Power Reductions with Energy Recovery Using Resonant Topologies

The problem of power densities in system-on-chips (SoCs) and processors has become more exacerbated recently, resulting in high cooling costs and reliability issues. One of the largest components of power consumption is the low skew clock distribution network (CDN), driving large load capacitance. This can consume as much as 70% of the total dynamic power that is lost as heat, needing elaborate sensing and cooling mechanisms. To mitigate this, resonant clocking has been utilized in several applications over the past decade. An improved energy recovering reconfigurable generalized series resonance (GSR) solution with all the critical support circuitry is developed in this work. This LC resonant clock driver is shown to save about 50% driver power (\u3e40% overall), on a 22nm process node and has 50% less skew than a non-resonant driver at 2GHz. It can operate down to 0.2GHz to support other energy savings techniques like dynamic voltage and frequency scaling (DVFS). As an example, GSR can be configured for the simpler pulse series resonance (PSR) operation to enable further power saving for double data rate (DDR) applications, by using de-skewing latches instead of flip-flop banks. A PSR based subsystem for 40% savings in clocking power with 40% driver active area reduction xii is demonstrated. This new resonant driver generates tracking pulses at each transition of clock for dual edge operation across DVFS. PSR clocking is designed to drive explicit-pulsed latches with negative setup time. Simulations using 45nm IBM/PTM device and interconnect technology models, clocking 1024 flip-flops show the reductions, compared to non-resonant clocking. DVFS range from 2GHz/1.3V to 200MHz/0.5V is obtained. The PSR frequency is set \u3e3× the clock rate, needing only 1/10th the inductance of prior-art LC resonance schemes. The skew reductions are achieved without needing to increase the interconnect widths owing to negative set-up times. Applications in data circuits are shown as well with a 90nm example. Parallel resonant and split-driver non-resonant configurations as well are derived from GSR. Tradeoffs in timing performance versus power, based on theoretical analysis, are compared for the first time and verified. This enables synthesis of an optimal topology for a given application from the GSR

Research on low power technology by AC power supply circuits

制度:新 ; 報告番号:甲3692号 ; 学位の種類:博士(工学) ; 授与年月日:2012/9/15 ; 早大学位記番号:新6060Waseda Universit

A Bang-Bang All-Digital PLL for Frequency Synthesis

abstract: Phase locked loops are an integral part of any electronic system that requires a clock signal and find use in a broad range of applications such as clock and data recovery circuits for high speed serial I/O and frequency synthesizers for RF transceivers and ADCs. Traditionally, PLLs have been primarily analog in nature and since the development of the charge pump PLL, they have almost exclusively been analog. Recently, however, much research has been focused on ADPLLs because of their scalability, flexibility and higher noise immunity. This research investigates some of the latest all-digital PLL architectures and discusses the qualities and tradeoffs of each. A highly flexible and scalable all-digital PLL based frequency synthesizer is implemented in 180 nm CMOS process. This implementation makes use of a binary phase detector, also commonly called a bang-bang phase detector, which has potential of use in high-speed, sub-micron processes due to the simplicity of the phase detector which can be implemented with a simple D flip flop. Due to the nonlinearity introduced by the phase detector, there are certain performance limitations. This architecture incorporates a separate frequency control loop which can alleviate some of these limitations, such as lock range and acquisition time.Dissertation/ThesisM.S. Electrical Engineering 201

Digital Phase Locked-Loop With Wide Tuning Range And Dynamic Phase Shift

For decades, Phase Lock Loop (PLL) has been widely used in numerous systems, such as telecommunications and digital design, where it plays significant role in improving overall system timing. Moving forward, with the latest revolution towards System-on-chip technology (SOC), the need of PLL in the form of Integrated Circuits has been growing tremendously. Core of this research is to design a PLL with wide tuning range and dynamic phase shift feature, which is implemented in the Integrated Circuits level. In line with fierce competition and fast-paced semiconductor industry, PLL design with above features are definitely most sought after, as it will tremendously reduce turn-around time, cost and effort for a project. Wide tuning range is achieved by introducing new Voltage Control Oscillator architecture, which will be able to provide wide tuning range without using very high KVCO. The new architecture proposed in this project is in differential input structure and consists of MOSFETs and capacitors; thus the area of implementation is small.Besides, extra feature which is proposed in this PLL is Dynamic Phase Shift feature. Dynamically tunable phase shift is important since the accuracy of the phase could be adjusted without having to reprogram the PLL, thus saving a lot of time. Dynamic Phase Shift feature is a new idea, which its design is implemented by using UP/DOWN counters, OR and AND gates. The complete design includes synchronous system design work such as state machine, diagram and truth table for system simplification. This proposed design achieved all specifications with wide-tuning range of 600MHz to 1300MHz is achieved with control voltage swing of 0.9V to 1.5V. Besides, the maximum static phase error measured in the simulation is 66ps, which is smaller than 200ps specification. Highest Period Jitter is 181ps while Cycle-to-Cycle Jitter is 55ps. Both types of jitter are within specification; lower than 300ps. Dynamic Phase Shift also successfully implemented where the UP/DN signal as the control to indicate either the phase is to be shifted up or down

Scalable Energy-Recovery Architectures.

