Design Of Silicon Controlled Rectifers Sic] For Robust Electrostatic Discharge Protection Applications

Electrostatic Discharge (ESD) phenomenon happens everywhere in our daily life. And it can occurs through the whole lifespan of an Integrated Circuit (IC), from the early wafer fabrication process, extending to assembly operation, and finally ending at the user‟s site. It has been reported that up to 35% of total IC field failures are ESD-induced, with estimated annual costs to the IC industry running to several billion dollars. The most straightforward way to avoid the ICs suffering from the threatening of ESD damages is to develop on-chip ESD protection circuits which can afford a robust, low-impedance bypassing path to divert the ESD current to the ground. There are three different types of popular ESD protection devices widely used in the industry, and they are diodes or diodes string, Grounded-gate NMOS (GGNMOS) and Silicon Controlled Rectifier (SCR). Among these different protection solutions, SCR devices have the highest ESD current conduction capability due to the conductivity modulation effect. But SCR devices also have several shortcomings such as the higher triggering point, the lower clamping voltage etc, which will become obstacles for SCR to be widely used as an ESD protection solutions in most of the industry IC products. At first, in some applications with pin voltage goes below ground or above the VDD, dual directional protection between each two pins are desired. The traditional dual-directional SCR structures will consume a larger silicon area or lead to big leakage current issue due to the happening of punch-through effect. A new and improved SCR structure for low-triggering ESD iv applications has been proposed in this dissertation and successfully realized in a BiCMOS process. Such a structure possesses the desirable characteristics of a dual-polarity conduction, low trigger voltage, small leakage current, large failing current, adjustable holding voltage, and compact size. Another issue with SCR devices is its deep snapback or lower holding voltage, which normally will lead to the latch-up happen. To make SCR devices be immunity with latch-up, it is required to elevate its holding voltage to be larger than the circuits operational voltage, which can be several tens volts in modern power electronic circuits. Two possible solutions have been proposed to resolve this issue. One solution is accomplished by using a segmented emitter topology based on the concept that the holding voltage can be increased by reducing the emitter injection efficiency. Experimental data show that the new SCR can posses a holding voltage that is larger than 40V and a failure current It2 that is higher than 28mA/um. The other solution is accomplished by stacking several low triggering voltage high holding voltage SCR cells together. The TLP measurement results show that this novel SCR stacking structure has an extremely high holding voltage, very small snapback, and acceptable failure current. The High Holding Voltage Figure of Merit (HHVFOM) has been proposed to be a criterion for different high holding voltage solutions. The HHVFOM comparison of our proposed structures and the existing high holding voltage solutions also show the advantages of our work

Monolithic Integration of CMOS Charge Pumps for High Voltage Generation beyond 100 V

Monolithic integration of step-up DC-DC converters used to be one of the largest challenges in high voltage CMOS SoCs. Charge pumps are considered as the most promising solution regarding in- tegration levels compared to boost converter with bulky inductors. However, conventional charge pump architectures usually show significant drawbacks and reliability problems, when used as on- chip high voltage generators. Hence, innovative charge pump architectures are required to realize the monolithic integration of charge pumps in high voltage applications. In this dissertation, three 4-phase charge pump architectures with the dynamic body biasing tech- nique and clock schemes with dead time techniques were proposed to overcome drawbacks such as body effect and reverse current problem of traditional Pelliconi charge pump. The influences of high voltage CMOS sandwich capacitors on the voltage gain and power efficiency of charge pumps were extensively investigated. The most reasonable 4-phase charge pump architecture with a suitable configuration of high voltage sandwich capacitors regarding the voltage gain and power efficiency was chosen to implement two high voltage ASICs in an advanced 120 V 0.35 μm high voltage CMOS technology. The first test chip operates successfully and is able to generate up to 120 V from a 3.7 V low voltage DC supply, which shows the highest output voltage among all the reported fully integrated CMOS charge pumps. The measurement results confirmed the benefits of the proposed charge pump architectures and clock schemes. The second chip providing a similar output voltage has a reduced chip size mainly due to decreased capacitor areas by increased clock frequencies. Fur- thermore, the second chip with an on-chip clock generator works independently of external clock signals which shows the feasibility of integrated charge pumps as part of high voltage SoCs. Based on the successful implementation of those high voltage CMOS ASICs, further discussions on the stability of the output voltage, levels of integration and limitations in the negative high voltage generation of high voltage CMOS charge pumps are held with the aid of simulation or measurement results. Feed- back regulation by adjusting the clock frequency or DC power supply is able to stabilize the voltage performance effectively while being easily integrated on-chip. Increasing the clock frequency can significantly reduce the required capacitor values which results in reduced chip sizes. An application example demonstrates the importance of fully integrated high voltage charge pumps. Besides, a new design methodology for the on-chip high voltage generation using CMOS technolo- gies was proposed. It contains a general design flow focusing mainly on the feasibility and reliability of high voltage CMOS ASICs and design techniques for on-chip high voltage generators. In this dissertation, it is proven that CMOS charge pumps using suitable architectures regarding the required chip size and circuit reliability are able to be used as on-chip high voltage generators for voltages beyond 100 V . Several methods to improve the circuit performance and to extend the functionalities of high voltage charge pumps are suggested for future works

