Design of TSV-sharing topologies for cost-effective 3D networks-on-chip

The Through-Silicon Via (TSV) technology has led to major breakthroughs in 3D stacking by providing higher speed and bandwidth, as well as lower power dissipation for the inter-layer communication. However, the current TSV fabrication suffers from a considerable area footprint and yield loss. Thus, it is necessary to restrict the number of TSVs in order to design cost-effective 3D on-chip networks. This critical issue can be addressed by clustering the network such that all of the routers within each cluster share a single TSV pillar for the vertical packet transmission. In some of the existing topologies, additional cluster routers are augmented into the mesh structure to handle the shared TSVs. However, they impose either performance degradation or power/area overhead to the system. Furthermore, the resulting architecture is no longer a mesh. In this paper, we redefine the clusters by replacing some routers in the mesh with the cluster routers, such that the mesh structure is preserved. The simulation results demonstrate a better equilibrium between performance and cost, using the proposed models

Fault-tolerant vertical link design for effective 3D stacking

[EN] Recently, 3D stacking has been proposed to alleviate the memory bandwidth limitation arising in chip multiprocessors (CMPs). As the number of integrated cores in the chip increases the access to external memory becomes the bottleneck, thus demanding larger memory amounts inside the chip. The most accepted solution to implement vertical links between stacked dies is by using Through Silicon Vias (TSVs). However, TSVs are exposed to misalignment and random defects compromising the yield of the manufactured 3D chip. A common solution to this problem is by over-provisioning, thus impacting on area and cost. In this paper, we propose a fault-tolerant vertical link design. With its adoption, fault-tolerant vertical links can be implemented in a 3D chip design at low cost without the need of adding redundant TSVs (no over-provision). Preliminary results are very promising as the fault-tolerant vertical link design increases switch area only by 6.69% while the achieved interconnect yield tends to 100%.This work was supported by the Spanish MEC and MICINN, as well as European Comission FEDER funds, under Grants CSD2006-00046 and TIN2009-14475-C04. It was also partly supported by the project NaNoC (project label 248972) which is funded by the European Commission within the Research Programme FP7.Hernández Luz, C.; Roca Pérez, A.; Flich Cardo, J.; Silla Jiménez, F.; Duato Marín, JF. (2011). Fault-tolerant vertical link design for effective 3D stacking. IEEE Computer Architecture Letters. 10(2):41-44. https://doi.org/10.1109/L-CA.2011.17S414410

Extending the performance of hybrid NoCs beyond the limitations of network heterogeneity

To meet the performance and scalability demands of the fast-paced technological growth towards exascale and Big-Data processing with the performance bottleneck of conventional metal based interconnects (wireline), alternative interconnect fabrics such as inhomogeneous three-dimensional integrated Network-on-Chip (3D NoC) and hybrid wired-wireless Network-on-Chip (WiNoC) have emanated as a cost-effective solution for emerging System-on-Chip (SoC) design. However, these interconnects trade-off optimized performance for cost by restricting the number of area and power hungry 3D routers and wireless nodes. Moreover, the non-uniform distributed traffic in chip multiprocessor (CMP) demands an on-chip communication infrastructure which can avoid congestion under high traffic conditions while possessing minimal pipeline delay at low-load conditions. To this end, in this paper, we propose a low-latency adaptive router with a low-complexity single-cycle bypassing mechanism to alleviate the performance degradation due to the slow 2D routers in such emerging hybrid NoCs. The proposed router transmits a flit using dimension-ordered routing (DoR) in the bypass datapath at low-loads. When the output port required for intra-dimension bypassing is not available, the packet is routed adaptively to avoid congestion. The router also has a simplified virtual channel allocation (VA) scheme that yields a non-speculative low-latency pipeline. By combining the low-complexity bypassing technique with adaptive routing, the proposed router is able balance the traffic in hybrid NoCs to achieve low-latency communication under various traffic loads. Simulation shows that, the proposed router can reduce applications’ execution time by an average of 16.9% compared to low-latency routers such as SWIFT. By reducing the latency between 2D routers (or wired nodes) and 3D routers (or wireless nodes) the proposed router can improve performance efficiency in terms of average packet delay by an average of 45% (or 50%) in 3D NoCs (or WiNoCs)

Energy and performance-aware application mapping for inhomogeneous 3D networks-on-chip