Energy efficiency is a critical challenge for today's integrated circuits, especially for high-end digital signal processing and communications that require both high throughput and low energy dissipation for extended battery life. Charge-recovery logic recovers and reuses charge using inductive elements and has the potential to achieve order-of-magnitude improvement in energy efficiency while maintaining high performance. However, the lack of large-scale high-speed silicon demonstrations and inductor area overheads are two major concerns. This dissertation focuses on scalable charge-recovery designs. We present a semi-automated design flow to enable the design of large-scale charge-recovery chips. We also present a new architecture that uses in-package inductors, eliminating the area overheads caused by the use of integrated inductors in high-performance charge-recovery chips. To demonstrate our semi-automated flow, which uses custom-designed standard-cell-like dynamic cells, we have designed a 576-bit charge-recovery low-density parity-check (LDPC) decoder chip. Functioning correctly at clock speeds above 1 GHz, this prototype is the first-ever demonstration of a GHz-speed charge-recovery chip of significant complexity. In terms of energy consumption, this chip improves over recent state-of-the-art LDPCs by at least 1.3 times with comparable or better area efficiency. To demonstrate our architecture for eliminating inductor overheads, we have designed a charge-recovery LDPC decoder chip with in-package inductors. This test-chip has been fabricated in a 65nm CMOS flip-chip process. A custom 6-layer FC-BGA package substrate has been designed with 16 inductors embedded in the fifth layer of the package substrate, yielding higher Q and significantly improving area efficiency and energy efficiency compared to their on-chip counterparts. From measurements, this chip achieves at least 2.3 times lower energy consumption with better area efficiency over state-of-the-art published designs.PhDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/116653/1/terryou_1.pd

Multi-Loop-Ring-Oscillator Design and Analysis for Sub-Micron CMOS

Ring oscillators provide a central role in timing circuits for today?s mobile devices and desktop computers. Increased integration in these devices exacerbates switching noise on the supply, necessitating improved supply resilience. Furthermore, reduced voltage headroom in submicron technologies limits the number of stacked transistors available in a delay cell. Hence, conventional single-loop oscillators offer relatively few design options to achieve desired specifications, such as supply rejection. Existing state-of-the-art supply-rejection- enhancement methods include actively regulating the supply with an LDO, employing a fully differential or current-starved delay cell, using a hi-Z voltage-to-current converter, or compensating/calibrating the delay cell. Multiloop ring oscillators (MROs) offer an additional solution because by employing a more complex ring-connection structure and associated delay cell, the designer obtains an additional degree of freedom to meet the desired specifications. Designing these more complex multiloop structures to start reliably and achieve the desired performance requires a systematic analysis procedure, which we attack on two fronts: (1) a generalized delay-cell viewpoint of the MRO structure to assist in both analysis and circuit layout, and (2) a survey of phase-noise analysis to provide a bank of methods to analyze MRO phase noise. We distill the salient phase-noise-analysis concepts/key equations previously developed to facilitate MRO and other non-conventional oscillator analysis. Furthermore, our proposed analysis framework demonstrates that all these methods boil down to obtaining three things: (1) noise modulation function (NMF), (2) noise transfer function (NTF), and (3) current-controlled-oscillator gain (KICO). As a case study, we detail the design, analysis, and measurement of a proposed multiloop ring oscillator structure that provides improved power-supply isolation (more than 20dB increase in supply rejection over a conventional-oscillator control case fabricated on the same test chip). Applying our general multi-loop-oscillator framework to this proposed MRO circuit leads both to design-oriented expressions for the oscillation frequency and supply rejection as well as to an efficient layout technique facilitating cross-coupling for improved quadrature accuracy and systematic, substantially simplified layout effort

Study of voltage controlled oscillator based analog-to-digital converter

A voltage controlled oscillator (VCO) based analog-to-digital converter (ADC) is a time based architecture with a first-order noise-shaping property, which can be implemented using a VCO and digital circuits. This thesis analyzes the performance of VCO-based ADCs in the presence of non idealities such as jitter, nonlinearity, mismatch, and the metastability of D flip-flops. Based on this analysis, design criteria for determining parameters for VCO-based ADCs are described. Further, the study involves the use of VCO based Dual-slope A/D converter and its behaviour under different input voltage level. Graph is plotted between output voltages of the integrator vs. time. Digital circuits like a bit-counter and logic circuits are used for operation mode. A normal VCO model is also done in MATLAB-simulink environment and studied under variable input frequency and corresponding output plots are view

