Experimental Evaluation and Comparison of Time-Multiplexed Multi-FPGA Routing Architectures

Emulating large complex designs require multi-FPGA systems (MFS). However, inter-FPGA communication is confronted by the challenge of lack of interconnect capacity due to limited number of FPGA input/output (I/O) pins. Serializing parallel signals onto a single trace effectively addresses the limited I/O pin obstacle. Besides the multiplexing scheme and multiplexing ratio (number of inter-FPGA signals per trace), the choice of the MFS routing architecture also affect the critical path latency. The routing architecture of an MFS is the interconnection pattern of FPGAs, fixed wires and/or programmable interconnect chips. Performance of existing MFS routing architectures is also limited by off-chip interface selection. In this dissertation we proposed novel 2D and 3D latency-optimized time-multiplexed MFS routing architectures. We used rigorous experimental approach and real sequential benchmark circuits to evaluate and compare the proposed and existing MFS routing architectures. This research provides a new insight into the encouraging effects of using off-chip optical interface and three dimensional MFS routing architectures. The vertical stacking results in shorter off-chip links improving the overall system frequency with the additional advantage of smaller footprint area. The proposed 3D architectures employed serialized interconnect between intra-plane and inter-plane FPGAs to address the pin limitation problem. Additionally, all off-chip links are replaced by optical fibers that exhibited latency improvement and resulted in faster MFS. Results indicated that exploiting third dimension provided latency and area improvements as compared to 2D MFS. We also proposed latency-optimized planar 2D MFS architectures in which electrical interconnections are replaced by optical interface in same spatial distribution. Performance evaluation and comparison showed that the proposed architectures have reduced critical path delay and system frequency improvement as compared to conventional MFS. We also experimentally evaluated and compared the system performance of three inter-FPGA communication schemes i.e. Logic Multiplexing, SERDES and MGT in conjunction with two routing architectures i.e. Completely Connected Graph (CCG) and TORUS. Experimental results showed that SERDES attained maximum frequency than the other two schemes. However, for very high multiplexing ratios, the performance of SERDES & MGT became comparable

Optoelectronic devices and packaging for information photonics

This thesis studies optoelectronic devices and the integration of these components onto optoelectronic multi chip modules (OE-MCMs) using a combination of packaging techniques. For this project, (1×12) array photodetectors were developed using PIN diodes with a GaAs/AlGaAs strained layer structure. The devices had a pitch of 250μm, operated at a wavelength of 850nm. Optical characterisation experiments of two types of detector arrays (shoe and ring) were successfully performed. Overall, the shoe devices achieved more consistent results in comparison with ring diodes, i.e. lower dark current and series resistance values. A decision was made to choose the shoe design for implementation into the high speed systems demonstrator. The (1x12) VCSEL array devices were the optical sources used in my research. This was an identical array at 250μm pitch configuration used in order to match the photodetector array. These devices had a wavelength of 850nm. Optoelectronic testing of the VCSEL was successfully conducted, which provided good beam profile analysis and I-V-P measurements of the VCSEL array. This was then implemented into a simple demonstrator system, where eye diagrams examined the systems performance and characteristics of the full system and showed positive results. An explanation was given of the following optoelectronic bonding techniques: Wire bonding and flip chip bonding with its associated technologies, i.e. Solder, gold stud bump and ACF. Also, technologies, such as ultrasonic flip chip bonding and gold micro-post technology were looked into and discussed. Experimental work implementing these methods on packaging the optoelectronic devices was successfully conducted and described in detail. Packaging of the optoelectronic devices onto the OEMCM was successfully performed. Electrical tests were successfully carried out on the flip chip bonded VCSEL and Photodetector arrays. These results verified that the devices attached on the MCM achieved good electrical performance and reliable bonding. Finally, preliminary testing was conducted on the fully assembled OE-MCMs. The aim was to initially power up the mixed signal chip (VCSEL driver), and then observe the VCSEL output

MEMS-enabled silicon photonic integrated devices and circuits

Photonic integrated circuits have seen a dramatic increase in complexity over the past decades. This development has been spurred by recent applications in datacenter communications and enabled by the availability of standardized mature technology platforms. Mechanical movement of wave-guiding structures at the micro- and nanoscale provides unique opportunities to further enhance functionality and to reduce power consumption in photonic integrated circuits. We here demonstrate integration of MEMS-enabled components in a simplified silicon photonics process based on IMEC's Standard iSiPP50G Silicon Photonics Platform and a custom release process

