Low-cost, precision, self-alignment technique for coupling laser and photodiode arrays to polymer waveguide arrays on multilayer PCBs

The first, to our knowledge, passive, precision, self-alignment technique for direct coupling of vertical cavity surface emitting laser (VCSEL) and photodiode (PD) arrays to an array of polymer buried channel waveguides on a rigid printed circuit board (PCB) is reported. It gives insertion losses as good as the best achieved previously, to within experimental measurement accuracy, but without the need for costly active alignment nor waveguide facet polishing and so is a major step towards a commercially realizable low cost connector. Such an optical connector with four duplex channels each operating at 10 Gb/s (80 Gb/s aggregate) was designed, constructed, and its alignment precision assessed. The alignment technique is applicable to polymer waveguide interconnections on both rigid and flexible multilayer printed circuit boards (PCBs). The dependence of optical coupling loss on mis-alignments in x, y and z of the VCSEL and PD arrays allows the precision of alignment to be assessed and its reproducibility on multiple mating cycles of the connector is reported. The first recorded measurements of crosstalk between waveguides when the connector is misaligned are reported. Lateral misalignments of the connector to within its tolerance are shown to have no effect on the signal to crosstalk ratio (SCR), to within experimental measurement accuracy. The insertion loss repeatability is similar to that of single mode fiber mechanically transferable (MT) connectors

Integrated Optical and Electronic PCB Manufacturing

In high speed digital systems the signals travel through copper track interconnections in Printed Circuit Boards (PCBs) but suffer loss, radiation, cross-talk, electromagnetic interference (EMI), and corruption limiting the maximum speed and interconnect distance so costly low loss dielectrics, pulse pre-emphasis, adaptive equalization and high levels of Forward Error Correction (FEC) must be used. This paper describes a lower cost approach using optical interconnections for the highest speed interconnects, This optical approach is scalable to large area PCBs and bit rates in excess of 10 Gb/s and makes use of multimode polymer waveguides butt coupled via dismountable, self aligning connectors to VCSEL laser and PIN photodiode arrays. The optical PCB (OPCB) 3 university and 10 company consortium, formed and led by the speaker constitutes a supply chain including waveguide modeling, OPCB layout, polymer manufacturing, OPCB manufacturing with route to exploitation in storage system, aerospace and optical sensor markets. The consortium’s research is reviewed including the establishment of waveguide design rules by measurement and simulation to build into PCB layout tools enabling the easy widespread adoption of this disruptive technology. Manufacturing technologies studied for acrylate and polysiloxane waveguides include photolithography, laser ablation, laser direct write, embossing, extrusion and ink jet printing

Integrated optical and electronic PCB manufacturing: invited plenary talk

In high speed digital systems the signals travel through copper track interconnections in Printed Circuit Boards (PCBs) but suffer loss, radiation, cross-talk, electromagnetic interference (EMI), and corruption limiting the maximum speed and interconnect distance so costly low loss dielectrics, pulse pre-emphasis, adaptive equalization and high levels of Forward Error Correction (FEC) must be used. This paper describes a lower cost approach using optical interconnections for the highest speed interconnects, This optical approach is scalable to large area PCBs and bit rates in excess of 10 Gb/s and makes use of multimode polymer waveguides butt coupled via dismountable, self aligning connectors to VCSEL laser and PIN photodiode arrays. The optical PCB (OPCB) 3 university and 10 company consortium, formed and led by the speaker constitutes a supply chain including waveguide modeling, OPCB layout, polymer manufacturing, OPCB manufacturing with route to exploitation in storage system, aerospace and optical sensor markets. The consortium’s research is reviewed including the establishment of waveguide design rules by measurement and simulation to build into PCB layout tools enabling the easy widespread adoption of this disruptive technology. Manufacturing technologies studied for acrylate and polysiloxane waveguides include photolithography, laser ablation, laser direct write, embossing, extrusion and ink jet printing

Photovoltaic stand-alone modular systems, phase 2

The final hardware and system qualification phase of a two part stand-alone photovoltaic (PV) system development is covered. The final design incorporated modular, power blocks capable of expanding incrementally from 320 watts to twenty kilowatts (PK). The basic power unit (PU) was nominally rated 1.28 kWp. The controls units, power collection buses and main lugs, electrical protection subsystems, power switching, and load management circuits are housed in a common control enclosure. Photo-voltaic modules are electrically connected in a horizontal daisy-chain method via Amp Solarlok plugs mating with compatible connectors installed on the back side of each photovoltaic module. A pair of channel rails accommodate the mounting of the modules into a frameless panel support structure. Foundations are of a unique planter (tub-like) configuration to allow for world-wide deployment without restriction as to types of soil. One battery string capable of supplying approximately 240 ampere hours nominal of carryover power is specified for each basic power unit. Load prioritization and shedding circuits are included to protect critical loads and selectively shed and defer lower priority or noncritical power demands. The baseline system, operating at approximately 2 1/2 PUs (3.2 kW pk.) was installed and deployed. Qualification was successfully complete in March 1983; since that time, the demonstration system has logged approximately 3000 hours of continuous operation under load without major incident

