An automated routing method for VLSI with three interconnection layers

Recently, to the extent allowed by the fabricating technology, approaches have been made to develop an automated router for the multi-layer IC layout design. In this thesis, we examine the VLSI routing problem where three layers are available for interconnection;We investigate the routing problem in three stages: global routing, power/ground routing, and channel routing. The global routing for three-interconnection layer model is not much different from that of two-layer madel. We study the global routing problem for two cases: gate array and general cell layout. In our three-layer grid model, power/ground wires keep the direction-per-layer scheme as signal net wires. However, the power/ground routing is further constrained by the width of wires and the layers they are laid on;The channel routing stage of our router is based on directional model where overlaps of horizontal wire segments are allowed. We improve the dogleg method so that it is applicable to the three-layer model and it can handle multi-terminal nets more efficiently. Applying the extensive dogleg method and the three-layer merge algorithm, we not only remove the cyclic vertical constraints graph but also eliminate the effect of the height of long vertical constraints tree to the channel width and thus we reduce the lower bound of the channel width to half of the density of the channel. We expand the applicability of channel router by eliminating some of the limitations assumed in channel routing problems by some existing algorithms. Routability conditions are examined for various cases of channel routing problem;The major result presented in this dissertation is an algorithm for a channel routing problem. Given a rectangular channel with terminals on top and bottom sides, the algorithm will find a three-layer channel routing which minimizes the channel width and the wire length. Experimental results show that our router is close to optimal

Analog layout design automation: ILP-based analog routers

The shrinking design window and high parasitic sensitivity in the advanced technology have imposed special challenges on the analog and radio frequency (RF) integrated circuit design. In this thesis, we propose a new methodology to address such a deficiency based on integer linear programming (ILP) but without compromising the capability of handling any special constraints for the analog routing problems. Distinct from the conventional methods, our algorithm utilizes adaptive resolutions for various routing regions. For a more congested region, a routing grid with higher resolution is employed, whereas a lower-resolution grid is adopted to a less crowded routing region. Moreover, we strengthen its speciality in handling interconnect width control so as to route the electrical nets based on analog constraints while considering proper interconnect width to address the acute interconnect parasitics, mismatch minimization, and electromigration effects simultaneously. In addition, to tackle the performance degradation due to layout dependent effects (LDEs) and take advantage of optical proximity correction (OPC) for resolution enhancement of subwavelength lithography, in this thesis we have also proposed an innovative LDE-aware analog layout migration scheme, which is equipped with our special routing methodology. The LDE constraints are first identified with aid of a special sensitivity analysis and then satisfied during the layout migration process. Afterwards the electrical nets are routed by an extended OPC-inclusive ILP-based analog router to improve the final layout image fidelity while the routability and analog constraints are respected in the meantime. The experimental results demonstrate the effectiveness and efficiency of our proposed methods in terms of both circuit performance and image quality compared to the previous works

Efficient Interconnection Schemes for VLSI and Parallel Computation

This thesis is primarily concerned with two problems of interconnecting components in VLSI technologies. In the first case, the goal is to construct efficient interconnection networks for general-purpose parallel computers. The second problem is a more specialized problem in the design of VLSI chips, namely multilayer channel routing. In addition, a final part of this thesis provides lower bounds on the area required for VLSI implementations of finite-state machines. This thesis shows that networks based on Leiserson\u27s fat-tree architecture are nearly as good as any network built in a comparable amount of physical space. It shows that these universal networks can efficiently simulate competing networks by means of an appropriate correspondence between network components and efficient algorithms for routing messages on the universal network. In particular, a universal network of area A can simulate competing networks with O(lg^3A) slowdown (in bit-times), using a very simple randomized routing algorithm and simple network components. Alternatively, a packet routing scheme of Leighton, Maggs, and Rao can be used in conjunction with more sophisticated switching components to achieve O(lg^2 A) slowdown. Several other important aspects of universality are also discussed. It is shown that universal networks can be constructed in area linear in the number of processors, so that there is no need to restrict the density of processors in competing networks. Also results are presented for comparisons between networks of different size or with processors of different sizes (as determined by the amount of attached memory). Of particular interest is the fact that a universal network built from sufficiently small processors can simulate (with the slowdown already quoted) any competing network of comparable size regardless of the size of processors in the competing network. In addition, many of the results given do not require the usual assumption of unit wire delay. Finally, though most of the discussion is in the two-dimensional world, the results are shown to apply in three dimensions by way of a simple demonstration of general results on graph layout in three dimensions. The second main problem considered in this thesis is channel routing when many layers of interconnect are available, a scenario that is becoming more and more meaningful as chip fabrication technologies advance. This thesis describes a system MulCh for multilayer channel routing which extends the Chameleon system developed at U. C. Berkeley. Like Chameleon, MulCh divides a multilayer problem into essentially independent subproblems of at most three layers, but unlike Chameleon, MulCh considers the possibility of using partitions comprised of a single layer instead of only partitions of two or three layers. Experimental results show that MulCh often performs better than Chameleon in terms of channel width, total net length, and number of vias. In addition to a description of MulCh as implemented, this thesis provides improved algorithms for subtasks performed by MulCh, thereby indicating potential improvements in the speed and performance of multilayer channel routing. In particular, a linear time algorithm is given for determining the minimum width required for a single-layer channel routing problem, and an algorithm is given for maintaining the density of a collection of nets in logarithmic time per net insertion. The last part of this thesis shows that straightforward techniques for implementing finite-state machines are optimal in the worst case. Specifically, for any s and k, there is a deterministic finite-state machine with s states and k symbols such that any layout algorithm requires (ks lg s) area to lay out its realization. For nondeterministic machines, there is an analogous lower bound of (ks^2) area

