20 research outputs found

    On Energy Efficient Computing Platforms

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    In accordance with the Moore's law, the increasing number of on-chip integrated transistors has enabled modern computing platforms with not only higher processing power but also more affordable prices. As a result, these platforms, including portable devices, work stations and data centres, are becoming an inevitable part of the human society. However, with the demand for portability and raising cost of power, energy efficiency has emerged to be a major concern for modern computing platforms. As the complexity of on-chip systems increases, Network-on-Chip (NoC) has been proved as an efficient communication architecture which can further improve system performances and scalability while reducing the design cost. Therefore, in this thesis, we study and propose energy optimization approaches based on NoC architecture, with special focuses on the following aspects. As the architectural trend of future computing platforms, 3D systems have many bene ts including higher integration density, smaller footprint, heterogeneous integration, etc. Moreover, 3D technology can signi cantly improve the network communication and effectively avoid long wirings, and therefore, provide higher system performance and energy efficiency. With the dynamic nature of on-chip communication in large scale NoC based systems, run-time system optimization is of crucial importance in order to achieve higher system reliability and essentially energy efficiency. In this thesis, we propose an agent based system design approach where agents are on-chip components which monitor and control system parameters such as supply voltage, operating frequency, etc. With this approach, we have analysed the implementation alternatives for dynamic voltage and frequency scaling and power gating techniques at different granularity, which reduce both dynamic and leakage energy consumption. Topologies, being one of the key factors for NoCs, are also explored for energy saving purpose. A Honeycomb NoC architecture is proposed in this thesis with turn-model based deadlock-free routing algorithms. Our analysis and simulation based evaluation show that Honeycomb NoCs outperform their Mesh based counterparts in terms of network cost, system performance as well as energy efficiency.Siirretty Doriast

    Network-on-Chip

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    Limitations of bus-based interconnections related to scalability, latency, bandwidth, and power consumption for supporting the related huge number of on-chip resources result in a communication bottleneck. These challenges can be efficiently addressed with the implementation of a network-on-chip (NoC) system. This book gives a detailed analysis of various on-chip communication architectures and covers different areas of NoCs such as potentials, architecture, technical challenges, optimization, design explorations, and research directions. In addition, it discusses current and future trends that could make an impactful and meaningful contribution to the research and design of on-chip communications and NoC systems

    Software-based and regionally-oriented traffic management in Networks-on-Chip

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    Since the introduction of chip-multiprocessor systems, the number of integrated cores has been steady growing and workload applications have been adapted to exploit the increasing parallelism. This changed the importance of efficient on-chip communication significantly and the infrastructure has to keep step with these new requirements. The work at hand makes significant contributions to the state-of-the-art of the latest generation of such solutions, called Networks-on-Chip, to improve the performance, reliability, and flexible management of these on-chip infrastructures

    Hierarchical Agent-based Adaptation for Self-Aware Embedded Computing Systems

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    Siirretty Doriast

    MOCAST 2021

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    The 10th International Conference on Modern Circuit and System Technologies on Electronics and Communications (MOCAST 2021) will take place in Thessaloniki, Greece, from July 5th to July 7th, 2021. The MOCAST technical program includes all aspects of circuit and system technologies, from modeling to design, verification, implementation, and application. This Special Issue presents extended versions of top-ranking papers in the conference. The topics of MOCAST include:Analog/RF and mixed signal circuits;Digital circuits and systems design;Nonlinear circuits and systems;Device and circuit modeling;High-performance embedded systems;Systems and applications;Sensors and systems;Machine learning and AI applications;Communication; Network systems;Power management;Imagers, MEMS, medical, and displays;Radiation front ends (nuclear and space application);Education in circuits, systems, and communications

    Cross-layer fault tolerance in networks-on-chip

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    The design of Networks-on-Chip follows the Open Systems Interconnection (OSI) reference model. The OSI model defines strictly separated network abstraction layers and specifies their functionality. Each layer has layer-specific information about the network that can be exclusively accessed by the methods of the layer. Adhering to the strict layer boundaries, however, leads to methods of the individual layers working in isolation from each other. This lack of interaction between methods is disadvantageous for fault diagnosis and fault tolerance in Networks-on-Chip as it results in solutions that have a high effort in terms of the time and implementation costs required to deal with faults. For Networks-on-Chip cross-layer design is considered as a promising method to remedy these shortcomings. It removes the strict layer boundaries by the exchange of information between layers. This interaction enables methods of different layers to cooperate, and thus, deal with faults more efficiently. Furthermore, providing lower layer information to the software allows hardware methods to be implemented as software tasks resulting in a reduction of the hardware complexity. The goal of this dissertation is the investigation of cross-layer design for fault diagnosis and fault tolerance in Networks-on-Chip. For fault diagnosis a scheme is proposed that allows the interaction of protocol-based diagnosis of the transport layer with functional diagnosis of the network layer and structural diagnosis of the physical layer by exchanging diagnostic information. The techniques use this information for optimizing their own diagnosis process. For protocol-based diagnosis on the transport layer, a diagnosis protocol is proposed that is able to locate faulty links, switches, and crossbar connections. For this purpose, the technique utilizes available information of lower layers. As proof of concept for the proposed interaction scheme, the diagnosis protocol is combined with a functional and a structural diagnosis approach and the performance and diagnosis quality of the resulting combinations is investigated. The results show that the combinations of the diagnosis protocol with one of the lower layer techniques have a considerably reduced fault localization latency compared to the functional and the structural standalone techniques. This reduction, however, comes at the expense of a reduced diagnosis quality. In terms of fault tolerance, the focus of this dissertation is on the design and implementation of cross-layer approaches utilizing software methods to provide fault tolerance for network layer routings. Two approaches for different routings are presented. The requirements to provide information of lower layers to the software using the available Network-on-Chip resources and interfaces for data communication are discussed. The concepts of two mechanisms of the data link layer are presented for converting status information into communicable units and for preventing communication resources from being blocked. In the first approach, software-based packet rerouting is proposed. By incorporating information from different layers, this approach provides fault tolerance for deterministic network layer routings. As specialization of software-based rerouting, dimension-order XY rerouting is presented. In the second approach, a reconfigurable routing for Networks-on-Chip with logical hierarchy is proposed in which cross-layer interaction is used to enable hierarchical units to manage themselves autonomously and to reconfigure the routing. Both approaches are evaluated regarding their performance as well as their implementation costs. In a final study, the cross-layer diagnosis technique and cross-layer fault tolerance approaches are combined. The information obtained by the diagnosis technique is used by the fault tolerance approaches for packet rerouting or for routing reconfiguration. The combinations are evaluated regarding their impact on Networks-on-Chip performance. The results show that the crosslayer information exchange with software has a considerable impact on performance when the amount of information becomes too large. In case of crosslayer diagnosis, however, the impact on Networks-on-Chip performance is significantly lower compared to functional and structural diagnosis

