductors were developed and tested by printing an embedded inductor for wireless power transfer

Microwave Devices for Wearable Sensors and IoT

The Internet of Things (IoT) paradigm is currently highly demanded in multiple scenarios and in particular plays an important role in solving medical-related challenges. RF and microwave technologies, coupled with wireless energy transfer, are interesting candidates because of their inherent contactless spectrometric capabilities and for the wireless transmission of sensing data. This article reviews some recent achievements in the field of wearable sensors, highlighting the benefits that these solutions introduce in operative contexts, such as indoor localization and microwave sensing. Wireless power transfer is an essential requirement to be fulfilled to allow these sensors to be not only wearable but also compact and lightweight while avoiding bulky batteries. Flexible materials and 3D printing polymers, as well as daily garments, are widely exploited within the presented solutions, allowing comfort and wearability without renouncing the robustness and reliability of the built-in wearable sensor

High-frequency characterization of embedded components in printed circuit boards

The embedding of electronic components is a three-dimensional packaging technology, where chips are placed inside of the printed circuit board instead of on top. The advantage of this technology is the reduced electronic interconnection length between components. The shorter this connection, the faster the signal transmission can occur. Different high-frequency aspects of chip embedding are investigated within this dissertation: interconnections to the embedded chip, crosstalk between signals on the chip and on the board, and interconnections running on top of or underneath embedded components. The high-frequency behavior of tracks running near embedded components is described using a broadband model for multilayer microstrip transmission lines. The proposed model can be used to predict the characteristic impedance and the loss of the lines. The model is based on two similar approximations that reduce the multilayer substrate to an equivalent single-layer structure. The per-unit-length shunt impedance parameters are derived from the complex effective dielectric constant, which is obtained using a variational method. A complex image approach results in the calculation of a frequency-dependent effective height that can be used to determine the per-unit-length resistance and inductance. A deliberate choice was made for a simple but accurate model that could easily be implemented in current high-frequency circuit simulators. Next to quasi-static electromagnetic simulations, a dedicated test vehicle that allows for the direct extraction of the propagation constant of these multilayer microstrips is manufactured and used to verify the model. The verification of the model using simulation and measurements shows that the proposed model slightly overestimates the loss of the measured multilayer microstrips, but is more accurate than the simulations in predicting the characteristic impedance

Analysis and Design of Low-Cost Waveguide Filters for Wireless Communications

The area of research of this thesis is built around advanced waveguide filter structures. Waveguide filters and the waveguide technology in general are renowned for high power capacity, low losses and excellent electromagnetic shielding. Waveguide filters are important components in fixed wireless communications as well as in satellite and radar systems. Furthermore, their advantages and utilization become even greater with increase in frequency, which is a trend in modern communication systems because upper frequency bands offer larger channel capacities. However, waveguide filters are relatively bulky and expensive. To comply with more and more demanding miniaturization and cost-cutting requirements, compactness and economical design represent some of the main contemporary focuses of interest. Approaches that are used to achieve this include use of planar inserts to build waveguide discontinuities, additive manufacturing and substrate integration. At the same time, waveguide filters still need to satisfy opposed stringent requirements like small insertion loss, high selectivity and multiband operation. Another difficulty that metal waveguide components face is integration with other circuitry, especially important when solid-state active devices are included. Thus, improvements of interconnections between waveguide and other transmission interfaces are addressed too. The thesis elaborates the following aspects of work: Further analysis and improved explanations regarding advanced waveguide filters with E-plane inserts developed by the Wireless Communications Research Group, using both cross coupled resonators and extracted pole sections (Experiments with higher filter orders, use of tuning screws, degrees of freedom in design, etc. Thorough performance comparison with competing filter technologies) - Proposing novel E-plane filter sections with I-shaped insets - Extension of the E-plane filtering structures with metal fins to new compact dual band filters with high frequency selectivity and miniaturized diplexers. - Introduction of easy-to-build waveguide filters with polymer insert frames and high-performance low-profile cavity filters, taking advantage of enhanced fabrication capabilities when using additive manufacturing - Developing new substrate integrated filters, as well as circuits used to transfer signals between different interfaces Namely, these are substrate integrated waveguide to metal waveguide planar transitions that do not require any modifications of the metal waveguides. Such novel transitions have been designed both for single and orthogonal signal polarizations

Packages for Terahertz Electronics

In the last couple of decades, solid-state device technologies, particularly electronic semiconductor devices, have been greatly advanced and investigated for possible adoption in various terahertz (THz) applications, such as imaging, security, and wireless communications. In tandem with these investigations, researchers have been exploring ways to package those THz electronic devices and integrated circuits for practical use. Packages are fundamentally expected to provide a physical housing for devices and integrated circuits (ICs) and reliable signal interconnections from the inside to the outside or vice versa. However, as frequency increases, we face several challenges associated with signal loss, dimensions, and fabrication. This paper provides a broad overview of recent progress in interconnections and packaging technologies dealing with these issues for THz electronics. In particular, emerging concepts based on commercial ceramic technologies, micromachining, and 3-D printing technologies for compact and lightweight packaging in practical applications are highlighted, along with metallic split blocks with rectangular waveguides, which are still considered the most valid and reliable approach.119Ysciescopu