A complete design path for the layout of flexible macros

XIV+172hlm.;24c

VLSI Routing for Advanced Technology

Routing is a major step in VLSI design, the design process of complex integrated circuits (commonly known as chips). The basic task in routing is to connect predetermined locations on a chip (pins) with wires which serve as electrical connections. One main challenge in routing for advanced chip technology is the increasing complexity of design rules which reflect manufacturing requirements. In this thesis we investigate various aspects of this challenge. First, we consider polygon decomposition problems in the context of VLSI design rules. We introduce different width notions for polygons which are important for width-dependent design rules in VLSI routing, and we present efficient algorithms for computing width-preserving decompositions of rectilinear polygons into rectangles. Such decompositions are used in routing to allow for fast design rule checking. A main contribution of this thesis is an O(n) time algorithm for computing a decomposition of a simple rectilinear polygon with n vertices into O(n) rectangles, preseverving two-dimensional width. Here the two-dimensional width at a point of the polygon is defined as the edge length of a largest square that contains the point and is contained in the polygon. In order to obtain these results we establish a connection between such decompositions and Voronoi diagrams. Furthermore, we consider implications of multiple patterning and other advanced design rules for VLSI routing. The main contribution in this context is the detailed description of a routing approach which is able to manage such advanced design rules. As a main algorithmic concept we use multi-label shortest paths where certain path properties (which model design rules) can be enforced by defining labels assigned to path vertices and allowing only certain label transitions. The described approach has been implemented in BonnRoute, a VLSI routing tool developed at the Research Institute for Discrete Mathematics, University of Bonn, in cooperation with IBM. We present experimental results confirming that a flow combining BonnRoute and an external cleanup step produces far superior results compared to an industry standard router. In particular, our proposed flow runs more than twice as fast, reduces the via count by more than 20%, the wiring length by more than 10%, and the number of remaining design rule errors by more than 60%. These results obtained by applying our multiple patterning approach to real-world chip instances provided by IBM are another main contribution of this thesis. We note that IBM uses our proposed combined BonnRoute flow as the default tool for signal routing

Improved Physical Design for Manufacturing Awareness and Advanced VLSI

Increasing challenges arise with each new semiconductor technology node, especially in advanced nodes, where the industry tries to extract every ounce of benefit as it approaches the limits of physics, through manufacturing-aware design technology co-optimization and design-based equivalent scaling. The increasing complexity of design and process technologies, and ever-more complex design rules, also become hurdles for academic researchers, separating academic researchers from the most up-to-date technical issues.This thesis presents innovative methodologies and optimizations to address the above challenges. There are three directions in this thesis: (i) manufacturing-aware design technology co-optimization; (ii) advanced node design-based equivalent scaling; and (iii) an open source academic detailed routing flow.To realize manufacturing-aware design technology co-optimization, this thesis presents two works: (i) a multi-row detailed placement optimization for neighbor diffusion effect mitigation between neighboring standard cells; and (ii) a post-routing optimization to generate 2D block mask layout for dummy segment removal in self-aligned multiple patterning.To achieve advanced node design-based equivalent scaling, this thesis presents two improved physical design methodologies: (i) a post-placement flop tray generation approach for clock power reduction; and (ii) a detailed placement approach to exploit inter-row M1 routing for congestion and wirelength reduction.To address the increasing gap between academia and industry, this thesis presents two works toward an open source academic detailed routing flow: (i) a complete, robust, scalable and design ruleaware dynamic programming-based pin access analysis framework; and (ii) TritonRoute – the open source detailed router that is capable of delivering DRC-clean detailed routing solutions in advanced nodes.This thesis concludes with a summary of its contributions and open directions for future research

