Signaling in 3-D integrated circuits, benefits and challenges

Three-dimensional (3-D) or vertical integration is a design and packaging paradigm that can mitigate many of the increasing challenges related to the design of modern integrated systems. 3-D circuits have recently been at the spotlight, since these circuits provide a potent approach to enhance the performance and integrate diverse functions within amulti-plane stack. Clock networks consume a great portion of the power dissipated in a circuit. Therefore, designing a low-power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Synchronization issues can be more challenging for 3-D circuits since a clock path can spread across several planes with different physical and electrical characteristics. Consequently, designing low power clock networks for 3-D circuits is an important issue. Resonant clock networks are considered efficient low-power alternatives to conventional clock distribution schemes. These networks utilize additional inductive circuits to reduce power while delivering a full swing clock signal to the sink nodes. In this research, a design method to apply resonant clocking to synthesized clock trees is proposed. Manufacturing processes for 3-D circuits include some additional steps as compared to standard CMOS processes which makes 3-D circuits more susceptible to manufacturing defects and lowers the overall yield of the bonded 3-D stack. Testing is another complicated task for 3-D ICs, where pre-bond test is a prerequisite. Pre-bond testability, in turn, presents new challenges to 3-D clock network design primarily due to the incomplete clock distribution networks prior to the bonding of the planes. A design methodology of resonant 3-D clock networks that support wireless pre-bond testing is introduced. To efficiently address this issue, inductive links are exploited to wirelessly transmit the clock signal to the disjoint resonant clock networks. The inductors comprising the LC tanks are used as the receiver circuit for the links, essentially eliminating the need for additional circuits and/or interconnect resources during pre-bond test. Recent FPGAs are quite complex circuits which provide reconfigurablity at the cost of lower performance and higher power consumption as compared to ASIC circuits. Exploiting a large number of programmable switches, routing structures are mainly responsible for performance degradation in FPAGs. Employing 3-D technology can providemore efficient switches which drastically improve the performance and reduce the power consumption of the FPGA. RRAM switches are one of the most promising candidates to improve the FPGA routing architecture thanks to their low on-resistance and non-volatility. Along with the configurable switches, buffers are the other important element of the FPGAs routing structure. Different characteristics of RRAM switches change the properties of signal paths in RRAM-based FPGAs. The on resistance of RRAMswitches is considerably lower than CMOS pass gate switches which results in lower RC delay for RRAM-based routing paths. This different nature in critical path and signal delay in turn affect the need for intermediate buffers. Thus the buffer allocation should be reconsidered. In the last part of this research, the effect of intermediate buffers on signal propagation delay is studied and a modified buffer allocation scheme for RRAM-based FPGA routing path is proposed

A hierarchical optimization engine for nanoelectronic systems using emerging device and interconnect technologies

A fast and efficient hierarchical optimization engine was developed to benchmark and optimize various emerging device and interconnect technologies and system-level innovations at the early design stage. As the semiconductor industry approaches sub-20nm technology nodes, both devices and interconnects are facing severe physical challenges. Many novel device and interconnect concepts and system integration techniques are proposed in the past decade to reinforce or even replace the conventional Si CMOS technology and Cu interconnects. To efficiently benchmark and optimize these emerging technologies, a validated system-level design methodology is developed based on the compact models from all hierarchies, starting from the bottom material-level, to the device- and interconnect-level, and to the top system-level models. Multiple design parameters across all hierarchies are co-optimized simultaneously to maximize the overall chip throughput instead of just the intrinsic delay or energy dissipation of the device or interconnect itself. This optimization is performed under various constraints such as the power dissipation, maximum temperature, die size area, power delivery noise, and yield. For the device benchmarking, novel graphen PN junction devices and InAs nanowire FETs are investigated for both high-performance and low-power applications. For the interconnect benchmarking, a novel local interconnect structure and hybrid Al-Cu interconnect architecture are proposed, and emerging multi-layer graphene interconnects are also investigated, and compared with the conventional Cu interconnects. For the system-level analyses, the benefits of the systems implemented with 3D integration and heterogeneous integration are analyzed. In addition, the impact of the power delivery noise and process variation for both devices and interconnects are quantified on the overall chip throughput.Ph.D

Optical Wireless Data Center Networks

Bandwidth and computation-intensive Big Data applications in disciplines like social media, bio- and nano-informatics, Internet-of-Things (IoT), and real-time analytics, are pushing existing access and core (backbone) networks as well as Data Center Networks (DCNs) to their limits. Next generation DCNs must support continuously increasing network traffic while satisfying minimum performance requirements of latency, reliability, flexibility and scalability. Therefore, a larger number of cables (i.e., copper-cables and fiber optics) may be required in conventional wired DCNs. In addition to limiting the possible topologies, large number of cables may result into design and development problems related to wire ducting and maintenance, heat dissipation, and power consumption. To address the cabling complexity in wired DCNs, we propose OWCells, a class of optical wireless cellular data center network architectures in which fixed line of sight (LOS) optical wireless communication (OWC) links are used to connect the racks arranged in regular polygonal topologies. We present the OWCell DCN architecture, develop its theoretical underpinnings, and investigate routing protocols and OWC transceiver design. To realize a fully wireless DCN, servers in racks must also be connected using OWC links. There is, however, a difficulty of connecting multiple adjacent network components, such as servers in a rack, using point-to-point LOS links. To overcome this problem, we propose and validate the feasibility of an FSO-Bus to connect multiple adjacent network components using NLOS point-to-point OWC links. Finally, to complete the design of the OWC transceiver, we develop a new class of strictly and rearrangeably non-blocking multicast optical switches in which multicast is performed efficiently at the physical optical (lower) layer rather than upper layers (e.g., application layer). Advisors: Jitender S. Deogun and Dennis R. Alexande

Efficient Passive Clustering and Gateways selection MANETs

Passive clustering does not employ control packets to collect topological information in ad hoc networks. In our proposal, we avoid making frequent changes in cluster architecture due to repeated election and re-election of cluster heads and gateways. Our primary objective has been to make Passive Clustering more practical by employing optimal number of gateways and reduce the number of rebroadcast packets

Silica and Silicon Based Nanostructures

Silica and silicon-based nanostructures are now well-understood materials for which the technologies are mature. The most obvious applications, such as electronic devices, have been widely explored over the last two decades. The aim of this Special Issue is to bring together the state of the art in the field and to enable the emergence of new ideas and concepts for silicon and silica-based nanostructures

Topical Workshop on Electronics for Particle Physics

The purpose of the workshop was to present results and original concepts for electronics research and development relevant to particle physics experiments as well as accelerator and beam instrumentation at future facilities; to review the status of electronics for the LHC experiments; to identify and encourage common efforts for the development of electronics; and to promote information exchange and collaboration in the relevant engineering and physics communities

Combining SOA and BPM Technologies for Cross-System Process Automation

This paper summarizes the results of an industry case study that introduced a cross-system business process automation solution based on a combination of SOA and BPM standard technologies (i.e., BPMN, BPEL, WSDL). Besides discussing major weaknesses of the existing, custom-built, solution and comparing them against experiences with the developed prototype, the paper presents a course of action for transforming the current solution into the proposed solution. This includes a general approach, consisting of four distinct steps, as well as specific action items that are to be performed for every step. The discussion also covers language and tool support and challenges arising from the transformation