High repetition rate femtosecond laser heat accumulation and ablation thresholds in cobalt-binder and binderless tungsten carbides

Femtosecond (fs) laser ablation has been studied for the potential of fast, high precision machining of difficult-to-machine materials like binderless tungsten carbide. Obstacles that have limited its efficiency include melting from heat accumulation (HA), particle shielding, and plasma shielding. To address HA without shielding effects, high repetition rate (57.4 MHz), ultra-low fluence fs laser irradiation is performed to study the incubation effect and subsequent HA-ablation threshold of fine-grained tungsten carbides. Exposure times on the order of 100 ms were conducted in air with fluences (1.82 to 9.09 mJ/cm2) two orders of magnitude below the single fs pulse ablation thresholds reported in literature (0.4 J/cm2). Heat accumulation at high repetition rate explains the ultra-low fluence melt threshold behavior resulting in melt crowns around ablated holes and grooves. The results of this study aid in predicting heat buildup in high repetition rate laser irradiation for applications that wish to achieve high ablation rates of difficult-to-machine, ultrahard materials and help enable shaping of binderless tungsten carbide for use in applications too extreme for bindered tungsten carbide

Contamination Control in Hybrid Microelectronic Modules. Part 1: Identification of Critical Process and Contaminants

Various hybrid processing steps, handling procedures, and materials are examined in an attempt to identify sources of contamination and to propose methods for the control of these contaminants. It is found that package sealing, assembly, and rework are especially susceptible to contamination. Moisture and loose particles are identified as the worst contaminants. The points at which contaminants are most likely to enter the hybrid package are also identified, and both general and specific methods for their detection and control are developed. In general, the most effective controls for contaminants are: clean working areas, visual inspection at each step of the process, and effective cleaning at critical process steps. Specific methods suggested include the detection of loose particles by a precap visual inspection, by preseal and post-seal electrical testing, and by a particle impact noise test. Moisture is best controlled by sealing all packages in a clean, dry, inert atmosphere after a thorough bake-out of all parts

Metallisation and structuring of low temperature Co-fired ceramic for micro and millimetre wave applications

The recent developments in Low Temperature Co-fired Ceramic (LTCC) as a substrate material enable it to be used in the micro and millimetre wave range providing low dissipation factors at high frequencies, good dielectric properties and a high degree of integration for further miniaturised devices. The most common metallisation method used in LTCC technology is screen printing with high cost noble metals such as silver and gold that are compatible with the high sintering temperatures (8500C). However, these techniques require high capital cost and maintenance cost. As the commercial world requires convenient and low cost process technologies for mass production, alternative metallisation methods should be considered. As a result, electroless copper plating of fired LTCC was mainly investigated in this research. The main goals of this project were to carry out electroless plating of fired LTCC with sufficient adhesion and to extend the process to metallise closed LTCC channel structures to manufacture Substrate Integrated Waveguide (SIW) components. The objectives were focused on electroless copper deposition on fired LTCC with improved adhesion. Electroless deposits on the Sn/Pd activated LTCC surface showed poor adhesion without any surface pre-treatments. Hence, chemical etching of fired LTCC was carried out using concentrated NaOH solution. NaOH pre-treatment of LTCC led to the formation of flake like structures on the LTCC surface. A number of surface and chemical analysis techniques and weight measurements were used to investigate the mechanism of the modification of the LTCC surface. The results showed that the flake like structures were dispersed in the LTCC material and a material model for the LTCC structure was proposed. SEM EDX elemental mapping showed that the flake like structure consisted of aluminium, calcium, boron and oxygen. Further experiments showed that both the concentration of NaOH and the immersion time affect the surface morphology and the roughness of fired LTCC. The measured Ra values were 0.6 m for untreated LTCC and 1.1 m for the LTCC sample treated with 4M NaOH for 270 minutes. Adhesion tests including peel test and scratch test were carried out to examine the adhesion strength of the deposited copper and both tests indicated that the NaOH pre-treatment led to an improvement, with the best results achieved for samples treated with 4M NaOH. A second aspect of the research focused on the selective metallisation of fired LTCC. Excimer laser machining was used to pattern a resist film laminated on the LTCC surface. This process also roughened the substrate and created channels that were characterised with respect to the laser operating parameters. After patterning the resist layer, samples were activated using Sn/Pd catalyst solution followed by the electroless copper deposition. Electroless copper was selectively deposited only on the patterned LTCC surface. Laser parameters clearly affected the copper plating rate. Even with a similar number of shots per area, the tracks machined with higher repetition rate showed relatively more machining depth as well as good plating conditions with low resistance values. The process was further implemented to realize a complete working circuit on fired LTCC. Passive components including a capacitor and an inductor were also fabricated on LTCC using the mask projection technique of the excimer laser system. This was successful for many designs, but when the separation between conductor lines dropped below 18 m, electroless copper started to deposit on the areas between them. Finally, a method to deposit copper films on the internal walls of closed channel structures was developed. The method was first demonstrated by flowing electroless copper solutions through silane treated glass capillaries. A thin layer (approx. 60 nm) of electroless copper was deposited only on the internal walls of the glass capillaries. The flow rate of the electroless copper solution had to be maintained at a low level as the copper deposits tended to wash away with higher flow rates. The structures were tested for transmission losses and showed low (<10dB) transmission losses in the terahertz region of the electromagnetic spectrum. The process was further applied to deposit electroless copper on the internal walls of the LTCC closed channel structures to manufacture a LTCC Substrate Integrated Waveguide (SIW)