Enhanced electrodeposition for the filling of micro-vias

This thesis investigated the introduction of megasound (MS) (1MHz) acoustic technology as an enhanced agitation method of an electrolyte solution for the electrochemical deposition of copper (Cu), used in electroplating processes. The thesis, carried out at Merlin Circuit Technology Ltd, studied the possibility of improving processing capabilities for use in Printed Circuit Board (PCB) industrial manufacture. Prior laboratory experiments demonstrated increased metallisation of vertical interconnect access (via) features in a Printed Circuit Board (PCB), which, if applied within manufacturing, would enable increased connectivity throughout a PCB and result in cost savings. PCB manufacturing quality after MS-assisted Cu electroplating was assessed by measurements of the topography of the electrodeposits, using scanning electron microscopy and white-light interferometry. Cu plating rate changes were also measured on the surface of the PCB and inside the vias. After plating Cu with MS-assistance, the macro and microscale surface composition was demonstrated to alter due to the direct influence of the acoustic waves. Systematic characteristic of the surface was conducted by varying the settings of the acoustic transducer device as well as the process parameters including electrical current distribution, bath additive chemistry and solution temperature. MS processing was shown to produce unique Cu artefacts. Their deleterious formation was demonstrated to be influenced by acoustic standing waves and microbubble formations at the electrolyte solution/PCB interface. Causes of these artefacts, microfluidic streaming and cavitation, were also observed and controlled to reduce the creation of these artefacts. MS plating Cu down through-hole via (THV) and blind-via (BV) interconnects was shown to produce measureable benefits. These include, for THVs, a 700 % increase of Cu plating deposit thickness within a 175 μm diameter, depth-to-width aspect ratio (ar) of 5.7:1, compared with processing under no-agitation conditions. For BVs, a 60 % average increase in Cu deposition in 150 μm and 200 μm, ar 1:1, was demonstrated against plating under standard manufacturing conditions - bubble agitation and panel movement.Engineering and Physical Research Council (EPSRC) grant number EP/G037523/

Integration of optical interconnections and optoelectronic components in flexible substrates

Licht als informatiedrager voor datacommunicatie kende een ongezien succes in de laatste decennia. Wegens de lage verliezen en hoge datasnelheden hebben ze voor het overbruggen van lange afstanden hun elektrische tegenhangers reeds geruime tijd verdrongen. Deze trend zet zich ook voort voor korte afstand communicatie op printplaten. Naast zijn functie als informatiedrager, wordt licht ook gebruikt om een waaier aan fysische grootheden te meten. Ook hier heeft licht enkele significante voordelen t.o.v elektrische informatiedragers, waardoor optische sensoren wijdverspreid zijn. Een tweede duidelijke trend binnen de elektronica is het gebruik van flexibele printkaarten. Deze zijn veel dunner, lichter en betrouwbaarder dan de klassieke harde printkaarten, waardoor ze uiterst geschikt zijn voor draagbare toepassingen waar compactheid en een laag gewicht hoge vereisten zijn. De flexibiliteit van de printplaten laat ook toe hen te gebruiken op onvlakke oppervlakken en op bewegende onderdelen. Het doel van het gepresenteerde doctoraatswerk is de ontwikkeling van een nieuw technologieplatform dat bovengenoemde trends combineert. Alle bouwblokken van optische communicatie, gaande van actieve opto-elektronische componenten, aanstuurelektronica, golfgeleiderbaantjes en galvanische verbindingen tot optische koppelstructuren tussen de verschillende bouwblokken, worden zodanig gerealiseerd dat elke component flexibel is en geïntegreerd wordt in een dunne folie met een dikte van slechts 150µm. Op die manier bekomen we een flexibele folie met alle passieve en actieve onderdelen voor optische communicatie geïntegreerd met enkel een elektrische interface naar de buitenwereld, wat de aanvaarding en toepassing van deze technologie in de huidige elektronica aanzienlijk kan versnellen. Binnen het doctoraatswerk werden alle voorgestelde technologieën en processen gerealiseerd en geoptimaliseerd. Bovendien werden de optische verliezen, warmteaspecten, hoogfrequent gedrag, mechanisch gedrag en betrouwbaarheid van de technologie gekarakteriseerd en vergeleken met de huidige state-of-the-art

