142 research outputs found
An integrated placement and routing approach
As the feature size continues scaling down, interconnects become the major contributor of signal delay. Since interconnects are mainly determined by placement and routing, these two stages play key roles to achieve high performance. Historically, they are divided into two separate stages to make the problem tractable. Therefore, the routing information is not available during the placement process. Net models such as HPWL, are employed to approximate the routing to simplify the placement problem. However, the good placement in terms of these objectives may not be routable at all in the routing stage because different objectives are optimized in placement and routing stages. This inconsistancy makes the results obtained by the two-step optimization method far from optimal;In order to achieve high-quality placement solution and ensure the following routing, we propose an integrated placement and routing approach. In this approach, we integrate placement and routing into the same framework so that the objective optimized in placement is the same as that in routing. Since both placement and routing are very hard problems (NP-hard), we need to have very efficient algorithms so that integrating them together will not lead to intractable complexity;In this dissertation, we first develop a highly efficient placer - FastPlace 3.0 for large-scale mixed-size placement problem. Then, an efficient and effective detailed placer - FastDP is proposed to improve global placement by moving standard cells in designs. For high-degree nets in designs, we propose a novel performance-driven topology design algorithm to generate good topologies to achieve very strict timing requirement. In the routing phase, we develop two global routers, FastRoute and FastRoute 2.0. Compared to traditional global routers, they can generate better solutions and are two orders of magnitude faster. Finally, based on these efficient and high-quality placement and routing algorithms, we propose a new flow which integrates placement and routing together closely. In this flow, global routing is extensively applied to obtain the interconnect information and direct the placement process. In this way, we can get very good placement solutions with guaranteed routability
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Layer assignment and routing optimization for advanced technologies
As VLSI technology scales to deep sub-micron and beyond, it becomes
increasingly challenging to achieve timing closure for VLSI design. Since a
complete design flow consists of several phases, such as logic synthesis, placement, and routing, interconnect synthesis plays an important role which includes buffer insertion/sizing and timing-driven routing. Although progress has been achieved by many advanced routing techniques, the following aspects
can be exploited sufficiently for further improvement: (1) incremental layer assignment for timing optimization; (2) signal routing with the requirement of regularity; (3) power-efficient optical-electrical interconnect paradigm. Thus, to perform the layer assignment and routing optimization for advanced technologies,
an automated routing engine in a global view is essential to benefit the interconnect design while satisfying specific requirements.
This dissertation proposes a set of algorithms and methodology on layer
assignment and routing optimization for advanced technologies. The research includes two timing-driven incremental layer assignment approaches, synergistic
topology generation and routing synthesis for signal groups, and optical-electrical routing design for power efficiency.
For incremental layer assignment, most of the conventional approaches
target via minimization but neglect the timing issues. Meanwhile, via delays
are ignored but should be considered in emerging technology nodes. Then two
timing-driven incremental layer assignment frameworks are proposed, where all the nets are solved simultaneously with the integration of via delays: (1) optimization of the total sum of net delays and reduction of slew violations; (2) minimization of critical path timing in selected nets.
For on-chip signal routing, the bundled bits in one group may have different
pin locations, but they have to be routed in a regular manner by sharing common topologies. Very few previous works target inter-bit regularity via multi-layer topology selection. Furthermore, the routability and wire-length of the signal bits should also be optimized. Then an advanced synergistic routing engine is promoted, which is able to not only control routability and wire-length but also guide each bit routing intelligently for design regularity.
For optical-electrical co-design routing, optical interconnect shows its
advantage due to the dominance of bandwidth-distance-power properties. The previous works lack a detailed exploration of optical-electrical co-design for on-chip interconnects. During the transmission, signal quality can be affected by various loss sources and Electrical to Optical (EO)/Optical to Electrical (OE) conversion overheads should also be considered. Then a power-efficient routing flow for on-chip signals is presented, where optical connections can collaborate with electrical wires seamlessly.