Three dimensional Networks-on-Chip (3D NoCs) have evolved as an ideal solution to the communication demands and complexity of future high density many core architectures. However, the design practicality of 3D NoCs faces several challenges such as thermal issues, high power consumption and area overhead of 3D routers as well as high complexity and cost of vertical link implementation. To mitigate the performance and manufacturing cost of 3D NoCs, inhomogeneous architectures have emerged to combine 2D and 3D routers in 3D NoCs producing lower area and energy consumption while maintaining the performance of homogeneous 3D NoCs. Due to the limited number of vertical links, application mapping on inhomogeneous 3D NoCs can be complex. However, application mapping has a great impact on the performance and energy consumption of NoCs. This paper presents an energy and performance aware application mapping algorithm for inhomogeneous 3D NoCs. The algorithm has been evaluated with various realistic traffic patterns and compared with existing mapping algorithms. Experimental results show NoCs mapped with the proposed algorithm have lower energy consumption and significant reduction in packet delays compared to the existing algorithms and comparable average packet latency with Branch-and-Bound

Cost-Effective Design of Mesh-of-Tree Interconnect for Multi-Core Clusters with 3-D Stacked L2 Scratchpad Memory

3-D integrated circuits (3-D ICs) offer a promising solution to overcome the scaling limitations of 2-D ICs. However, using too many through-silicon-vias (TSVs) pose a negative impact on 3-D ICs due to the large overhead of TSV (e.g., large footprint and low yield). In this paper, we propose a new TSV sharing method for a circuit-switched 3-D mesh-of-tree (MoT) interconnect, which supports high-throughput and low-latency communication between processing cores and 3-D stacked multibanked L2 scratchpad memory. The proposed method supports traffic balancing and TSV-failure tolerant routing. The proposed method advocates a modular design strategy to allow stacking multiple identical memory dies without the need for different masks for dies at different levels in the memory stack. We also investigate various parameters of 3-D memory stacking (e.g., fabrication technology, TSV bonding technique, number of memory tiers, and TSV sharing scheme) that affect interconnect latency, system performance, and fabrication cost. Compared to conventional MoT interconnect that is straightforwardly adapted to 3-D integration, the proposed method yields up to (times 2.11) and (times 1.11) improvements in terms of cost efficiency (i.e., performance/cost) for microbump TSV bonding and direct Cu–Cu TSV bonding techniques, respectively

Robust and Traffic Aware Medium Access Control Mechanisms for Energy-Efficient mm-Wave Wireless Network-on-Chip Architectures

To cater to the performance/watt needs, processors with multiple processing cores on the same chip have become the de-facto design choice. In such multicore systems, Network-on-Chip (NoC) serves as a communication infrastructure for data transfer among the cores on the chip. However, conventional metallic interconnect based NoCs are constrained by their long multi-hop latencies and high power consumption, limiting the performance gain in these systems. Among, different alternatives, due to the CMOS compatibility and energy-efficiency, low-latency wireless interconnect operating in the millimeter wave (mm-wave) band is nearer term solution to this multi-hop communication problem. This has led to the recent exploration of millimeter-wave (mm-wave) wireless technologies in wireless NoC architectures (WiNoC). To realize the mm-wave wireless interconnect in a WiNoC, a wireless interface (WI) equipped with on-chip antenna and transceiver circuit operating at 60GHz frequency range is integrated to the ports of some NoC switches. The WIs are also equipped with a medium access control (MAC) mechanism that ensures a collision free and energy-efficient communication among the WIs located at different parts on the chip. However, due to shrinking feature size and complex integration in CMOS technology, high-density chips like multicore systems are prone to manufacturing defects and dynamic faults during chip operation. Such failures can result in permanently broken wireless links or cause the MAC to malfunction in a WiNoC. Consequently, the energy-efficient communication through the wireless medium will be compromised. Furthermore, the energy efficiency in the wireless channel access is also dependent on the traffic pattern of the applications running on the multicore systems. Due to the bursty and self-similar nature of the NoC traffic patterns, the traffic demand of the WIs can vary both spatially and temporally. Ineffective management of such traffic variation of the WIs, limits the performance and energy benefits of the novel mm-wave interconnect technology. Hence, to utilize the full potential of the novel mm-wave interconnect technology in WiNoCs, design of a simple, fair, robust, and efficient MAC is of paramount importance. The main goal of this dissertation is to propose the design principles for robust and traffic-aware MAC mechanisms to provide high bandwidth, low latency, and energy-efficient data communication in mm-wave WiNoCs. The proposed solution has two parts. In the first part, we propose the cross-layer design methodology of robust WiNoC architecture that can minimize the effect of permanent failure of the wireless links and recover from transient failures caused by single event upsets (SEU). Then, in the second part, we present a traffic-aware MAC mechanism that can adjust the transmission slots of the WIs based on the traffic demand of the WIs. The proposed MAC is also robust against the failure of the wireless access mechanism. Finally, as future research directions, this idea of traffic awareness is extended throughout the whole NoC by enabling adaptiveness in both wired and wireless interconnection fabric

