Combined HW/SW Drift and Variability Mitigation for PCM-based Analog In-memory Computing for Neural Network Applications

Matrix-Vector Multiplications (MVMs) represent a heavy workload for both training and inference in Deep Neural Networks (DNNs) applications. Analog In-memory Computing (AIMC) systems based on Phase Change Memory (PCM) has been shown to be a valid competitor to enhance the energy efficiency of DNN accelerators. Although DNNs are quite resilient to computation inaccuracies, PCM non-idealities could strongly affect MVM operations precision, and thus the accuracy of DNNs. In this paper, a combined hardware and software solution to mitigate the impact of PCM non-idealities is presented. The drift of PCM cells conductance is compensated at the circuit level through the introduction of a conductance ratio at the core of the MVM computation. A model of the behaviour of PCM cells is employed to develop a device-aware training for DNNs and the accuracy is estimated in a CIFAR-10 classification task. This work is supported by a PCM-based AIMC prototype, designed in a 90-nm STMicroelectronics technology, and conceived to perform Multiply-and-Accumulate (MAC) computations, which are the kernel of MVMs. Results show that the MAC computation accuracy is around 95% even under the effect of cells drift. The use of a device-aware DNN training makes the networks less sensitive to weight variability, with a 15% increase in classification accuracy over a conventionally-trained Lenet-5 DNN, and a 36% gain when drift compensation is applied

IEEE Access Special Section Editorial: Smart Health Sensing and Computational Intelligence: From Big Data to Big Impacts

Smart health big data is paving a promising way for ubiquitous health management, leveraging exciting advances in biomedical engineering technologies, such as convenient bio-sensing, health monitoring, in-home monitoring, biomedical signal processing, data mining, health trend tracking, and evidence-based medical decision support. To build and utilize the smart health big data, advanced data sensing and data mining technologies are closely coupled key enabling factors. In smart health big data innovations, challenges arise in how to informatively and robustly build the big data with advanced sensing technologies, and how to automatically and effectively decode patterns from the big data with intelligent computational methods. More specifically, advanced sensing techniques should be able to capture more modalities that can reflect rich physiological and behavioral states of humans, and enhance the signal robustness in daily wearable applications. In addition, intelligent computational techniques are required to unveil patterns deeply hidden in the data and nonlinearly convert the patterns to high-level medical insights

Faculty of Engineering and Design. Research Review

STUDENTS AND ACADEMICS - This publication introduces you to the department or school and then each faculty member’s research areas, research applications, and their most recent activities. A comprehensive index can be found at the back of this publication to help guide you by specific areas of interest, as well as point out interdisciplinary topics and researchers. INDUSTRY LEADERS - This publication includes information regarding specific facilities, labs, and research areas of departments and schools as well as individual faculty members and researchers. A comprehensive index can be found at the back of this publication to help guide you by specific areas of interest, as well as point out interdisciplinary topics and researchers

Efficient DSP and Circuit Architectures for Massive MIMO: State-of-the-Art and Future Directions

Massive MIMO is a compelling wireless access concept that relies on the use of an excess number of base-station antennas, relative to the number of active terminals. This technology is a main component of 5G New Radio (NR) and addresses all important requirements of future wireless standards: a great capacity increase, the support of many simultaneous users, and improvement in energy efficiency. Massive MIMO requires the simultaneous processing of signals from many antenna chains, and computational operations on large matrices. The complexity of the digital processing has been viewed as a fundamental obstacle to the feasibility of Massive MIMO in the past. Recent advances on system-algorithm-hardware co-design have led to extremely energy-efficient implementations. These exploit opportunities in deeply-scaled silicon technologies and perform partly distributed processing to cope with the bottlenecks encountered in the interconnection of many signals. For example, prototype ASIC implementations have demonstrated zero-forcing precoding in real time at a 55 mW power consumption (20 MHz bandwidth, 128 antennas, multiplexing of 8 terminals). Coarse and even error-prone digital processing in the antenna paths permits a reduction of consumption with a factor of 2 to 5. This article summarizes the fundamental technical contributions to efficient digital signal processing for Massive MIMO. The opportunities and constraints on operating on low-complexity RF and analog hardware chains are clarified. It illustrates how terminals can benefit from improved energy efficiency. The status of technology and real-life prototypes discussed. Open challenges and directions for future research are suggested.Comment: submitted to IEEE transactions on signal processin

Reducing Library Characterization Time for Cell-aware Test while Maintaining Test Quality