The effectiveness of proposed algorithms and techniques is demonstrated in this dissertation. These approaches are able to achieve the improvements regarding specific metrics and eventually benefit the routing flow.Electrical and Computer Engineerin
Beyond the arithmetic constraint: depth-optimal mapping of logic chains in reconfigurable fabrics
Look-up table based FPGAs have migrated from a niche technology for design prototyping to a valuable end-product component and, in some cases, a replacement for general purpose processors and ASICs alike. One way architects have bridged the performance gap between FPGAs and ASICs is through the inclusion of specialized components such as multipliers, RAM modules, and microcontrollers. Another dedicated structure that has become standard in reconfigurable fabrics is the arithmetic carry chain. Currently, it is only used to map arithmetic operations as identified by HDL macros. For non-arithmetic operations, it is an idle but potentially powerful resource.;Obstacles to using the carry chain for generic logic operations include lack of architectural and computer-aided design support. Current carry-select architectures facilitate carry chain reuse, although they do so only for (K-1)-input operations. Additionally, hardware description language (HDL) macros are the only recourse for a designer wishing to map generic logic chains in a carry-select architecture. A novel architecture that allows the full K-input operational capacity of the carry chain to be harnessed is presented as a solution to current architectural limitations. It is shown to have negligible impact on logic element area and delay. Using only two additional 2:1 pass transistor multiplexers, it enables the transmission of a K-input operation to the carry chain and general routing simultaneously. To successfully identify logic chains in an arbitrary Boolean network, ChainMap is presented as a novel technology mapping algorithm. ChainMap creates delay-optimal generic logic chains in polynomial time without HDL macros. It maps both arithmetic and non-arithmetic logic chains whenever depth increasing nodes, which increase logic depth but not routing depth, are encountered. Use of the chain is not reserved for arithmetic, but rather any set of gates exhibiting similar characteristics. By using the carry chain as a generic, near zero-delay adjacent cell interconnection structure a potential average optimal speedup of 1.4x is revealed. Post place and route experiments indicate that ChainMap solutions perform similarly to HDL chains when cluster resources are abundant and significantly better in cluster-constrained arrays
Incorporating Physical Information into Clustering for FPGAs
The traditional approach to FPGA clustering and CLB-level placement has been shown to yield significantly worse overall placement quality than approaches which allow BLEs to move during placement. In practice, however, modern FPGA architectures require computationally-expensive Design Rule Checks (DRC) which render BLE-level placement impractical.
This thesis research addresses this problem by proposing a novel clustering framework
that produces better initial clusters that help to reduce the dependence on BLE-level placement. The work described in this dissertation includes: (1) a
comparison of various clustering algorithms used for FPGAs, (2) the introduction of a novel hybridized clustering framework for timing-driven FPGA clustering, (3) the addition of physical information to make better clusters, (4) a comparison of the implemented approaches to known clustering
tools, and (5) the implementation and evaluation of cluster improvement heuristics. The proposed techniques are quantified across accepted benchmarks and show that the implemented DPack produces results with 16% less wire length, 19% smaller minimum channel
widths, and 8% less critical delay, on average, than known academic tools. The hybridized approach, HDPack, is found to achieve 21% less wire length, 24% smaller minimum channel widths, and 6% less critical delay, on average
A complete design path for the layout of flexible macros
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AI/ML Algorithms and Applications in VLSI Design and Technology
An evident challenge ahead for the integrated circuit (IC) industry in the
nanometer regime is the investigation and development of methods that can
reduce the design complexity ensuing from growing process variations and
curtail the turnaround time of chip manufacturing. Conventional methodologies
employed for such tasks are largely manual; thus, time-consuming and
resource-intensive. In contrast, the unique learning strategies of artificial
intelligence (AI) provide numerous exciting automated approaches for handling
complex and data-intensive tasks in very-large-scale integration (VLSI) design
and testing. Employing AI and machine learning (ML) algorithms in VLSI design
and manufacturing reduces the time and effort for understanding and processing
the data within and across different abstraction levels via automated learning
algorithms. It, in turn, improves the IC yield and reduces the manufacturing
turnaround time. This paper thoroughly reviews the AI/ML automated approaches
introduced in the past towards VLSI design and manufacturing. Moreover, we
discuss the scope of AI/ML applications in the future at various abstraction
levels to revolutionize the field of VLSI design, aiming for high-speed, highly
intelligent, and efficient implementations
High-performance Global Routing for Trillion-gate Systems-on-Chips.