High Performance and Power Efficient On-Chip Network Designs through Multiple Injection Ports

Las redes dentro de un chip se están convirtiendo en el elemento principal de los sistemas multiprocesador. A medida que aumenta la escala de integración, más elementos de cómputo (procesadores) se incluyen en el mismo chip. Estos componentes se interconectan con una red dentro del chip que debe ofrecer latencias de transmisión ultra bajas (orden de nanosegundos) y anchos de banda elevados. El diseño, pues, de una red eficiente dentro del chip juega un papel fundamental. En la presente tesis se analizan diferentes alternativas de diseño de las redes en el chip. En particular, se hace uso de la posibilidad de utilizar diferentes puertos de inyección desde los procesadores con el fin de obtener diferentes mejoras. En primer lugar, las prestaciones aumentan al tener procesadores con distintas alternativas de inyección de tráfico. En segundo lugar, además aumenta la tolerancia a fallos frente a defectos de fabricación (mas importantes conforme avanza la tecnología). Y en tercer lugar, permite una política de apagado de componentes más agresiva que nos permita un ahorro significativo de energía. Hemos evaluado diferentes topologías derivadas del mecanismo de inyección en términos de prestaciones, coste de implementación, y ahorro de consumo. Además, hemos desarrollado simuladores específicos para las distintas técnicas utilizadas. Cada topología diseñada supone una mejora respecto a la anterior, y por supuesto, teniendo en cuenta las topologías existentes. En resumen, nuestro esfuerzo se centra en conseguir un excelente compromiso entre prestaciones, consumo y tolerancia a fallos dentro de una red en chip. Para la primera propuesta (topología NR-Mesh), se alcanzan mejoras en prestaciones de un 7\% y hasta de un 75\% en reducción de consumo de media, comparado con la malla 2D o malla de 2 dimensiones. Para la siguiente propuesta, la malla concentrada paralela (PC-Mesh), el beneficio en prestaciones que se obtiene es de hasta un 20\%, así cómo de un 60\% en reducción deCamacho Villanueva, J. (2012). High Performance and Power Efficient On-Chip Network Designs through Multiple Injection Ports [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/18235Palanci

A high speed serializer/deserializer design

A Serializer/Deserializer (SerDes) is a circuit that converts parallel data into a serial stream and vice versa. It helps solve clock/data skew problems, simplifies data transmission, lowers the power consumption and reduces the chip cost. The goal of this project was to solve the challenges in high speed SerDes design, which included the low jitter design, wide bandwidth design and low power design. A quarter-rate multiplexer/demultiplexer (MUX/DEMUX) was implemented. This quarter-rate structure decreases the required clock frequency from one half to one quarter of the data rate. It is shown that this significantly relaxes the design of the VCO at high speed and achieves lower power consumption. A novel multi-phase LC-ring oscillator was developed to supply a low noise clock to the SerDes. This proposed VCO combined an LC-tank with a ring structure to achieve both wide tuning range (11%) and low phase noise (-110dBc/Hz at 1MHz offset). With this structure, a data rate of 36 Gb/s was realized with a measured peak-to-peak jitter of 10ps using 0.18microm SiGe BiCMOS technology. The power consumption is 3.6W with 3.4V power supply voltage. At a 60 Gb/s data rate the simulated peak-to-peak jitter was 4.8ps using 65nm CMOS technology. The power consumption is 92mW with 2V power supply voltage. A time-to-digital (TDC) calibration circuit was designed to compensate for the phase mismatches among the multiple phases of the PLL clock using a three dimensional fully depleted silicon on insulator (3D FDSOI) CMOS process. The 3D process separated the analog PLL portion from the digital calibration portion into different tiers. This eliminated the noise coupling through the common substrate in the 2D process. Mismatches caused by the vertical tier-to-tier interconnections and the temperature influence in the 3D process were attenuated by the proposed calibration circuit. The design strategy and circuits developed from this dissertation provide significant benefit to both wired and wireless applications

Addressing Manufacturing Challenges in NoC-based ULSI Designs

Hernández Luz, C. (2012). Addressing Manufacturing Challenges in NoC-based ULSI Designs [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/1669