Electrostatic Discharge

As we enter the nanoelectronics era, electrostatic discharge (ESD) phenomena is an important issue for everything from micro-electronics to nanostructures. This book provides insight into the operation and design of micro-gaps and nanogenerators with chapters on low capacitance ESD design in advanced technologies, electrical breakdown in micro-gaps, nanogenerators from ESD, and theoretical prediction and optimization of triboelectric nanogenerators. The information contained herein will prove useful for for engineers and scientists that have an interest in ESD physics and design

A Low Power, Rad-Hard, ECL Standard Cell Library

Space exploration for life both inside and outside of our solar system demand the design and fabrication of robust, reliable electronics that can take measurements, process data, and sustain necessary operations. However, the presence of high radiation and the cold temperature of space poses a challenge to most designers. This thesis presents the design of a radiation-hardened, cold capable emitter coupled logic standard cell library with the intention of being used for space applications. The cells are designed and fabricated in a 90nm silicon germanium BiCMOS process. First, a review of emitter coupled logic is presented. Then, the design methodology for the standard cells are presented. Next, the results of several fabricated standard cells are discussed and analyzed. Finally, the work is concluded and future work is discussed

On-Chip Power Supply Noise: Scaling, Suppression and Detection

Design metrics such as area, timing and power are generally considered as the primary criteria in the design of modern day circuits, however, the minimization of power supply noise, among other noise sources, is appreciably more important since not only can it cause a degradation in these parameters but can cause entire chips to fail. Ensuring the integrity of the power supply voltage in the power distribution network of a chip is therefore crucial to both building reliable circuits as well as preventing circuit performance degradation. Power supply noise concerns, predicted over two decades ago, continue to draw significant attention, and with present CMOS technology projected to keep on scaling, it is shown in this work that these issues are not expected to diminish. This research also considers the management and on-chip detection of power supply noise. There are various methods of managing power supply noise, with the use of decoupling capacitors being the most common technique for suppressing the noise. An in-depth analysis of decap structures including scaling effects is presented in this work with corroborating silicon results. The applicability of various decaps for given design constraints is provided. It is shown that MOS-metal hybrid structures can provide a significant increase in capacitance per unit area compared to traditional structures and will continue to be an important structure as technology continues to scale. Noise suppression by means of current shifting within the clock period of an ALU block is further shown to be an additional method of reducing the minimum voltage observed on its associated supply. A simple, and area and power efficient technique for on-chip supply noise detection is also proposed

Ultra-low noise, high-frame rate readout design for a 3D-stacked CMOS image sensor

