9,385 research outputs found

    Interconnect performance estimation models for design planning

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    A global wire planning scheme for Network-on-Chip.

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    As technology scales down, the interconnect for on-chip global communication becomes the delay bottleneck. In order to provide well-controlled global wire delay and efficient global communication, a packet switched Network-on-Chip (NoC) architecture was proposed by different authors. In this paper, the NoC system parameters constrained by the interconnections are studied. Predictions on scaled system parameters such as clock frequency, resource size, global communication bandwidth and inter-resource delay are made for future technologies. Based on these parameters, a global wire planning scheme is proposed

    Extending systems-on-chip to the third dimension : performance, cost and technological tradeoffs.

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    Because of the today's market demand for high-performance, high-density portable hand-held applications, electronic system design technology has shifted the focus from 2-D planar SoC single-chip solutions to different alternative options as tiled silicon and single-level embedded modules as well as 3-D integration. Among the various choices, finding an optimal solution for system implementation dealt usually with cost, performance and other technological trade-off analysis at the system conceptual level. It has been identified that the decisions made within the first 20% of the total design cycle time will ultimately result up to 80% of the final product cost. In this paper, we discuss appropriate and realistic metric for performance and cost trade-off analysis both at system conceptual level (up-front in the design phase) and at implementation phase for verification in the three-dimensional integration. In order to validate the methodology, two ubiquitous electronic systems are analyzed under various implementation schemes and discuss the pros and cons of each of them

    Throughput-driven floorplanning with wire pipelining

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    The size of future high-performance SoC is such that the time-of-flight of wires connecting distant pins in the layout can be much higher than the clock period. In order to keep the frequency as high as possible, the wires may be pipelined. However, the insertion of flip-flops may alter the throughput of the system due to the presence of loops in the logic netlist. In this paper, we address the problem of floorplanning a large design where long interconnects are pipelined by inserting the throughput in the cost function of a tool based on simulated annealing. The results obtained on a series of benchmarks are then validated using a simple router that breaks long interconnects by suitably placing flip-flops along the wires

    On signalling over through-silicon via (TSV) interconnects in 3-D integrated circuits.

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    This paper discusses signal integrity (SI) issues and signalling techniques for Through Silicon Via (TSV) interconnects in 3-D Integrated Circuits (ICs). Field-solver extracted parasitics of TSVs have been employed in Spice simulations to investigate the effect of each parasitic component on performance metrics such as delay and crosstalk and identify a reduced-order electrical model that captures all relevant effects. We show that in dense TSV structures voltage-mode (VM) signalling does not lend itself to achieving high data-rates, and that current-mode (CM) signalling is more effective for high throughput signalling as well as jitter reduction. Data rates, energy consumption and coupled noise for the different signalling modes are extracted

    On-Chip Transparent Wire Pipelining (invited paper)

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    Wire pipelining has been proposed as a viable mean to break the discrepancy between decreasing gate delays and increasing wire delays in deep-submicron technologies. Far from being a straightforwardly applicable technique, this methodology requires a number of design modifications in order to insert it seamlessly in the current design flow. In this paper we briefly survey the methods presented by other researchers in the field and then we thoroughly analyze the solutions we recently proposed, ranging from system-level wire pipelining to physical design aspects

    Closed form metrics to accurately model the response in general arbitrarily-coupled RC trees.

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    Closed form expressions are presented for the first and second moment of the impulse response for arbitrarily-coupled RC trees with multiple drivers, and used to generate accurate second order estimations of the transfer function from any driver to the receiver. The superposition of the waveforms for all switching events allows precise delay and noise calculations for systems of coupled interconnects with different aggressor arrival times, with a minimum of computational complexity
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