Hybrid 2D/3D Photonic Integration for Non-Planar Circuit Topologies

We present a concept for realizing crossing-free photonic integrated circuits (PIC) using 3D freeform waveguides. We prove the viability of the approach using a silicon photonic 4 x 4 switch-andselect device. The method is applicable to a wide range of PIC technologies

Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding

Efficient coupling of III-V light sources to silicon photonic circuits is one of the key challenges of integrated optics. Important requirements are low coupling losses, as well as small footprint and high yield of the overall assembly, along with the ability to use automated processes for large-scale production. In this paper, we demonstrate that photonic wire bonding addresses these challenges by exploiting direct-write two-photon lithography for in-situ fabrication of three-dimensional freeform waveguides between optical chips. In a series proof-of-concept experiments, we connect InP-based horizontal-cavity surface emitting lasers (HCSEL) to passive silicon photonic circuits with insertion losses down to 0.4 dB. To the best of our knowledge, this is the most efficient interface between an InP light source and a silicon photonic chip that has so far been demonstrated. Our experiments represent a key step in advancing photonic wire bonding to a universal integration platform for hybrid photonic multi-chip assemblies that combine known-good dies of different materials to high-performance hybrid multi-chip modules.Comment: 9 pages, 5 figure

Silicon-organic hybrid devices for high-speed electro-optic signal processing

Among the various elements of the silicon photonics platform, electro-optic IQ modulators play an important role. In this book, silicon-organic hybrid (SOH) integration is used to realize electro-optic IQ modulators for complex signal processing. Leveraging the high nonlinearity of organic materials, SOH IQ modulators provide low energy consumption for high-speed data transmission and frequency shifting. Furthermore, the device design is adapted for commercial foundry processes