Cell-aware test (CAT) explicitly targets faults caused by defects inside library cells to improve test quality, compared with conventional automatic test pattern generation (ATPG) approaches, which target faults only at the boundaries of library cells. The CAT methodology consists of two stages. Stage 1, based on dedicated analog simulation, library characterization per cell identifies which cell-level test pattern detects which cell-internal defect; this detection information is encoded in a defect detection matrix (DDM). In Stage 2, with the DDMs as inputs, cell-aware ATPG generates chip-level test patterns per circuit design that is build up of interconnected instances of library cells. This paper focuses on Stage 1, library characterization, as both test quality and cost are determined by the set of cell-internal defects identified and simulated in the CAT tool flow. With the aim to achieve the best test quality, we first propose an approach to identify a comprehensive set, referred to as full set, of potential open- and short-defect locations based on cell layout. However, the full set of defects can be large even for a single cell, making the time cost of the defect simulation in Stage 1 unaffordable. Subsequently, to reduce the simulation time, we collapse the full set to a compact set of defects which serves as input of the defect simulation. The full set is stored for the diagnosis and failure analysis. With inspecting the simulation results, we propose a method to verify the test quality based on the compact set of defects and, if necessary, to compensate the test quality to the same level as that based on the full set of defects. For 351 combinational library cells in Cadence’s GPDK045 45nm library, we simulate only 5.4% defects from the full set to achieve the same test quality based on the full set of defects. In total, the simulation time, via linear extrapolation per cell, would be reduced by 96.4% compared with the time based on the full set of defects

A Survey of hardware protection of design data for integrated circuits and intellectual properties

International audienceThis paper reviews the current situation regarding design protection in the microelectronics industry. Over the past ten years, the designers of integrated circuits and intellectual properties have faced increasing threats including counterfeiting, reverse-engineering and theft. This is now a critical issue for the microelectronics industry, mainly for fabless designers and intellectual properties designers. Coupled with increasing pressure to decrease the cost and increase the performance of integrated circuits, the design of a secure, efficient, lightweight protection scheme for design data is a serious challenge for the hardware security community. However, several published works propose different ways to protect design data including functional locking, hardware obfuscation, and IC/IP identification. This paper presents a survey of academic research on the protection of design data. It concludes with the need to design an efficient protection scheme based on several properties

Toward Biologically-Inspired Self-Healing, Resilient Architectures for Digital Instrumentation and Control Systems and Embedded Devices

Digital Instrumentation and Control (I&C) systems in safety-related applications of next generation industrial automation systems require high levels of resilience against different fault classes. One of the more essential concepts for achieving this goal is the notion of resilient and survivable digital I&C systems. In recent years, self-healing concepts based on biological physiology have received attention for the design of robust digital systems. However, many of these approaches have not been architected from the outset with safety in mind, nor have they been targeted for the automation community where a significant need exists. This dissertation presents a new self-healing digital I&C architecture called BioSymPLe, inspired from the way nature responds, defends and heals: the stem cells in the immune system of living organisms, the life cycle of the living cell, and the pathway from Deoxyribonucleic acid (DNA) to protein. The BioSymPLe architecture is integrating biological concepts, fault tolerance techniques, and operational schematics for the international standard IEC 61131-3 to facilitate adoption in the automation industry. BioSymPLe is organized into three hierarchical levels: the local function migration layer from the top side, the critical service layer in the middle, and the global function migration layer from the bottom side. The local layer is used to monitor the correct execution of functions at the cellular level and to activate healing mechanisms at the critical service level. The critical layer is allocating a group of functional B cells which represent the building block that executes the intended functionality of critical application based on the expression for DNA genetic codes stored inside each cell. The global layer uses a concept of embryonic stem cells by differentiating these type of cells to repair the faulty T cells and supervising all repair mechanisms. Finally, two industrial applications have been mapped on the proposed architecture, which are capable of tolerating a significant number of faults (transient, permanent, and hardware common cause failures CCFs) that can stem from environmental disturbances and we believe the nexus of its concepts can positively impact the next generation of critical systems in the automation industry

