Desynchronization: Synthesis of asynchronous circuits from synchronous specifications

Asynchronous implementation techniques, which measure logic delays at run time and activate registers accordingly, are inherently more robust than their synchronous counterparts, which estimate worst-case delays at design time, and constrain the clock cycle accordingly. De-synchronization is a new paradigm to automate the design of asynchronous circuits from synchronous specifications, thus permitting widespread adoption of asynchronicity, without requiring special design skills or tools. In this paper, we first of all study different protocols for de-synchronization and formally prove their correctness, using techniques originally developed for distributed deployment of synchronous language specifications. We also provide a taxonomy of existing protocols for asynchronous latch controllers, covering in particular the four-phase handshake protocols devised in the literature for micro-pipelines. We then propose a new controller which exhibits provably maximal concurrency, and analyze the performance of desynchronized circuits with respect to the original synchronous optimized implementation. We finally prove the feasibility and effectiveness of our approach, by showing its application to a set of real designs, including a complete implementation of the DLX microprocessor architectur

A novel scan segmentation design method for avoiding shift timing failure in scan testing

ITC : 2011 IEEE International Test Conference , 20-22 Sep. 2011 , Anaheim, CA, USAHigh power consumption in scan testing can cause undue yield loss which has increasingly become a serious problem for deep-submicron VLSI circuits. Growing evidence attributes this problem to shift timing failures, which are primarily caused by excessive switching activity in the proximities of clock paths that tends to introduce severe clock skew due to IR-drop-induced delay increase. This paper is the first of its kind to address this critical issue with a novel layout-aware scheme based on scan segmentation design, called LCTI-SS (Low-Clock-Tree-Impact Scan Segmentation). An optimal combination of scan segments is identified for simultaneous clocking so that the switching activity in the proximities of clock trees is reduced while maintaining the average power reduction effect on conventional scan segmentation. Experimental results on benchmark and industrial circuits have demonstrated the advantage of the LCTI-SS scheme

Chippe : a system for constraint driven behavioral synthesis

This report describes the Chippe system, gives some background previous work and describes several sample design runs of the system. Also presented are the sources of the design tradeoffs used by Chippe, and overview of the internal design model, and experiences using the system

The status of US Teraflops-scale projects

The current status of United States projects pursuing Teraflops-scale computing resources for lattice field theory is discussed. Two projects are in existence at this time: the Multidisciplinary Teraflops Project, incorporating the physicists of the QCD Teraflops Collaboration, and a smaller project, centered at Columbia, involving the design and construction of a 0.8 Teraflops computer primarily for QCD.Comment: Contribution to Lattice 94. 7 pages. Latex source followed by compressed, uuenocded postscript file of the complete paper. Individual figures available from [email protected]

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Circuit design and analysis for on-FPGA communication systems

On-chip communication system has emerged as a prominently important subject in Very-Large- Scale-Integration (VLSI) design, as the trend of technology scaling favours logics more than interconnects. Interconnects often dictates the system performance, and, therefore, research for new methodologies and system architectures that deliver high-performance communication services across the chip is mandatory. The interconnect challenge is exacerbated in Field-Programmable Gate Array (FPGA), as a type of ASIC where the hardware can be programmed post-fabrication. Communication across an FPGA will be deteriorating as a result of interconnect scaling. The programmable fabrics, switches and the specific routing architecture also introduce additional latency and bandwidth degradation further hindering intra-chip communication performance. Past research efforts mainly focused on optimizing logic elements and functional units in FPGAs. Communication with programmable interconnect received little attention and is inadequately understood. This thesis is among the first to research on-chip communication systems that are built on top of programmable fabrics and proposes methodologies to maximize the interconnect throughput performance. There are three major contributions in this thesis: (i) an analysis of on-chip interconnect fringing, which degrades the bandwidth of communication channels due to routing congestions in reconfigurable architectures; (ii) a new analogue wave signalling scheme that significantly improves the interconnect throughput by exploiting the fundamental electrical characteristics of the reconfigurable interconnect structures. This new scheme can potentially mitigate the interconnect scaling challenges. (iii) a novel Dynamic Programming (DP)-network to provide adaptive routing in network-on-chip (NoC) systems. The DP-network architecture performs runtime optimization for route planning and dynamic routing which, effectively utilizes the in-silicon bandwidth. This thesis explores a new horizon in reconfigurable system design, in which new methodologies and concepts are proposed to enhance the on-FPGA communication throughput performance that is of vital importance in new technology processes

Measurements, Models, Systems and Design

531 s.