Due to aggressive transistor scaling, modern-day CMOS circuits have continually increased in both complexity and productivity. Modern semiconductor designs have narrower and more resistive wires, thereby shifting the performance bottleneck to interconnect delay. These trends considerably impact timing closure and call for improvements in high-performance physical design tools to keep pace with the current state of IC innovation.
As leading-edge designs may incorporate tens of millions of gates, algorithm and software scalability are crucial to achieving reasonable turnaround time. Moreover, with decreasing device sizes, optimizing traditional objectives is no longer sufficient.
Our research focuses on (i) expanding the capabilities of standalone global routing, (ii) extending global routing for use in different design applications, and (iii) integrating routing within broader physical design optimizations and flows, e.g., congestion-driven
placement. Our first global router relies on integer-linear programming (ILP), and can solve fairly large problem instances to optimality. Our second iterative global router relies on Lagrangian relaxation, where we relax the routing violation constraints to allowing routing overflow at a penalty. In both approaches, our desire is to give the router the maximum degree of freedom within a specified context. Empirically, both routers produce competitive results within a reasonable amount of runtime. To improve routability, we explore the incorporation of routing with placement, where the router estimates congestion and feeds this information to the placer. In turn, the emphasis on runtime is heightened, as the router will be invoked multiple times. Empirically, our placement-and-route framework significantly improves the final solution’s routability than performing the steps sequentially. To further enhance routability-driven placement, we (i) leverage incrementality to generate fast and accurate congestion maps, and (ii) develop several techniques to relieve cell-based and layout-based congestion. To broaden the scope of routing, we integrate a global router in a chip-design flow that addresses the buffer explosion problem.PHDComputer Science and EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/98025/1/jinhu_1.pd
Custom Cell Placement Automation for Asynchronous VLSI
Asynchronous Very-Large-Scale-Integration (VLSI) integrated circuits have demonstrated many advantages over their synchronous counterparts, including low power consumption, elastic pipelining, robustness against manufacturing and temperature variations, etc. However, the lack of dedicated electronic design automation (EDA) tools, especially physical layout automation tools, largely limits the adoption of asynchronous circuits. Existing commercial placement tools are optimized for synchronous circuits, and require a standard cell library provided by semiconductor foundries to complete the physical design. The physical layouts of cells in this library have the same height to simplify the placement problem and the power distribution network. Although the standard cell methodology also works for asynchronous designs, the performance is inferior compared with counterparts designed using the full-custom design methodology. To tackle this challenge, we propose a gridded cell layout methodology for asynchronous circuits, in which the cell height and cell width can be any integer multiple of two grid values. The gridded cell approach combines the shape regularity of standard cells with the size flexibility of full-custom layouts. Therefore, this approach can achieve a better space utilization ratio and lower wire length for asynchronous designs. Experiments have shown that the gridded cell placement approach reduces area without impacting the routability. We have also used this placer to tape out a chip in a 65nm process technology, demonstrating that our placer generates design-rule clean results
Algorithmic techniques for physical design : macro placement and under-the-cell routing
With the increase of chip component density and new manufacturability constraints imposed by modern technology nodes, the role of algorithms for electronic design automation is key to the successful implementation of integrated circuits. Two of the critical steps in the physical design flows are macro placement and ensuring all design rules are honored after timing closure.
This thesis proposes contributions to help in these stages, easing time-consuming manual steps and helping physical design engineers to obtain better layouts in reduced turnaround time.
The first contribution is under-the-cell routing, a proposal to systematically connect standard cell components via lateral pins in the lower metal layers. The aim is to reduce congestion in the upper metal layers caused by extra metal and vias, decreasing the number of design rule violations. To allow cells to connect by abutment, a standard cell library is enriched with instances containing lateral pins in a pre-selected sharing track. Algorithms are proposed to maximize the numbers of connections via lateral connection by mapping placed cell instances to layouts with lateral pins, and proposing local placement modifications to increase the opportunities for such connections. Experimental results show a significant decrease in the number of pins, vias, and in number of design rule violations, with negligible impact on wirelength and timing.
The second contribution, done in collaboration with eSilicon (a leading ASIC design company), is the creation of HiDaP, a macro placement tool for modern industrial designs. The proposed approach follows a multilevel scheme to floorplan hierarchical blocks, composed of macros and standard cells. By exploiting RTL information available in the netlist, the dataflow affinity between these blocks is modeled and minimized to find a macro placement with good wirelength and timing properties. The approach is further extended to allow additional engineer input, such as preferred macro locations, and also spectral and force methods to guide the floorplanning search.
Experimental results show that the layouts generated by HiDaP outperforms those obtained by a state-of-the-art EDA physical design software, with similar wirelength and better timing when compared to manually designed tape-out ready macro placements. Layouts obtained by HiDaP have successfully been brought to near timing closure with one to two rounds of small modifications by physical design engineers. HiDaP has been fully integrated in the design flows of the company and its development remains an ongoing effort.A causa de l'increment de la densitat de components en els xip i les noves restriccions de disseny imposades pels últims nodes de fabricació, el rol de l'algorísmia en l'automatització del disseny electrònic ha esdevingut clau per poder implementar circuits integrats. Dos dels passos crucials en el procés de disseny físic és el placement de macros i assegurar la correcció de les regles de disseny un cop les restriccions de timing del circuit són satisfetes. Aquesta tesi proposa contribucions per ajudar en aquests dos reptes, facilitant laboriosos passos manuals en el procés i ajudant als enginyers de disseny físic a obtenir millors resultats en menys temps. La primera contribució és el routing "under-the-cell", una proposta per connectar cel·les estàndard usant pins laterals en les capes de metall inferior de manera sistemàtica. L'objectiu és reduir la congestió en les capes de metall superior causades per l'ús de metall i vies, i així disminuir el nombre de violacions de regles de disseny. Per permetre la connexió lateral de cel·les, estenem una llibreria de cel·les estàndard amb dissenys que incorporen connexions laterals. També proposem modificacions locals al placement per permetre explotar aquest tipus de connexions més sovint. Els resultats experimentals mostren una reducció significativa en el nombre de pins, vies i nombre de violacions de regles de disseny, amb un impacte negligible en wirelength i timing. La segona contribució, desenvolupada en col·laboració amb eSilicon (una empresa capdavantera en disseny ASIC), és el desenvolupament de HiDaP, una eina de macro placement per a dissenys industrials actuals. La proposta segueix un procés multinivell per fer el floorplan de blocks jeràrquics, formats per macros i cel·les estàndard. Mitjançant la informació RTL disponible en la netlist, l'afinitat de dataflow entre els mòduls es modela i minimitza per trobar macro placements amb bones propietats de wirelength i timing. La proposta també incorpora la possibilitat de rebre input addicional de l'enginyer, com ara suggeriments de les posicions de les macros. Finalment, també usa mètodes espectrals i de forçes per guiar la cerca de floorplans. Els resultats experimentals mostren que els dissenys generats amb HiDaP són millors que els obtinguts per eines comercials capdavanteres de EDA. Els resultats també mostren que els dissenys presentats poden obtenir un wirelength similar i millor timing que macro placements obtinguts manualment, usats per fabricació. Alguns dissenys obtinguts per HiDaP s'han dut fins a timing-closure en una o dues rondes de modificacions incrementals per part d'enginyers de disseny físic. L'eina s'ha integrat en el procés de disseny de eSilicon i el seu desenvolupament continua més enllà de les aportacions a aquesta tesi
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