Gestión de jerarquías de memoria híbridas a nivel de sistema

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadoras y Automática y de Ku Leuven, Arenberg Doctoral School, Faculty of Engineering Science, leída el 11/05/2017.In electronics and computer science, the term ‘memory’ generally refers to devices that are used to store information that we use in various appliances ranging from our PCs to all hand-held devices, smart appliances etc. Primary/main memory is used for storage systems that function at a high speed (i.e. RAM). The primary memory is often associated with addressable semiconductor memory, i.e. integrated circuits consisting of silicon-based transistors, used for example as primary memory but also other purposes in computers and other digital electronic devices. The secondary/auxiliary memory, in comparison provides program and data storage that is slower to access but offers larger capacity. Examples include external hard drives, portable flash drives, CDs, and DVDs. These devices and media must be either plugged in or inserted into a computer in order to be accessed by the system. Since secondary storage technology is not always connected to the computer, it is commonly used for backing up data. The term storage is often used to describe secondary memory. Secondary memory stores a large amount of data at lesser cost per byte than primary memory; this makes secondary storage about two orders of magnitude less expensive than primary storage. There are two main types of semiconductor memory: volatile and nonvolatile. Examples of non-volatile memory are ‘Flash’ memory (sometimes used as secondary, sometimes primary computer memory) and ROM/PROM/EPROM/EEPROM memory (used for firmware such as boot programs). Examples of volatile memory are primary memory (typically dynamic RAM, DRAM), and fast CPU cache memory (typically static RAM, SRAM, which is fast but energy-consuming and offer lower memory capacity per are a unit than DRAM). Non-volatile memory technologies in Si-based electronics date back to the 1990s. Flash memory is widely used in consumer electronic products such as cellphones and music players and NAND Flash-based solid-state disks (SSDs) are increasingly displacing hard disk drives as the primary storage device in laptops, desktops, and even data centers. The integration limit of Flash memories is approaching, and many new types of memory to replace conventional Flash memories have been proposed. The rapid increase of leakage currents in Silicon CMOS transistors with scaling poses a big challenge for the integration of SRAM memories. There is also the case of susceptibility to read/write failure with low power schemes. As a result of this, over the past decade, there has been an extensive pooling of time, resources and effort towards developing emerging memory technologies like Resistive RAM (ReRAM/RRAM), STT-MRAM, Domain Wall Memory and Phase Change Memory(PRAM). Emerging non-volatile memory technologies promise new memories to store more data at less cost than the expensive-to build silicon chips used by popular consumer gadgets including digital cameras, cell phones and portable music players. These new memory technologies combine the speed of static random-access memory (SRAM), the density of dynamic random-access memory (DRAM), and the non-volatility of Flash memory and so become very attractive as another possibility for future memory hierarchies. The research and information on these Non-Volatile Memory (NVM) technologies has matured over the last decade. These NVMs are now being explored thoroughly nowadays as viable replacements for conventional SRAM based memories even for the higher levels of the memory hierarchy. Many other new classes of emerging memory technologies such as transparent and plastic, three-dimensional(3-D), and quantum dot memory technologies have also gained tremendous popularity in recent years...En el campo de la informática, el término ‘memoria’ se refiere generalmente a dispositivos que son usados para almacenar información que posteriormente será usada en diversos dispositivos, desde computadoras personales (PC), móviles, dispositivos inteligentes, etc. La memoria principal del sistema se utiliza para almacenar los datos e instrucciones de los procesos que se encuentre en ejecución, por lo que se requiere que funcionen a alta velocidad (por ejemplo, DRAM). La memoria principal está implementada habitualmente mediante memorias semiconductoras direccionables, siendo DRAM y SRAM los principales exponentes. Por otro lado, la memoria auxiliar o secundaria proporciona almacenaje(para ficheros, por ejemplo); es más lenta pero ofrece una mayor capacidad. Ejemplos típicos de memoria secundaria son discos duros, memorias flash portables, CDs y DVDs. Debido a que estos dispositivos no necesitan estar conectados a la computadora de forma permanente, son muy utilizados para almacenar copias de seguridad. La memoria secundaria almacena una gran cantidad de datos aun coste menor por bit que la memoria principal, siendo habitualmente dos órdenes de magnitud más barata que la memoria primaria. Existen dos tipos de memorias de tipo semiconductor: volátiles y no volátiles. Ejemplos de memorias no volátiles son las memorias Flash (algunas veces usadas como memoria secundaria y otras veces como memoria principal) y memorias ROM/PROM/EPROM/EEPROM (usadas para firmware como programas de arranque). Ejemplos de memoria volátil son las memorias DRAM (RAM dinámica), actualmente la opción predominante a la hora de implementar la memoria principal, y las memorias SRAM (RAM estática) más rápida y costosa, utilizada para los diferentes niveles de cache. Las tecnologías de memorias no volátiles basadas en electrónica de silicio se remontan a la década de1990. Una variante de memoria de almacenaje por carga denominada como memoria Flash es mundialmente usada en productos electrónicos de consumo como telefonía móvil y reproductores de música mientras NAND Flash solid state disks(SSDs) están progresivamente desplazando a los dispositivos de disco duro como principal unidad de almacenamiento en computadoras portátiles, de escritorio e incluso en centros de datos. En la actualidad, hay varios factores que amenazan la actual predominancia de memorias semiconductoras basadas en cargas (capacitivas). Por un lado, se está alcanzando el límite de integración de las memorias Flash, lo que compromete su escalado en el medio plazo. Por otra parte, el fuerte incremento de las corrientes de fuga de los transistores de silicio CMOS actuales, supone un enorme desafío para la integración de memorias SRAM. Asimismo, estas memorias son cada vez más susceptibles a fallos de lectura/escritura en diseños de bajo consumo. Como resultado de estos problemas, que se agravan con cada nueva generación tecnológica, en los últimos años se han intensificado los esfuerzos para desarrollar nuevas tecnologías que reemplacen o al menos complementen a las actuales. Los transistores de efecto campo eléctrico ferroso (FeFET en sus siglas en inglés) se consideran una de las alternativas más prometedores para sustituir tanto a Flash (por su mayor densidad) como a DRAM (por su mayor velocidad), pero aún está en una fase muy inicial de su desarrollo. Hay otras tecnologías algo más maduras, en el ámbito de las memorias RAM resistivas, entre las que cabe destacar ReRAM (o RRAM), STT-RAM, Domain Wall Memory y Phase Change Memory (PRAM)...Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu