Temperature-Aware Leakage Minimization Techniques for Real-Time Systems

In this paper, we study the interdependencies between system's leakage and on-chip temperature. We show that the temperature variation caused by on-chip heat accumulation has a large impact in estimating the system's leakage energy. More importantly, we propose an online temperature-aware leakage minimization technique to demonstrate how to incorporate the temperature information to reduce energy consumption at real time. The basic idea is to run when the system is cool and the workload is high and to put the system to sleep when it is hot and the workload is light. The online algorithm has low run-time complexity and achieves significant leakage energy saving. In fact, we are able to get about 25% leakage reduction on both real life and artificial benchmarks. Comparing to our optimal offline algorithm, the above online algorithm provides similar energy savings with similar decisions on how to put the system to sleep and how to wake it up. Finally, our temperature-aware leakage minimization techniques can be combined with existing DVS methods to improve the total energy efficiency by further saving on leakage

The Thermal-Constrained Real-Time Systems Design on Multi-Core Platforms -- An Analytical Approach

Over the past decades, the shrinking transistor size enabled more transistors to be integrated into an IC chip, to achieve higher and higher computing performances. However, the semiconductor industry is now reaching a saturation point of Moore’s Law largely due to soaring power consumption and heat dissipation, among other factors. High chip temperature not only significantly increases packing/cooling cost, degrades system performance and reliability, but also increases the energy consumption and even damages the chip permanently. Although designing 2D and even 3D multi-core processors helps to lower the power/thermal barrier for single-core architectures by exploring the thread/process level parallelism, the higher power density and longer heat removal path has made the thermal problem substantially more challenging, surpassing the heat dissipation capability of traditional cooling mechanisms such as cooling fan, heat sink, heat spread, etc., in the design of new generations of computing systems. As a result, dynamic thermal management (DTM), i.e. to control the thermal behavior by dynamically varying computing performance and workload allocation on an IC chip, has been well-recognized as an effective strategy to deal with the thermal challenges. Over the past decades, the shrinking transistor size, benefited from the advancement of IC technology, enabled more transistors to be integrated into an IC chip, to achieve higher and higher computing performances. However, the semiconductor industry is now reaching a saturation point of Moore’s Law largely due to soaring power consumption and heat dissipation, among other factors. High chip temperature not only significantly increases packing/cooling cost, degrades system performance and reliability, but also increases the energy consumption and even damages the chip permanently. Although designing 2D and even 3D multi-core processors helps to lower the power/thermal barrier for single-core architectures by exploring the thread/process level parallelism, the higher power density and longer heat removal path has made the thermal problem substantially more challenging, surpassing the heat dissipation capability of traditional cooling mechanisms such as cooling fan, heat sink, heat spread, etc., in the design of new generations of computing systems. As a result, dynamic thermal management (DTM), i.e. to control the thermal behavior by dynamically varying computing performance and workload allocation on an IC chip, has been well-recognized as an effective strategy to deal with the thermal challenges. Different from many existing DTM heuristics that are based on simple intuitions, we seek to address the thermal problems through a rigorous analytical approach, to achieve the high predictability requirement in real-time system design. In this regard, we have made a number of important contributions. First, we develop a series of lemmas and theorems that are general enough to uncover the fundamental principles and characteristics with regard to the thermal model, peak temperature identification and peak temperature reduction, which are key to thermal-constrained real-time computer system design. Second, we develop a design-time frequency and voltage oscillating approach on multi-core platforms, which can greatly enhance the system throughput and its service capacity. Third, different from the traditional workload balancing approach, we develop a thermal-balancing approach that can substantially improve the energy efficiency and task partitioning feasibility, especially when the system utilization is high or with a tight temperature constraint. The significance of our research is that, not only can our proposed algorithms on throughput maximization and energy conservation outperform existing work significantly as demonstrated in our extensive experimental results, the theoretical results in our research are very general and can greatly benefit other thermal-related research

