49 research outputs found

    Microwave CMOS VCOs and Front-Ends - using integrated passives on-chip and on-carrier

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    The increasing demand for high data rates in wireless communication systems is increasing the requirements on the transceiver front-ends, as they are pushed to utilize more and wider bands at higher frequencies. The work in this thesis is focused on receiver front-ends composed of Low Noise Amplifiers (LNAs), Mixers, and Voltage Controlled Oscillators (VCOs) operating at microwave frequencies. Traditionally, microwave electronics has used exclusive and more expensive semiconductor technologies (III-V materials). However, the rapid development of consumer electronics (e.g. video game consoles) the last decade has pushed the silicon CMOS IC technology towards even smaller feature sizes. This has resulted in high speed transistors (high fT and fmax) with low noise figures. However, as the breakdown voltages have decreased, a lower supply voltage must be used, which has had a negative impact on linearity and dynamic range. Nonetheless, todays downscaled CMOS technology is a feasible alternative for many microwave and even millimeter wave applications. The low quality factor (Q) of passive components on-chip usually limits the high frequency performance. For inductors realized in a standard CMOS process the substrate coupling results in a degraded Q. The quality factor can, however, be improved by moving the passive components off-chip and integrating them on a low loss carrier. This thesis therefore features microwave front-end and VCO designs in CMOS, where some designs have been flip-chip mounted on carriers featuring high Q inductors and low loss baluns. The thesis starts with an introduction to wireless communication, receiver architectures, front-end receiver blocks, and low loss carrier technology, followed by the included papers. The six included papers show the capability of CMOS and carrier technology at microwave frequencies: Papers II, III, and VI demonstrate fully integrated CMOS circuit designs. An LC-VCO using an accumulation mode varactor is presented in Paper II, a QVCO using 4-bit switched tuning is shown in Paper III, and a quadrature receiver front-end (including QVCO) is demonstrated in paper VI. Papers I and IV demonstrate receiver front-ends using low loss baluns on carrier for the LO and RF signals. Paper IV also includes a front-end using single-ended RF input which is converted to differential form in a novel merged LNA and balun. A VCO demonstrating the benefits of a high Q inductor on carrier is presented in Paper V

    Floating and Grounded Impedance Simulator

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    A Study of the Sensitivity of Energy Conversion Efficiency to Load Variation in Class-E Resonant Power Inverter

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    In this thesis the sensitivity of energy conversion efficiency (ECE) and output power of a class-E resonant inverter under variable resistive and inductive load assignments is examined for wireless power transfer (WPT) applications. By performing simulation and mathematical analysis, it was found that the on-resistance of the switching device has minor effect on the design’s efficiency. Additional comparisons between the simulation and mathematical analysis show reasonable output power and ECE load variation performance for the design, but with unique load impedances where zero voltage switching (ZVS) and zero derivative switching (ZDS) are achieved. These comparisons also expose inaccurate mathematical assumptions. Experimental test results are presented to validate simulation and mathematical assumptions. These tests also show invalid assumptions used in the simulation and mathematical analysis and the performance of the class-E resonant power inverter suffer due to the difference in resonant frequencies during switch on and off state periods, nonlinear shunt capacitance, and parasitic impedances

    Fuzzy-ART based adaptive digital watermarking scheme

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    A Novel Block-based Watermarking Scheme Using the SVD Transform

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    In this paper, a block-based watermarking scheme based on the Singular Value Decomposition (SVD) is proposed. Our watermark, a pseudo-random Gaussian sequence, is embedded by modifying the angles formed by the right singular vectors of each block of the original image. The orthogonality property of the right singular vector matrix is preserved during the embedding process. Several experiments have been carried out to test the performance of the proposed scheme against different attack scenarios. We conclude that the proposed scheme is resistant against common signal processing operations and attacks, while it preserves the quality of the original image

    Design of a High-Speed Architecture for Stabilization of Video Captured Under Non-Uniform Lighting Conditions

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    Video captured in shaky conditions may lead to vibrations. A robust algorithm to immobilize the video by compensating for the vibrations from physical settings of the camera is presented in this dissertation. A very high performance hardware architecture on Field Programmable Gate Array (FPGA) technology is also developed for the implementation of the stabilization system. Stabilization of video sequences captured under non-uniform lighting conditions begins with a nonlinear enhancement process. This improves the visibility of the scene captured from physical sensing devices which have limited dynamic range. This physical limitation causes the saturated region of the image to shadow out the rest of the scene. It is therefore desirable to bring back a more uniform scene which eliminates the shadows to a certain extent. Stabilization of video requires the estimation of global motion parameters. By obtaining reliable background motion, the video can be spatially transformed to the reference sequence thereby eliminating the unintended motion of the camera. A reflectance-illuminance model for video enhancement is used in this research work to improve the visibility and quality of the scene. With fast color space conversion, the computational complexity is reduced to a minimum. The basic video stabilization model is formulated and configured for hardware implementation. Such a model involves evaluation of reliable features for tracking, motion estimation, and affine transformation to map the display coordinates of a stabilized sequence. The multiplications, divisions and exponentiations are replaced by simple arithmetic and logic operations using improved log-domain computations in the hardware modules. On Xilinx\u27s Virtex II 2V8000-5 FPGA platform, the prototype system consumes 59% logic slices, 30% flip-flops, 34% lookup tables, 35% embedded RAMs and two ZBT frame buffers. The system is capable of rendering 180.9 million pixels per second (mpps) and consumes approximately 30.6 watts of power at 1.5 volts. With a 1024×1024 frame, the throughput is equivalent to 172 frames per second (fps). Future work will optimize the performance-resource trade-off to meet the specific needs of the applications. It further extends the model for extraction and tracking of moving objects as our model inherently encapsulates the attributes of spatial distortion and motion prediction to reduce complexity. With these parameters to narrow down the processing range, it is possible to achieve a minimum of 20 fps on desktop computers with Intel Core 2 Duo or Quad Core CPUs and 2GB DDR2 memory without a dedicated hardware

    TSV Equivalent Circuit Model using 3D Full-Wave Analysis

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    This work presents a study to build lumped models for fault-free and faulty Through Silicon Vias (TSVs). Three dimensional full-wave simulations are performed to extract equivalent circuit models. The effects of parametric and catastrophic faults due to pin-holes, voids and open circuits on the equivalent circuit models have been determined through 3D simulations. The extracted TSV models are then used to conduct delay tests to determine the required measurement resolution to detect TSV defects. It is shown that the substrate conductivity has a considerable effect on TSV fault characterization. It is also shown that, regardless of the substrate type, even a relatively large void does not alter the TSV resistance or its parasitic capacitance noticeably at 1GHz solution frequency. An on-chip test solution for TSV parametric faults requires a dedicated high resolution measurement circuit due to the minor variations of TSV circuit model parameters
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