Numerical Simulation of Laser Processing Materials: An Engineering Approach

The following chapter aims at giving an overview of the use of numerical simulation in the field of laser processing. Indeed, the past two decades saw an increasing demand for lasers in various areas such as healthcare, microelectronics, cartography, optoelectronics, aeronautics, etc. Thus, the comprehension of the laser-material interaction and the removal mechanism became primordial to predict and improve the efficiency of a process. After a nonexhaustive literature review, two simulation approaches (Finite Element and Design Of Experiment, DOE) will be presented to demonstrate the importance of numerical simulation in laser applications

Fabrication of Array Microstructures by Localized Electro-Deposition

Localized Electro-Deposition (LED) is now highly receiving scientists and researchers attention for its advantages over conventional fabrication techniques. These advantages include simplicity of the setup thus reducing the overall fabrication cost, capability of producing 2D and 3D high aspect ratio microstructures and its ability to fabricate microstructures from various raw materials. Efforts now are taking place in order to standardize the fabrication by LED to develop a commercial setup that is capable of producing complex microstructures which, in tum, can be integrated in different applications including microelectronics, microelectrochemical systems (MEMS) and sensors applications. The standardization process is performed by studying and optimizing all the parameters that control the LED process. In order to expand the current LED capabilities, this research thesis is investigating the feasibility of fabricating array of microstructures. These micro scale structures can be used as antenna arrays in ultra high frequency applications and also can be integrated in mechanical micro systems. In this work, two LED fabrication algorithms were introduced and compared to produce arrays of micro scale features: serial deposition and parallel deposition. In serial deposition algorithm, the conventional single tip microelectrode is used to realize high aspect ratio array elements by fabricating them serially (i.e. element by element), while in the parallel deposition algorithm; the same array is fabricated by using multi-tip array microelectrode where the array microstructures are fabricated simultaneously (all array elements grow in parallel fashion). The effects of microelectrode tip material, tip geometry and the used electrolyte (raw material) on the LED fabrication process are also presented. The new fabrication technology tested in this work enables the advancement of antennas for the upper GHz range. By implementing the parallel deposition technique outlined in this thesis, the resolution and repeatability will be enhanced and the required fabrication time of a micro system will be shorter thus enhancing the overall production rate

Light sensor platform based on the integration of Bacteriorhodopsin with a single electron transistor

This paper reports on the integration of an optical protein with single electron transistors to form a nano-bio-hybrid device for sensing. Bacteriorhodopsin (bR) is an optoelectric protein that translocates a proton across a distance of several nanometers in response to an absorbed photon of incident light. This charge gradient results in a measurable voltage in the dried state. Single electron transistors (SETs) have active regions consisting of one or more quantum islands with a size typically 10 nanometers or less. Integrating bacteriorhodopsin with the gate of a SET provides a device capable of a modulated electrical output in response to optical modulation at the device gate. Modulation of the optoelectric activity of the bR by chemical binding with a targeted environmental antigen can form a direct chemical-to-electrical sensor reducing the size and complexity of fluorescence-based systems. The work resulted in electrical resistance and capacitance characterization of purple membrane containing bR under variable illumination to ensure minimal impact on SET operation. Purple membrane containing bacteriorhodopsin was electrodeposited on the SET gates, and current throughput was well correlated with variable and cyclic illumination. It was confirmed that bR optoelectric activity is capable of driving SETs

Microstructural and Wear Behavior Characterization of Porous Layers Produced by Pulsed Laser Irradiation in Glass-Ceramics Substrates

In this work, wear behavior and microstructural characterization of porous layers produced in glass-ceramic substrates by pulsed laser irradiation in the nanosecond range are studied under unidirectional sliding conditions against AISI316 and corundum counterbodies. Depending on the optical configuration of the laser beam and on the working parameters, the local temperature and pressure applied over the interaction zone can generate a porous glass-ceramic layer. Material transference from the ball to the porous glass-ceramic layer was observed in the wear tests carried out against the AISI316 ball counterface whereas, in the case of the corundum ball, the wear volume loss was concentrated in the porous layer. Wear rate and friction coefficient presented higher values than expected for dense glass-ceramics