Multi-Loop-Ring-Oscillator Design and Analysis for Sub-Micron CMOS

Ring oscillators provide a central role in timing circuits for today?s mobile devices and desktop computers. Increased integration in these devices exacerbates switching noise on the supply, necessitating improved supply resilience. Furthermore, reduced voltage headroom in submicron technologies limits the number of stacked transistors available in a delay cell. Hence, conventional single-loop oscillators offer relatively few design options to achieve desired specifications, such as supply rejection. Existing state-of-the-art supply-rejection- enhancement methods include actively regulating the supply with an LDO, employing a fully differential or current-starved delay cell, using a hi-Z voltage-to-current converter, or compensating/calibrating the delay cell. Multiloop ring oscillators (MROs) offer an additional solution because by employing a more complex ring-connection structure and associated delay cell, the designer obtains an additional degree of freedom to meet the desired specifications. Designing these more complex multiloop structures to start reliably and achieve the desired performance requires a systematic analysis procedure, which we attack on two fronts: (1) a generalized delay-cell viewpoint of the MRO structure to assist in both analysis and circuit layout, and (2) a survey of phase-noise analysis to provide a bank of methods to analyze MRO phase noise. We distill the salient phase-noise-analysis concepts/key equations previously developed to facilitate MRO and other non-conventional oscillator analysis. Furthermore, our proposed analysis framework demonstrates that all these methods boil down to obtaining three things: (1) noise modulation function (NMF), (2) noise transfer function (NTF), and (3) current-controlled-oscillator gain (KICO). As a case study, we detail the design, analysis, and measurement of a proposed multiloop ring oscillator structure that provides improved power-supply isolation (more than 20dB increase in supply rejection over a conventional-oscillator control case fabricated on the same test chip). Applying our general multi-loop-oscillator framework to this proposed MRO circuit leads both to design-oriented expressions for the oscillation frequency and supply rejection as well as to an efficient layout technique facilitating cross-coupling for improved quadrature accuracy and systematic, substantially simplified layout effort

High Performance Optical Transmitter Ffr Next Generation Supercomputing and Data Communication

High speed optical interconnects consuming low power at affordable prices are always a major area of research focus. For the backbone network infrastructure, the need for more bandwidth driven by streaming video and other data intensive applications such as cloud computing has been steadily pushing the link speed to the 40Gb/s and 100Gb/s domain. However, high power consumption, low link density and high cost seriously prevent traditional optical transceiver from being the next generation of optical link technology. For short reach communications, such as interconnects in supercomputers, the issues related to the existing electrical links become a major bottleneck for the next generation of High Performance Computing (HPC). Both applications are seeking for an innovative solution of optical links to tackle those current issues. In order to target the next generation of supercomputers and data communication, we propose to develop a high performance optical transmitter by utilizing CISCO Systems®\u27s proprietary CMOS photonic technology. The research seeks to achieve the following outcomes: 1. Reduction of power consumption due to optical interconnects to less than 5pJ/bit without the need for Ring Resonators or DWDM and less than 300fJ/bit for short distance data bus applications. 2. Enable the increase in performance (computing speed) from Peta-Flop to Exa-Flops without the proportional increase in cost or power consumption that would be prohibitive to next generation system architectures by means of increasing the maximum data transmission rate over a single fiber. 3. Explore advanced modulation schemes such as PAM-16 (Pulse-Amplitude-Modulation with 16 levels) to increase the spectrum efficiency while keeping the same or less power figure. This research will focus on the improvement of both the electrical IC and optical IC for the optical transmitter. An accurate circuit model of the optical device is created to speed up the performance optimization and enable co-simulation of electrical driver. Circuit architectures are chosen to minimize the power consumption without sacrificing the speed and noise immunity. As a result, a silicon photonic based optical transmitter employing 1V supply, featuring 20Gb/s data rate is fabricated. The system consists of an electrical driver in 40nm CMOS and an optical MZI modulator with an RF length of less than 0.5mm in 0.13&mu m SOI CMOS. Two modulation schemes are successfully demonstrated: On-Off Keying (OOK) and Pulse-Amplitude-Modulation-N (PAM-N N=4, 16). Both versions demonstrate signal integrity, interface density, and scalability that fit into the next generation data communication and exa-scale computing. Modulation power at 20Gb/s data rate for OOK and PAM-16 of 4pJ/bit and 0.25pJ/bit are achieved for the first time of an MZI type optical modulator, respectively