    Driving the Network-on-Chip Revolution to Remove the Interconnect Bottleneck in Nanoscale Multi-Processor Systems-on-Chip

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    The sustained demand for faster, more powerful chips has been met by the availability of chip manufacturing processes allowing for the integration of increasing numbers of computation units onto a single die. The resulting outcome, especially in the embedded domain, has often been called SYSTEM-ON-CHIP (SoC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MP-SoC). MPSoC design brings to the foreground a large number of challenges, one of the most prominent of which is the design of the chip interconnection. With a number of on-chip blocks presently ranging in the tens, and quickly approaching the hundreds, the novel issue of how to best provide on-chip communication resources is clearly felt. NETWORKS-ON-CHIPS (NoCs) are the most comprehensive and scalable answer to this design concern. By bringing large-scale networking concepts to the on-chip domain, they guarantee a structured answer to present and future communication requirements. The point-to-point connection and packet switching paradigms they involve are also of great help in minimizing wiring overhead and physical routing issues. However, as with any technology of recent inception, NoC design is still an evolving discipline. Several main areas of interest require deep investigation for NoCs to become viable solutions: • The design of the NoC architecture needs to strike the best tradeoff among performance, features and the tight area and power constraints of the onchip domain. • Simulation and verification infrastructure must be put in place to explore, validate and optimize the NoC performance. • NoCs offer a huge design space, thanks to their extreme customizability in terms of topology and architectural parameters. Design tools are needed to prune this space and pick the best solutions. • Even more so given their global, distributed nature, it is essential to evaluate the physical implementation of NoCs to evaluate their suitability for next-generation designs and their area and power costs. This dissertation performs a design space exploration of network-on-chip architectures, in order to point-out the trade-offs associated with the design of each individual network building blocks and with the design of network topology overall. The design space exploration is preceded by a comparative analysis of state-of-the-art interconnect fabrics with themselves and with early networkon- chip prototypes. The ultimate objective is to point out the key advantages that NoC realizations provide with respect to state-of-the-art communication infrastructures and to point out the challenges that lie ahead in order to make this new interconnect technology come true. Among these latter, technologyrelated challenges are emerging that call for dedicated design techniques at all levels of the design hierarchy. In particular, leakage power dissipation, containment of process variations and of their effects. The achievement of the above objectives was enabled by means of a NoC simulation environment for cycleaccurate modelling and simulation and by means of a back-end facility for the study of NoC physical implementation effects. Overall, all the results provided by this work have been validated on actual silicon layout

    Memory Systems and Interconnects for Scale-Out Servers

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    The information revolution of the last decade has been fueled by the digitization of almost all human activities through a wide range of Internet services. The backbone of this information age are scale-out datacenters that need to collect, store, and process massive amounts of data. These datacenters distribute vast datasets across a large number of servers, typically into memory-resident shards so as to maintain strict quality-of-service guarantees. While data is driving the skyrocketing demands for scale-out servers, processor and memory manufacturers have reached fundamental efficiency limits, no longer able to increase server energy efficiency at a sufficient pace. As a result, energy has emerged as the main obstacle to the scalability of information technology (IT) with huge economic implications. Delivering sustainable IT calls for a paradigm shift in computer system design. As memory has taken a central role in IT infrastructure, memory-centric architectures are required to fully utilize the IT's costly memory investment. In response, processor architects are resorting to manycore architectures to leverage the abundant request-level parallelism found in data-centric applications. Manycore processors fully utilize available memory resources, thereby increasing IT efficiency by almost an order of magnitude. Because manycore server chips execute a large number of concurrent requests, they exhibit high incidence of accesses to the last-level-cache for fetching instructions (due to large instruction footprints), and off-chip memory (due to lack of temporal reuse in on-chip caches) for accessing dataset objects. As a result, on-chip interconnects and the memory system are emerging as major performance and energy-efficiency bottlenecks in servers. This thesis seeks to architect on-chip interconnects and memory systems that are tuned for the requirements of memory-centric scale-out servers. By studying a wide range of data-centric applications, we uncover application phenomena common in data-centric applications, and examine their implications on on-chip network and off-chip memory traffic. Finally, we propose specialized on-chip interconnects and memory systems that leverage common traffic characteristics, thereby improving server throughput and energy efficiency
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