Review and Characterization of Gallium Nitride Power Devices

Gallium Nitride (GaN) power devices are an emerging technology that have only recently become available commercially. This new technology enables the design of converters at higher frequencies and efficiencies than those achievable with conventional Si devices. This thesis reviews the characteristics and commercial status of both vertical and lateral GaN power devices from the user perspective, providing the background necessary to understand the significance of these recent developments. Additionally, the challenges encountered in GaN-based converter design are considered, such as the consequences of faster switching on gate driver design and board layout. Other issues include the unique reverse conduction behavior, dynamic on-resistance, breakdown mechanisms, thermal design, device availability, and reliability qualification. Static and dynamic characterization was then performed across the full current, voltage, and temperature range of this device to enable effective GaN-based converter design. Static testing was performed with a curve tracer and precision impedance analyzer. A double pulse test setup was constructed and used to measure switching loss and time at the fastest achievable switching speed, and the subsequent overvoltages due to the fast switching were characterized. The results were also analyzed to characterize the effects of cross-talk in the active and synchronous devices of a phase-leg topology with enhancement-mode GaN HFETs. Based on these results and analysis, an accurate loss model was developed for the device under test. Based on analysis of these characterization results, a simplified model was developed to describe the overall switching behavior and some unique features of the device. The consequences of the Miller effect during the turn-on transient were studied to show that no Miller plateau occurs, but rather a decreased gate voltage slope, followed by a sharp drop. The significance of this distinction is derived and explained. GaN performance at elevated temperature was also studied, because turn-on time increases significantly with temperature, and turn-on losses increase as a result. Based on this relationship, a temperature-dependent turn-on model and a linear scaling factor was proposed for estimating turn-on loss in e-mode GaN HFETs

Characterization and Utilization of 600 V GaN GITs for 4.5 kW Single Phase Inverter Design

Superior properties allow for faster switching and higher power density converters. However, the fast switching capability of GaN, while theoretically beneficial to converter design, presents several challenges due to the presence of printed circuit board (PCB) and device parasitics. Therefore, it is imperative that the results of device characterization reflect actual device behavior in order to adequately model the device for converter design. This thesis focuses on characterization and utilization of 600 V/30 A Gallium Nitride gate injection transistors, or GaN GITs. The experimental data from static and dynamic characterization was used to maximize the performance of the devices in each phase leg of a 4.5 kW, single-phase, full-bridge inverter. The impact of PCB and device parasitics on switching behavior was also investigated, and a trade-off study of switching loss, overshoot voltage, and dead time loss is presented. Device packaging is also of interest regarding the design of high-frequency devices. This thesis compares the impact of two package designs for the GIT device by designing two separate inverters with the same specifications utilizing the different packages. Finally, due to the lower critical energy of the GaN HEMT during a short circuit, this thesis studies the short-circuit robustness of the devices. The performance of a unique gate sensing protection scheme is compared between two different packages, and the impact of the gate drive and protection circuit design parameters on performance is evaluated

Characterization Methodology, Modeling, and Converter Design for 600 V Enhancement-Mode GaN FETs

Gallium Nitride (GaN) power devices are an emerging technology that have only become available commercially in the past few years. This new technology enables the design of converters at higher frequencies and efficiencies than those achievable with conventional Si devices. This dissertation reviews the unique characteristics, commercial status, and design challenges that surround GaN FETs, in order to provide sufficient background to potential GaN-based converter designers.Methodology for experimentally characterizing a GaN FET was also presented, including static characterization with a curve tracer and impedance analyzer, as well as dynamic characterization in a double pulse test setup. This methodology was supplemented by additional tests to determine losses caused by Miller-induced cross talk, and the tradeoff between these losses and overlap losses was studied for one example device.Based on analysis of characterization results, a simplified model was developed to describe the overall switching behavior and some unique features of the device. The impact of the Miller effect during the turn-on transient was studied, as well as the dynamic performance of GaN at elevated temperature.Furthermore, solutions were proposed for several key design challenges in GaN-based converters. First, a driver-integrated overcurrent and short-circuit protection scheme was developed, based on the relationship between gate voltage and drain current in GaN gate injection transistors. Second, the limitations on maximum utilization of current and voltage in a GaN FET were studied, particularly the voltage overshoots following turn-on and turn-off switching transients, and the effective cooling of GaN FETs in higher power operation. A thermal design was developed for heat extraction from bottom-cooled surface-mount devices. These solutions were verified in a GaN-based full-bridge single-phase inverter