Due to the switch from CCD to CMOS technology, CMOS based image sensors have become smaller, cheaper, faster, and have recently outclassed CCDs in terms of image quality. Apart from the extensive set of applications requiring image sensors, the next technological breakthrough in imaging would be to consolidate and completely shift the conventional CMOS image sensor technology to the 3D-stacked technology. Stacking is recent and an innovative technology in the imaging field, allowing multiple silicon tiers with different functions to be stacked on top of each other. The technology allows for an extreme parallelism of the pixel readout circuitry. Furthermore, the readout is placed underneath the pixel array on a 3D-stacked image sensor, and the parallelism of the readout can remain constant at any spatial resolution of the sensors, allowing extreme low noise and a high-frame rate (design) at virtually any sensor array resolution. The objective of this work is the design of ultra-low noise readout circuits meant for 3D-stacked image sensors, structured with parallel readout circuitries. The readout circuit’s key requirements are low noise, speed, low-area (for higher parallelism), and low power. A CMOS imaging review is presented through a short historical background, followed by the description of the motivation, the research goals, and the work contributions. The fundamentals of CMOS image sensors are addressed, as a part of highlighting the typical image sensor features, the essential building blocks, types of operation, as well as their physical characteristics and their evaluation metrics. Following up on this, the document pays attention to the readout circuit’s noise theory and the column converters theory, to identify possible pitfalls to obtain sub-electron noise imagers. Lastly, the fabricated test CIS device performances are reported along with conjectures and conclusions, ending this thesis with the 3D-stacked subject issues and the future work. A part of the developed research work is located in the Appendices.Devido à mudança da tecnologia CCD para CMOS, os sensores de imagem em CMOS tornam se mais pequenos, mais baratos, mais rápidos, e mais recentemente, ultrapassaram os sensores CCD no que respeita à qualidade de imagem. Para além do vasto conjunto de aplicações que requerem sensores de imagem, o próximo salto tecnológico no ramo dos sensores de imagem é o de mudar completamente da tecnologia de sensores de imagem CMOS convencional para a tecnologia “3D-stacked”. O empilhamento de chips é relativamente recente e é uma tecnologia inovadora no campo dos sensores de imagem, permitindo vários planos de silício com diferentes funções poderem ser empilhados uns sobre os outros. Esta tecnologia permite portanto, um paralelismo extremo na leitura dos sinais vindos da matriz de píxeis. Além disso, num sensor de imagem de planos de silício empilhados, os circuitos de leitura estão posicionados debaixo da matriz de píxeis, sendo que dessa forma, o paralelismo pode manter-se constante para qualquer resolução espacial, permitindo assim atingir um extremo baixo ruído e um alto debito de imagens, virtualmente para qualquer resolução desejada. O objetivo deste trabalho é o de desenhar circuitos de leitura de coluna de muito baixo ruído, planeados para serem empregues em sensores de imagem “3D-stacked” com estruturas altamente paralelizadas. Os requisitos chave para os circuitos de leitura são de baixo ruído, rapidez e pouca área utilizada, de forma a obter-se o melhor rácio. Uma breve revisão histórica dos sensores de imagem CMOS é apresentada, seguida da motivação, dos objetivos e das contribuições feitas. Os fundamentos dos sensores de imagem CMOS são também abordados para expor as suas características, os blocos essenciais, os tipos de operação, assim como as suas características físicas e suas métricas de avaliação. No seguimento disto, especial atenção é dada à teoria subjacente ao ruído inerente dos circuitos de leitura e dos conversores de coluna, servindo para identificar os possíveis aspetos que dificultem atingir a tão desejada performance de muito baixo ruído. Por fim, os resultados experimentais do sensor desenvolvido são apresentados junto com possíveis conjeturas e respetivas conclusões, terminando o documento com o assunto de empilhamento vertical de camadas de silício, junto com o possível trabalho futuro

Ultra-Wideband CMOS Transceiver Front-End for Bio-Medical Radar Sensing

Since the Federal Communication Commission released the unlicensed 3.1-10.6 GHz frequency band for commercial use in early 2002, the ultra wideband (UWB) has developed from an emerging technology into a mainstream research area. The UWB technology, which utilizes wide spectrum, opens a new era of possibility for practical applications in radar sensing, one of which is the human vital sign monitoring. The aim of this thesis is to study and research the possibility of a new generation humanrespiration monitoring sensor using UWB radar technology and to develop a new prototype of UWB radar sensor for system-on-chip solutions in CMOS technology. In this thesis, a lowpower Gaussian impulse UWB mono-static radar transceiver architecture is presented. The UWB Gaussian pulse transmitter and receiver are implemented and fabricated using 90nm CMOS technology. Since the energy of low order Gaussian pulse is mostly condensed at lower frequency, in order to transmit the pulse in a very efficient way, higher order Gaussian derivative pulses are desired as the baseband signal. This motivates the advancement of the design into UWB high-order pulse transmitter. Both the Gaussian impulse UWB transmitter and Gaussian higher-order impulse UWB transmitter take the low-power and high-speed advantage of digital circuit to generate different waveforms. The measurement results are analyzed and discussed. This thesis also presents a low-power UWB mono-static radar transceiver architecture exploiting the full benefit of UWB bandwidth in radar sensing applications. The transceiver includes a full UWB band transmitter, an UWB receiver front-end, and an on-chip diplexer. The non-coherent UWB transmitter generates pulse modulated baseband signals at different carrier frequencies within the designated 3-10 GHz band using a digitally controlled pulse generator. The test shows the proposed radar transceiver can detect the human respiration pattern within 50 cm distance. The applications of this UWB radar sensing solution in commercialized standard CMOS technology include constant breathing pattern monitoring for gated radiation therapy, realtime monitoring of patients, and any other breathing monitoring. The research paves the way to wireless technology integration with health care and bio-sensor network