DAC-Less amplifier-less generation and transmission of QAM signals using sub-volt silicon-organic hybrid modulators

We demonstrate generation and transmission of optical signals by directly interfacing highly efficient silicon-organic hybrid (SOH) modulators to binary output ports of a field-programmable gate array. Using an SOH Mach-Zehnder modulator (MZM) and an SOH IQ modulator we generate ON-OFF- keying and binary phase-shift keying signals as well as quadrature phase-shift keying and 16-state quadrature amplitude modulation (16QAM) formats. Peak-to-peak voltages amount to only 0.27 V-pp for driving the MZM and 0.41 V-pp for the IQ modulator. Neither digital-to-analog converters nor drive amplifiers are required, and the RF energy consumption in the modulator amounts to record-low 18 fJ/bit for 16QAM signaling

Current and Nascent SETI Instruments

Here we describe our ongoing efforts to develop high-performance and sensitive instrumentation for use in the search for extra-terrestrial intelligence (SETI). These efforts include our recently deployed Search for Extraterrestrial Emissions from Nearby Developed Intelligent Populations Spectrometer (SERENDIP V.v) and two instruments currently under development; the Heterogeneous Radio SETI Spectrometer (HRSS) for SETI observations in the radio spectrum and the Optical SETI Fast Photometer (OSFP) for SETI observations in the optical band. We will discuss the basic SERENDIP V.v instrument design and initial analysis methodology, along with instrument architectures and observation strategies for OSFP and HRSS. In addition, we will demonstrate how these instruments may be built using low-cost, modular components and programmed and operated by students using common languages, e.g. ANSI C.Comment: 12 pages, 5 figures, Original version appears as Chapter 2 in "The Proceedings of SETI Sessions at the 2010 Astrobiology Science Conference: Communication with Extraterrestrial Intelligence (CETI)," Douglas A. Vakoch, Edito

Limits on Fundamental Limits to Computation

An indispensable part of our lives, computing has also become essential to industries and governments. Steady improvements in computer hardware have been supported by periodic doubling of transistor densities in integrated circuits over the last fifty years. Such Moore scaling now requires increasingly heroic efforts, stimulating research in alternative hardware and stirring controversy. To help evaluate emerging technologies and enrich our understanding of integrated-circuit scaling, we review fundamental limits to computation: in manufacturing, energy, physical space, design and verification effort, and algorithms. To outline what is achievable in principle and in practice, we recall how some limits were circumvented, compare loose and tight limits. We also point out that engineering difficulties encountered by emerging technologies may indicate yet-unknown limits.Comment: 15 pages, 4 figures, 1 tabl

Principles, fundamentals, and applications of programmable integrated photonics

[EN] Programmable integrated photonics is an emerging new paradigm that aims at designing common integrated optical hardware resource configurations, capable of implementing an unconstrained variety of functionalities by suitable programming, following a parallel but not identical path to that of integrated electronics in the past two decades of the last century. Programmable integrated photonics is raising considerable interest, as it is driven by the surge of a considerable number of new applications in the fields of telecommunications, quantum information processing, sensing, and neurophotonics, calling for flexible, reconfigurable, low-cost, compact, and low-power-consuming devices that can cooperate with integrated electronic devices to overcome the limitation expected by the demise of Moore¿s Law. Integrated photonic devices exploiting full programmability are expected to scale from application-specific photonic chips (featuring a relatively low number of functionalities) up to very complex application-agnostic complex subsystems much in the same way as field programmable gate arrays and microprocessors operate in electronics. Two main differences need to be considered. First, as opposed to integrated electronics, programmable integrated photonics will carry analog operations over the signals to be processed. Second, the scale of integration density will be several orders of magnitude smaller due to the physical limitations imposed by the wavelength ratio of electrons and light wave photons. The success of programmable integrated photonics will depend on leveraging the properties of integrated photonic devices and, in particular, on research into suitable interconnection hardware architectures that can offer a very high spatial regularity as well as the possibility of independently setting (with a very low power consumption) the interconnection state of each connecting element. Integrated multiport interferometers and waveguide meshes provide regular and periodic geometries, formed by replicating unit elements and cells, respectively. In the case of waveguide meshes, the cells can take the form of a square, hexagon, or triangle, among other configurations. Each side of the cell is formed by two integrated waveguides connected by means of a Mach¿Zehnder interferometer or a tunable directional coupler that can be operated by means of an output control signal as a crossbar switch or as a variable coupler with independent power division ratio and phase shift. 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