Flexible stretchable electronics for sport and wellbeing applications

Wearable electronics are becoming increasingly widespread in modern society. Though these devices are intended to be worn, integrated into clothing and other everyday objects, the technologies and processes used to manufacture them is no different than those that manufacture laptops and mobile phones. Many of these devices are intended to monitor the user’s health, activity and general wellbeing, within clinical, recreational and assistive environments. Consequently, the inherent incompatibility of these rigid devices with the soft, elastic structure of the human body can in some cases can be uncomfortable and inconvenient for everyday life. For devices to take the step from a ‘wearable’ to an ‘invisible’, a drastic rethinking of electronics manufacturing is required.The fundamental aim of this research is to establish parameters of usefulness and an array of materials with complimentary processes that would assist in transitioning devices to long term almost invisible items that can assist in improving the health of the wearer. In order to approach this problem, a novel architecture was devised that utilised PDMS as a substrate and microfluid channels of Galinstan liquid alloy for interconnects. CO2 laser machining was investigated as a means of creating channels and vias on PDMS substrates. Trace speeds and laser power outputs were investigated in order to find an optimal combination. The results displayed upper limits for power densities; where surpassing this limit resulted in poor repeatability and surface finish. It was found that there was an optimal set of trace speeds that ranged from approximately 120mm/s to 190mm/s that resulted in the most reliable and repeatable performance. Due to the complex nature of a materials variable energy absorption properties, it is not possible to quantify a single optimal parameter set.To understand the performance of these devices in situ, finite element analysis was employed to model deformations that such a device could experience. The aims here were to investigate the bond strength required to prevent delamination, between the silicon-PDMS and PDMS-PDMS bonds, in addition to the stress applied to the silicone die during these deformations. Based upon the applied loads the required bond strengths would need to be at least ~65kPa to maintain PDMS-PDMS adhesion during these tests, while stress on the silicone-PDMS adhesion required an expected v higher ~160kPa, both of which are within the reach of existing bonding techniques that are capable of withstanding a pressure of ~600kPa before failure occurs. Stress on the silicon die did not exceed ~7.8 MPa during simulation, which is well below the fracture stress.By developing knowledge about how various components of such a system will respond during use and under stress, it allows future engineers to make informed design decisions and develop better more resilient products.</div

Electric power for space satellites

The development of electric power systems for satellites is discussed as an evolutionary process requiring the integration of power generation, power storage, and power control and distribution. The growth of space electric power systems is traced. The capabilities and limitations of the various elements (i.e. silicon solar cells) are discussed together with their impact on future technological growth

Materials for high-density electronic packaging and interconnection

Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production

Pluggable Optical Connector Interfaces for Electro-Optical Circuit Boards

A study is hereby presented on system embedded photonic interconnect technologies, which would address the communications bottleneck in modern exascale data centre systems driven by exponentially rising consumption of digital information and the associated complexity of intra-data centre network management along with dwindling data storage capacities. It is proposed that this bottleneck be addressed by adopting within the system electro-optical printed circuit boards (OPCBs), on which conventional electrical layers provide power distribution and static or low speed signaling, but high speed signals are conveyed by optical channels on separate embedded optical layers. One crucial prerequisite towards adopting OPCBs in modern data storage and switch systems is a reliable method of optically connecting peripheral cards and devices within the system to an OPCB backplane or motherboard in a pluggable manner. However the large mechanical misalignment tolerances between connecting cards and devices inherent to such systems are contrasted by the small sizes of optical waveguides required to support optical communication at the speeds defined by prevailing communication protocols. An innovative approach is therefore required to decouple the contrasting mechanical tolerances in the electrical and optical domains in the system in order to enable reliable pluggable optical connectivity. This thesis presents the design, development and characterisation of a suite of new optical waveguide connector interface solutions for electro-optical printed circuit boards (OPCBs) based on embedded planar polymer waveguides and planar glass waveguides. The technologies described include waveguide receptacles allowing parallel fibre connectors to be connected directly to OPCB embedded planar waveguides and board-to-board connectors with embedded parallel optical transceivers allowing daughtercards to be orthogonally connected to an OPCB backplane. For OPCBs based on embedded planar polymer waveguides and embedded planar glass waveguides, a complete demonstration platform was designed and developed to evaluate the connector interfaces and the associated embedded optical interconnect. Furthermore a large portfolio of intellectual property comprising 19 patents and patent applications was generated during the course of this study, spanning the field of OPCBs, optical waveguides, optical connectors, optical assembly and system embedded optical interconnects