Analysis of design strategies for RF ESD problems in CMOS circuits

This thesis analyses the design strategies used to protect RF circuits that are implemented in CMOS technologies. It investigates, in detail, the physical mechanisms involved when a ggNMOS structure is exposed to an ESD event and undergoes snapback. The understanding gained is used to understand why the performance of the current RF ESD clamp is poor and suggestions are made as to how the performance of ggNMOS clamps can be improved beyond the current body of knowledge. The ultimate aim is to be able to design effective ESD protection clamps whilst minimising the effect the circuit has on RF I/O signals. A current ggNMOS based RF ESD I/O protection circuit is analysed in detail using a Transmission Line Pulse (TLP) tester. This is shown to be a very effective diagnostic tool by showing many characteristics of the ggNMOS during the triggering and conducting phase of the ESD event and demonstrate deficiencies in the clamp design. The use of a FIB enhances the analysis by allowing the isolation of individual components in the circuit and therefore their analysis using the TLP tester. SPICE simulations are used to provide further commentary on the debate surrounding the specification required of a TLP tester for there to be a good correlation between a TLP test and the industry standard Human Body Model (HBM) ESD test. Finite element simulations are used to probe deeper in to the mechanisms involved when a ggNMOS undergoes snapback especially with regard to the contribution parasitic components within the ggNMOS make to the snapback process. New ggNMOS clamps are proposed which after some modification are shown to work. Some of the finite element experiments are repeated in a 0.18μπ7. process CMOS test chip and a comparison is made between the two sets of results. In the concluding chapter understanding that has been gained from previous chapters is combined with the published body of knowledge to suggest and explain improvements in the design of a ggNMOS for RF and standard applications. These improvements will improve homogeneity of ggNMOS operation thus allowing the device size to be reduced and parasitic loading for a given ESD performance. These techniques can also be used to ensure that the ESD current does not take an unintended path through the chip

Design of Power-Efficient Optical Transceivers and Design of High-Linearity Wireless Wideband Receivers

The combination of silicon photonics and advanced heterogeneous integration is promising for next-generation disaggregated data centers that demand large scale, high throughput, and low power. In this dissertation, we discuss the design and theory of power-efficient optical transceivers with System-in-Package (SiP) 2.5D integration. Combining prior arts and proposed circuit techniques, a receiver chip and a transmitter chip including two 10 Gb/s data channels and one 2.5 GHz clocking channel are designed and implemented in 28 nm CMOS technology. An innovative transimpedance amplifier (TIA) and a single-ended to differential (S2D) converter are proposed and analyzed for a low-voltage high-sensitivity receiver; a four-to-one serializer, programmable output drivers, AC coupling units, and custom pads are implemented in a low-power transmitter; an improved quadrature locked loop (QLL) is employed to generate accurate quadrature clocks. In addition, we present an analysis for inverter-based shunt-feedback TIA to explicitly depict the trade-off among sensitivity, data rate, and power consumption. At last, the research on CDR-based​ clocking schemes for optical links is also discussed. We introduce prior arts and propose a power-efficient clocking scheme based on an injection-locked phase rotator. Next, we analyze injection-locked ring oscillators (ILROs) that have been widely used for quadrature clock generators (QCGs) in multi-lane optical or wireline transceivers due to their low power, low area, and technology scalability. The asymmetrical or partial injection locking from 2 phases to 4 phases results in imbalances in amplitude and phase. We propose a modified frequency-domain analysis to provide intuitive insight into the performance design trade-offs. The analysis is validated by comparing analytical predictions with simulations for an ILRO-based QCG in 28 nm CMOS technology. This dissertation also discusses the design of high-linearity wireless wideband receivers. An out-of-band (OB) IM3 cancellation technique is proposed and analyzed. By exploiting a baseband auxiliary path (AP) with a high-pass feature, the in-band (IB) desired signal and out-of-band interferers are split. OB third-order intermodulation products (IM3) are reconstructed in the AP and cancelled in the baseband (BB). A 0.5-2.5 GHz frequency-translational noise-cancelling (FTNC) receiver is implemented in 65nm CMOS to demonstrate the proposed approach. It consumes 36 mW without cancellation at 1 GHz LO frequency and 1.2 V supply, and it achieves 8.8 MHz baseband bandwidth, 40dB gain, 3.3dB NF, 5dBm OB IIP3, and −6.5dBm OB B1dB. After IM3 cancellation, the effective OB-IIP3 increases to 32.5 dBm with an extra 34 mW for narrow-band interferers (two tones). For wideband interferers, 18.8 dB cancellation is demonstrated over 10 MHz with two −15 dBm modulated interferers. The local oscillator (LO) leakage is −92 dBm and −88 dB at 1 GHz and 2 GHz LO respectively. In summary, this technique achieves both high OB linearity and good LO isolation

