Electrical modeling of the photoelectric effect induced by a pulsed laser applied to an SRAM cell

International audienceThis abstract presents an electrical model of an SRAM cell exposed to a pulsed Photoelectrical Laser Stimulation (PLS), based on our past model of MOS transistor under laser illumination. The validity of our model is assessed by the very good correlation obtained between measurements and electrical simulation. These simulations are capable to explain some specific points. For example, in theory, a SRAM cell under PLS have four sensitive areas. But in measurements only three areas were revealed. A hypothesis was presented in this paper and confirm by electrical simulation. The specific topology of the cell masks one sensitive area. Therefore the electrical model could be used as a tool of characterization of a CMOS circuits under PLS

Simulation and Experimental Demonstration of the Importance of IR-Drops During Laser Fault-Injection

International audienceLaser fault injections induce transient faults into ICs by locally generating transient currents that temporarily flip the outputs of the illuminated gates. Laser fault injection can be anticipated or studied by using simulation tools at different abstraction levels: physical, electrical or logical. At the electrical level, the classical laser-fault injection model is based on the addition of current sources to the various sensitive nodes of CMOS transistors. However, this model does not take into account the large transient current components also induced between the VDD and GND of ICs designed with advanced CMOS technologies. These short-circuit currents provoke a significant IR-drop that contribute to the fault injection process. This paper describes our research on the assessment of this contribution. It shows through simulation and experiments that during laser fault injection campaigns, laser-induced IR-drop is always present when considering circuits designed with deep submicron technologies. It introduces an enhanced electrical fault model taking the laser-induced IR-drop into account. It also proposes a methodology that allows the use of the model to simulate laser-induced faults at the electrical level in large-scale circuits. On the basis of further simulations and experimental results, we found that, depending on the laser pulse characteristics, the number of injected faults may be underestimated by a factor of up to 2.4 if the laser-induced IR-drop is ignored. This could lead to incorrect estimations of the fault injection threshold, which is especially relevant to the design of countermeasure techniques for secure integrated systems

Study of Radiation Effects on 28nm UTBB FDSOI Technology

With the evolution of modern Complementary Metal-Oxide-Semiconductor (CMOS) technology, transistor feature size has been scaled down to nanometers. The scaling has resulted in tremendous advantages to the integrated circuits (ICs), such as higher speed, smaller circuit size, and lower operating voltage. However, it also creates some reliability concerns. In particular, small device dimensions and low operating voltages have caused nanoscale ICs to become highly sensitive to operational disturbances, such as signal coupling, supply and substrate noise, and single event effects (SEEs) caused by ionizing particles, like cosmic neutrons and alpha particles. SEEs found in ICs can introduce transient pulses in circuit nodes or data upsets in storage cells. In well-designed ICs, SEEs appear to be the most troublesome in a space environment or at high altitudes in terrestrial environment. Techniques from the manufacturing process level up to the system design level have been developed to mitigate radiation effects. Among them, silicon-on-insulator (SOI) technologies have proven to be an effective approach to reduce single-event effects in ICs. So far, 28nm ultra-thin body and buried oxide (UTBB) Fully Depleted SOI (FDSOI) by STMicroelectronics is one of the most advanced SOI technologies in commercial applications. Its resilience to radiation effects has not been fully explored and it is of prevalent interest in the radiation effects community. Therefore, two test chips, namely ST1 and AR0, were designed and tested to study SEEs in logic circuits fabricated with this technology. The ST1 test chip was designed to evaluate SET pulse widths in logic gates. Three kinds of the on-chip pulse-width measurement detectors, namely the Vernier detector, the Pulse Capture detector and the Pulse Filter detector, were implemented in the ST1 chip. Moreover, a Circuit for Radiation Effects Self-Test (CREST) chain with combinational logic was designed to study both SET and SEU effects. The ST1 chip was tested using a heavy ion irradiation beam source in Radiation Effects Facility (RADEF), Finland. The experiment results showed that the cross-section of the 28nm UTBB-FDSOI technology is two orders lower than its bulk competitors. Laser tests were also applied to this chip to research the pulse distortion effects and the relationship between SET, SEU and the clock frequency. Total Ionizing Dose experiments were carried out at the University of Saskatchewan and European Space Agency with Co-60 gammacell radiation sources. The test results showed the devices implemented in the 28nm UTBB-FDSOI technology can maintain its functionality up to 1 Mrad(Si). In the AR0 chip, we designed five ARM Cortex-M0 cores with different logic protection levels to investigate the performance of approximate logic protecting methods. There are three custom-designed SRAM blocks in the test chip, which can also be used to measure the SEU rate. From the simulation result, we concluded that the approximate logic methodology can protect the digital logic efficiently. This research comprehensively evaluates the radiation effects in the 28nm UTBB-FDSOI technology, which provides the baseline for later radiation-hardened system designs in this technology