Switching Performance Evaluation, Design, and Test of a Robust 10 kV SiC MOSFET Based Phase Leg for Modular Medium Voltage Converters

10 kV SiC MOSFETs are one of the most promising power semiconductor devices for next-generation high-performance modular medium voltage (MV) converters. With extraordinary device characteristics, 10 kV SiC MOSFETs also bring a variety of challenges in the design and test of MV converters. To tackle these inherent challenges, this dissertation focuses on a robust half bridge (HB) phase leg based on 10 kV SiC MOSFETs for modular MV converters. A baseline design and test of the phase leg is established first as the foundation of the research in this dissertation. Thorough evaluation of 10 kV SiC MOSFETs’ switching performance in a phase leg is necessary before applying them in MV converters. The impact of parasitic capacitors and the freewheeling diode is investigated to understand the switching performance more extensively and guide the converter design. One non-negligible challenge is the flashover fault resulting from the premature insulation breakdown, a short circuit fault with extremely fast transients. A device model is established to analyze the behavior of 10 kV SiC MOSFETs when the fault occurs in a phase leg thoroughly. Subsequently, the gate driver and protection design considerations are summarized to achieve lower short circuit current and overvoltage and ensure the survival of the MOSFET that in ON state when the fault happens. Furthermore, it is challenging to design the overcurrent/short circuit protection with fast response and strong noise immunity under fast switching transients for 10 kV SiC MOSFETs. The noise immunity of the desaturation (desat) protection is studied quantitatively to provide design guidelines for noise immunity enhancement. Then, the protection scheme based on desat protection is developed and validated withimmunity, the strong noise immunity of the developed protection is also successfully validated. In addition, a simple test scheme is proposed and validated experimentally, in order to qualify the HB phase leg based on the 10 kV SiC MOSFET comprehensively for the modular MV converter applications. The test scheme includes the ac-dc continuous test with two phase legs in series to create the testing condition similar to what is generated in a modular MV converter, especially the high dv/dt. The test scheme can fully test the capability of the phase leg to withstand high dv/dt and its resulting noise

Driving and Protection of High Density High Temperature Power Module for Electric Vehicle Application

There has been an increasing trend for the commercialization of electric vehicles (EVs) to reduce greenhouse gas emissions and dependence on petroleum. However, a key technical barrier to their wide application is the development of high power density electric drive systems due to limited space within EVs. High temperature environment inherent in EVs further introduces a new level of complexity. Under high power density and high temperature operation, system reliability and safety also become important. This dissertation deals with the development of advanced driving and protection technologies for high temperature high density power module capable of operating under the harsh environment of electric vehicles, while ensuring system reliability and safety under short circuit conditions. Several related research topics will be discussed in this dissertation. First, an active gate driver (AGD) for IGBT modules is proposed to improve their overall switching performance. The proposed one has the capability of reducing the switching loss, delay time, and Miller plateau duration during turn-on and turn-off transient without sacrificing current and voltage stress. Second, a board-level integrated silicon carbide (SiC) MOSFET power module is developed for high temperature and high power density application. Specifically, a silicon-on-insulator (SOI) based gate driver board is designed and fabricated through chip-on-board (COB) technique. Also, a 1200 V / 100 A SiC MOSFET phase-leg power module is developed utilizing high temperature packaging technologies. Third, a comprehensive short circuit ruggedness evaluation and numerical investigation of up-to-date commercial silicon carbide (SiC) MOSFETs is presented. The short circuit capability of three types of commercial 1200 V SiC MOSFETs is tested under various conditions. The experimental short circuit behaviors are compared and analyzed through numerical thermal dynamic simulation. Finally, according to the short circuit ruggedness evaluation results, three short circuit protection methods are proposed to improve the reliability and overall cost of the SiC MOSFET based converter. A comparison is made in terms of fault response time, temperature dependent characteristics, and applications to help designers select a proper protection method

Electromagnetic Interference and Compatibility

Recent progress in the fields of Electrical and Electronic Engineering has created new application scenarios and new Electromagnetic Compatibility (EMC) challenges, along with novel tools and methodologies to address them. This volume, which collects the contributions published in the “Electromagnetic Interference and Compatibility” Special Issue of MDPI Electronics, provides a vivid picture of current research trends and new developments in the rapidly evolving, broad area of EMC, including contributions on EMC issues in digital communications, power electronics, and analog integrated circuits and sensors, along with signal and power integrity and electromagnetic interference (EMI) suppression properties of materials