Design And Characterization Of Noveldevices For New Generation Of Electrostaticdischarge (esd) Protection Structures

The technology evolution and complexity of new circuit applications involve emerging reliability problems and even more sensitivity of integrated circuits (ICs) to electrostatic discharge (ESD)-induced damage. Regardless of the aggressive evolution in downscaling and subsequent improvement in applications\u27 performance, ICs still should comply with minimum standards of ESD robustness in order to be commercially viable. Although the topic of ESD has received attention industry-wide, the design of robust protection structures and circuits remains challenging because ESD failure mechanisms continue to become more acute and design windows less flexible. The sensitivity of smaller devices, along with a limited understanding of the ESD phenomena and the resulting empirical approach to solving the problem have yielded time consuming, costly and unpredictable design procedures. As turnaround design cycles in new technologies continue to decrease, the traditional trial-and-error design strategy is no longer acceptable, and better analysis capabilities and a systematic design approach are essential to accomplish the increasingly difficult task of adequate ESD protection-circuit design. This dissertation presents a comprehensive design methodology for implementing custom on-chip ESD protection structures in different commercial technologies. First, the ESD topic in the semiconductor industry is revised, as well as ESD standards and commonly used schemes to provide ESD protection in ICs. The general ESD protection approaches are illustrated and discussed using different types of protection components and the concept of the ESD design window. The problem of implementing and assessing ESD protection structures is addressed next, starting from the general discussion of two design methods. The first ESD design method follows an experimental approach, in which design requirements are obtained via fabrication, testing and failure analysis. The second method consists of the technology computer aided design (TCAD)-assisted ESD protection design. This method incorporates numerical simulations in different stages of the ESD design process, and thus results in a more predictable and systematic ESD development strategy. Physical models considered in the device simulation are discussed and subsequently utilized in different ESD designs along this study. The implementation of new custom ESD protection devices and a further integration strategy based on the concept of the high-holding, low-voltage-trigger, silicon controlled rectifier (SCR) (HH-LVTSCR) is demonstrated for implementing ESD solutions in commercial low-voltage digital and mixed-signal applications developed using complementary metal oxide semiconductor (CMOS) and bipolar CMOS (BiCMOS) technologies. This ESD protection concept proposed in this study is also successfully incorporated for implementing a tailored ESD protection solution for an emerging CMOS-based embedded MicroElectroMechanical (MEMS) sensor system-on-a-chip (SoC) technology. Circuit applications that are required to operate at relatively large input/output (I/O) voltage, above/below the VDD/VSS core circuit power supply, introduce further complications in the development and integration of ESD protection solutions. In these applications, the I/O operating voltage can extend over one order of magnitude larger than the safe operating voltage established in advanced technologies, while the IC is also required to comply with stringent ESD robustness requirements. A practical TCAD methodology based on a process- and device- simulation is demonstrated for assessment of the device physics, and subsequent design and implementation of custom P1N1-P2N2 and coupled P1N1-P2N2//N2P3-N3P1 silicon controlled rectifier (SCR)-type devices for ESD protection in different circuit applications, including those applications operating at I/O voltage considerably above/below the VDD/VSS. Results from the TCAD simulations are compared with measurements and used for developing technology- and circuit-adapted protection structures, capable of blocking large voltages and providing versatile dual-polarity symmetric/asymmetric S-type current-voltage characteristics for high ESD protection. The design guidelines introduced in this dissertation are used to optimize and extend the ESD protection capability in existing CMOS/BiCMOS technologies, by implementing smaller and more robust single- or dual-polarity ESD protection structures within the flexibility provided in the specific fabrication process. The ESD design methodologies and characteristics of the developed protection devices are demonstrated via ESD measurements obtained from fabricated stand-alone devices and on-chip ESD protections. The superior ESD protection performance of the devices developed in this study is also successfully verified in IC applications where the standard ESD protection approaches are not suitable to meet the stringent area constraint and performance requirement