Integrated Circuits/Microchips

With the world marching inexorably towards the fourth industrial revolution (IR 4.0), one is now embracing lives with artificial intelligence (AI), the Internet of Things (IoTs), virtual reality (VR) and 5G technology. Wherever we are, whatever we are doing, there are electronic devices that we rely indispensably on. While some of these technologies, such as those fueled with smart, autonomous systems, are seemingly precocious; others have existed for quite a while. These devices range from simple home appliances, entertainment media to complex aeronautical instruments. Clearly, the daily lives of mankind today are interwoven seamlessly with electronics. Surprising as it may seem, the cornerstone that empowers these electronic devices is nothing more than a mere diminutive semiconductor cube block. More colloquially referred to as the Very-Large-Scale-Integration (VLSI) chip or an integrated circuit (IC) chip or simply a microchip, this semiconductor cube block, approximately the size of a grain of rice, is composed of millions to billions of transistors. The transistors are interconnected in such a way that allows electrical circuitries for certain applications to be realized. Some of these chips serve specific permanent applications and are known as Application Specific Integrated Circuits (ASICS); while, others are computing processors which could be programmed for diverse applications. The computer processor, together with its supporting hardware and user interfaces, is known as an embedded system.In this book, a variety of topics related to microchips are extensively illustrated. The topics encompass the physics of the microchip device, as well as its design methods and applications

Electronic and Photonic Systems WILGA 2014

Symposium Wilga 2014, in its 34th edition, was organized during the last week of May. Symposium is organized under the auspices of SPIE, IEEE, Photonics Society of Poland, WEiTI PW, and PKOpto SEP. The event gathered around 350 persons, mainly young researchers from the  whole country. There were presented around 250 speeches and communications. The main book of Symposium Proceedings is Proc. SPIE vol.9290 which contains around 130 papers. A few tens of papers were also published in technical journals. The leading topics of Wilga 2014 were gathered in key sessions: nano-materials for photonics and electronics, astronomy and space technology, biomedicine, computational intelligence, visualization and multimedia, and large research experiments. The paper presents a digest of some topical tracks, and chosen  work results presented during WILGA 2014 Symposium

Ultra-thin plasma nitrided oxide gate dielectrics for advanced MOS transistors

Ultra-thin plasma nitrided oxides have been optimized with the objective to decrease JG and maximize carrier mobility. It was found that while the base oxide cannot be aggressively scaled, plasma optimization yields better mobility thereby increase transistor performance. A summary of the EOT versus gate leakage current density of NMOS devices with plasma nitrided oxides is shown in Figure 5.19. EOT down to 1.2 nm has been achieved with a gate leakage current density of 40 A/cm2 at 1 V operating voltage

Nonlinear microscopy for failure analysis of CMOS integrated circuits in the vectorial focusing regime

This thesis focuses on the development of techniques for enhancing the spatial resolution and localisation precision in the sub-surface microscopy for failure analysis in semiconductor integrated circuits (ICs). Highest spatial resolutions are obtained by implementing solid immersion lenses (SIL), which provide unsurpassed numerical aperture (NA) for sub-surface microscopy. These high NA conditions mean that scalar diffraction theory is no longer valid and a vectorial focusing description should be applied to accurately describe the focal plane electric field distribution. Vectorial theory predicts that under high NA conditions a linearly polarised (LP) light focuses to a spot that is extended along the electric field vector, but radially polarised (RP) light is predicted to form a circular spot whose diameter equals the narrower dimension obtained with linear polarisation. By implementing a novel liquid-crystal (LC) radial polarisation converter (RPC) this effect was studied for both two-photon optical-beam-induced current (TOBIC) microscopy and two-photon laser assisted device alteration (2pLADA) techniques, showing a resolution and localisation improvement using the RP beam. By comparing images of the same structural features obtained using linear, circular and radial polarisations imaging and localisation resolutions both approaching 100 nm were demonstrated. The obtained experimental results were in good agreement with modelling and were consistent with theoretically predicted behaviour. Certain artefacts were observed under radial polarisation, which were thought to result from the extended depth of focus and the significant longitudinal field component. In any application these effects must be considered alongside the benefits of the symmetric field distribution in the focal plane. While SIL sub-surface microscopy offers unmatched spatial resolutions, it is prone to being severely degraded by aberrations arising from inaccurate dimensions of the SIL, imprecise substrate thickness or imperfect contact between SIL and substrate. It is in this context that techniques to identify and even mitigate aberrations in the system are important. A simple approach is demonstrated for revealing the presence of chromatic and spherical aberrations by measuring the two-photon autocorrelation of the pulses at the focal plane inside the sample. In the case of aberration free imaging, it was shown both theoretically and experimentally that the planes of the maximum autocorrelation amplitude and shortest pulse duration always coincide. Therefore, the optics of the imaging system can be first adjusted to obtain the minimum autocorrelation duration and then the wavefront of incident light modified to maximise the autocorrelation intensity, iterating this procedure until the positions of minimum pulse duration and maximum autocorrelation amplitude coincide

Two-Dimensional Electronics and Optoelectronics

The discovery of monolayer graphene led to a Nobel Prize in Physics being awarded in 2010. This has stimulated further research on a wide variety of two-dimensional (2D) layered materials. The coupling of metallic graphene, semiconducting 2D transition metal dichalcogenides (TMDCs) and black phosphorus have attracted a tremendous amount of interest in new electronic and optoelectronic applications. Together with other 2D materials, such as the wide band gap boron nitride nanosheets (BNNSs), all these 2D materials have led towards an emerging field of van der Waal 2D heterostructures. The papers in this book were originally published by Electronics (MDPI) in a Special Issue on “Two-Dimensional Electronics and Optoelectronics”. The book consists of eight papers, including two review articles, covering various pertinent and fascinating issues concerning 2D materials and devices. Further, the potential and the challenges of 2D materials are discussed, which provide up to date guidance for future research and development