The Potential of Printed Electronics and Personal Fabrication in Driving the Internet of Things

In the early nineties, Mark Weiser, a chief scientist at the Xerox Palo Alto Research Center (PARC), wrote a series of seminal papers that introduced the concept of Ubiquitous Computing. Within this vision, computers and others digital technologies are integrated seamlessly into everyday objects and activities, hidden from our senses whenever not used or needed. An important facet of this vision is the interconnectivity of the various physical devices, which creates an Internet of Things. With the advent of Printed Electronics, new ways to link the physical and digital worlds became available. Common printing technologies, such as screen, flexography, and inkjet printing, are now starting to be used not only to mass-produce extremely thin, flexible and cost effective electronic circuits, but also to introduce electronic functionality into objects where it was previously unavailable. In turn, the growing accessibility to Personal Fabrication tools is leading to the democratization of the creation of technology by enabling end-users to design and produce their own material goods according to their needs. This paper presents a survey of commonly used technologies and foreseen applications in the field of Printed Electronics and Personal Fabrication, with emphasis on the potential to drive the Internet of Things

A Digital Manufacturing Process For Three-Dimensional Electronics

Additive manufacturing (AM) offers the ability to produce devices with a degree of three-dimensional complexity and mass customisation previously unachievable with subtractive and formative approaches. These benefits have not transitioned into the production of commercial electronics that still rely on planar, template-driven manufacturing, which prevents them from being tailored to the end user or exploiting conformal circuitry for miniaturisation. Research into the AM fabrication of 3D electronics has been demonstrated; however, because of material restrictions, the durability and electrical conductivity of such devices was often limited. This thesis presents a novel manufacturing approach that hybridises the AM of polyetherimide (PEI) with chemical modification and selective light-based synthesis of silver nanoparticles to produce 3D electronic systems. The resulting nanoparticles act as a seed site for the electroless deposition of copper. The use of high-performance materials for both the conductive and dielectric elements created devices with the performance required for real-world applications. For printing PEI, a low-cost fused filament fabrication (FFF); also known as fused deposition modelling (FDM), printer with a unique inverted design was developed. The orientation of the printer traps hot air within a heated build environment that is open on its underside allowing the print head to deposit the polymer while keeping the sensitive components outside. The maximum achievable temperature was 120 °C and was found to reduce the degree of warping and the ultimate tensile strength of printed parts. The dimensional accuracy was, on average, within 0.05 mm of a benchmark printer and fine control over the layer thickness led to the discovery of flexible substrates that can be directly integrated into rigid parts. Chemical modification of the printed PEI was used to embed ionic silver into the polymer chain, sensitising it to patterning with a 405 nm laser. The rig used for patterning was a re-purposed vat-photopolymerisation printer that uses a galvanometer to guide the beam that is focused to a spot size of 155 µm at the focal plane. The positioning of the laser spot was controlled with an open-sourced version of the printers slicing software. The optimal laser patterning parameters were experimentally validated and a link between area-related energy density and the quality of the copper deposition was found. In tests where samples were exposed to more than 2.55 J/cm^2, degradation of the polymer was experienced which produced blistering and delamination of the copper. Less than 2.34 J/cm^2 also had negative effect and resulted in incomplete coverage of the patterned area. The minimum feature resolution produced by the patterning setup was 301 µm; however, tests with a photomask demonstrated features an order of magnitude smaller. The non-contact approach was also used to produce conformal patterns over sloped and curved surfaces. Characterisation of the copper deposits found an average thickness of 559 nm and a conductivity of 3.81 × 107 S/m. Tape peel and bend fatigue testing showed that the copper was ductile and adhered well to the PEI, with flexible electronic samples demonstrating over 50,000 cycles at a minimum bend radius of 6.59 mm without failure. Additionally, the PEI and copper combination was shown to survive a solder reflow with peak temperatures of 249°C. Using a robotic pick and place system a test board was automatically populated with surface mount components as small as 0201 resistors which were affixed using high-temperature, Type-V Tin-Silver-Copper solder paste. Finally, to prove the process a range of functional demonstrators were built and evaluated. These included a functional timer circuit, inductive wireless power coils compatible with two existing standards, a cylindrical RF antenna capable of operating at several frequencies below 10 GHz, flexible positional sensors, and multi-mode shape memory alloy actuators

Lab-on-PCB Devices

Lab-on-PCB devices can be considered an emerging technology. In fact, most of the contributions have been published during the last 5 years. It is mainly focussed on both biomedical and electronic applications. The book includes an interesting guide for using the different layers of the Printed Circuit Boards for developing new devices; guidelines for fabricating PCB-based electrochemical biosensors, and an overview of fluid manipulation devices fabricated using Printed Circuit Boards. In addition, current PCB-based devices are reported, and studies for several aspects of research and development of lab-on-PCB devices are described