Enhancing Power Efficient Design Techniques in Deep Submicron Era

Excessive power dissipation has been one of the major bottlenecks for design and manufacture in the past couple of decades. Power efficient design has become more and more challenging when technology scales down to the deep submicron era that features the dominance of leakage, the manufacture variation, the on-chip temperature variation and higher reliability requirements, among others. Most of the computer aided design (CAD) tools and algorithms currently used in industry were developed in the pre deep submicron era and did not consider the new features explicitly and adequately. Recent research advances in deep submicron design, such as the mechanisms of leakage, the source and characterization of manufacture variation, the cause and models of on-chip temperature variation, provide us the opportunity to incorporate these important issues in power efficient design. We explore this opportunity in this dissertation by demonstrating that significant power reduction can be achieved with only minor modification to the existing CAD tools and algorithms. First, we consider peak current, which has become critical for circuit's reliability in deep submicron design. Traditional low power design techniques focus on the reduction of average power. We propose to reduce peak current while keeping the overhead on average power as small as possible. Second, dual Vt technique and gate sizing have been used simultaneously for leakage savings. However, this approach becomes less effective in deep submicron design. We propose to use the newly developed process-induced mechanical stress to enhance its performance. Finally, in deep submicron design, the impact of on-chip temperature variation on leakage and performance becomes more and more significant. We propose a temperature-aware dual Vt approach to alleviate hot spots and achieve further leakage reduction. We also consider this leakage-temperature dependency in the dynamic voltage scaling approach and discover that a commonly accepted result is incorrect for the current technology. We conduct extensive experiments with popular design benchmarks, using the latest industry CAD tools and design libraries. The results show that our proposed enhancements are promising in power saving and are practical to solve the low power design challenges in deep submicron era

Real-Time Systems

Since 2004, most of chip vendors have begun to shift their major focus from single-core to multi-core architecture (W. Wolf. Signal Processing Magazine, IEEE, 26(6):50–54, 2009). One major reason of this shift is that it reaches a physical limit by scaling transistor size and increasing the clock frequency to improve the computing performance on a single-core architecture (Agarwal et al. Proceedings of the 27th International Symposium on, pages 248–259, June 2000), that is, the overall chip cannot be reached within a single clock cycle. Multi-core architecture, however, brings innovative and promising opportunities to further improve the computing performance. By providing multiple processing cores on a single chip, multi-core systems can dramatically increase the computing performance and mitigate the power and thermal issues with the same performance achievement as single-core systems. As multi-core architecture has been more and more dominant in the industrial market, there is an urgent demand for effective and efficient techniques for the design of multi-core systems

Voltage Set-up Problem on Embedded Systems with Multiple Voltages

Dynamic voltage scaling (DVS), arguably the most effective energy reduction technique, can be enabled by having multiple voltages physically implemented on the chip and allowing the operating system to decide which voltage to use at run-time. Indeed, this is predicted as the future low-power system by International Technology Roadmap for Semiconductors (ITRS). There still exist many important unsolved problems on how to reduce the system's dynamic and/or total power by DVS. One of such problems, which we refer to as the voltage set-up problem, is "how many levels and at which values should voltages be implemented for the system to achieve the maximum energy saving". It challenges whether DVS technique's full potential in energy saving can be reached on multiple-voltage systems. In this paper, (1) we derive analytical solutions for dual-voltage system. (2) For the general case that does not have analytic solutions, we develop efficient numerical methods that can take the overhead of voltage switch and leakage into account. (3) We demonstrate how to apply the proposed algorithms on system design. (4) Interestingly, the experimental results, on both real life DSP applications and random created applications, suggest that multiple-voltage DVS systems with only a couple levels of voltages, when set up properly, can be very close to DVS technique's full potential in energy saving. Parts of this report were published in IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Vol. 13, No. 7, pp. 869-872, July 2005

Applying real-time interface and calculus for dynamic power management in hard real-time systems

Power dissipation has been an important design issue for a wide range of computer systems in the past decades. Dynamic power consumption due to signal switching activities and static power consumption due to leakage current are the two major sources of power consumption in a CMOS circuit. As CMOS technology advances towards deep sub-micron domain, static power dissipation is comparable to or even more than dynamic power dissipation. This article explores how to apply dynamic power management to reduce static power for hard real-time systems. We propose online algorithms that adaptively control the power mode of a system, procrastinating the processing of arrived events as late as possible. To cope with multiple event streams with different characteristics, we provide solutions for preemptive earliest-deadline-first and fixed-priority scheduling policies. By adopting a worst-case interval-based abstraction, our approach can not only tackle arbitrary event arrivals, e.g., with burstiness, but also guarantee hard real-time requirements with respect to both timing and backlog constraints. We also present extensive simulation results to demonstrate the effectiveness of our approache

Energy-aware scheduling of bag-of-tasks applications on master-worker platforms

International audienceWe consider the problem of scheduling an application composed of independent tasks on a fully heterogeneous master-worker platform with communication costs. We introduce a bi-criteria approach aiming at maximizing the throughput of the application while minimizing the energy consumed by participating resources. Assuming arbitrary super-linear power consumption laws, we investigate different models, with energy overheads and memory constraints. Building upon closed-form expressions for the uni-processor case, we derive asymptotically optimal solutions for all models

Towards Optimal Application Mapping for Energy-Efficient Many-Core Platforms

Siirretty Doriast