Structure discovery techniques for circuit design and process model visualization

Graphs are one of the most used abstractions in many knowledge fields because of the easy and flexibility by which graphs can represent relationships between objects. The pervasiveness of graphs in many disciplines means that huge amounts of data are available in graph form, allowing many opportunities for the extraction of useful structure from these graphs in order to produce insight into the data. In this thesis we introduce a series of techniques to resolve well-known challenges in the areas of digital circuit design and process mining. The underlying idea that ties all the approaches together is discovering structures in graphs. We show how many problems of practical importance in these areas can be solved utilizing both common and novel structure mining approaches. In the area of digital circuit design, this thesis proposes automatically discovering frequent, repetitive structures in a circuit netlist in order to improve the quality of physical planning. These structures can be used during floorplanning to produce regular designs, which are known to be highly efficient and economical. At the same time, detecting these repeating structures can exponentially reduce the total design time. The second focus of this thesis is in the area of the visualization of process models. Process mining is a recent area of research which centers on studying the behavior of real-life systems and their interactions with the environment. Complicated process models, however, hamper this goal. By discovering the important structures in these models, we propose a series of methods that can derive visualization-friendly process models with minimal loss in accuracy. In addition, and combining the areas of circuit design and process mining, this thesis opens the area of specification mining in asynchronous circuits. Instead of the usual design flow, which involves synthesizing circuits from specifications, our proposal discovers specifications from implemented circuits. This area allows for many opportunities for verification and re-synthesis of asynchronous circuits. The proposed methods have been tested using real-life benchmarks, and the quality of the results compared to the state-of-the-art.Els grafs són una de les representacions abstractes més comuns en molts camps de recerca, gràcies a la facilitat i flexibilitat amb la que poden representar relacions entre objectes. Aquesta popularitat fa que una gran quantitat de dades es puguin trobar en forma de graf, i obre moltes oportunitats per a extreure estructures d'aquest grafs, útils per tal de donar una intuïció millor de les dades subjacents. En aquesta tesi introduïm una sèrie de tècniques per resoldre reptes habitualment trobats en les àrees de disseny de circuits digitals i mineria de processos industrials. La idea comú sota tots els mètodes proposats es descobrir automàticament estructures en grafs. En la tesi es mostra que molts problemes trobats a la pràctica en aquestes àrees poden ser resolts utilitzant nous mètodes de descobriment d'estructures. En l'àrea de disseny de circuits, proposem descobrir, automàticament, estructures freqüents i repetitives en les definicions del circuit per tal de millorar la qualitat de les etapes posteriors de planificació física. Les estructures descobertes poden fer-se servir durant la planificació per produir dissenys regulars, que son molt més econòmics d'implementar. Al mateix temps, la descoberta i ús d'aquestes estructures pot reduir exponencialment el temps total de disseny. El segon punt focal d'aquesta tesi és en l'àrea de la visualització de models de processos industrials. La mineria de processos industrials es un tema jove de recerca que es centra en estudiar el comportament de sistemes reals i les interaccions d'aquests sistemes amb l'entorn. No obstant, quan d'aquest anàlisi s'obtenen models massa complexos visualment, l'estudi n'és problemàtic. Proposem una sèrie de mètodes que, gràcies al descobriment automàtic de les estructures més importants, poden generar models molt més fàcils de visualitzar que encara descriuen el comportament del sistema amb gran precisió. Combinant les àrees de disseny de circuits i mineria de processos, aquesta tesi també obre un nou tema de recerca: la mineria d'especificacions per circuits asíncrons. En l'estil de disseny asíncron habitual, sintetitzadors automàtics generen circuits a partir de les especificacions. En aquesta tesi proposem el pas invers: descobrir automàticament les especificacions de circuits ja implementats. Així, creem noves oportunitats per a la verificació i la re-síntesi de circuits asíncrons. Els mètodes proposats en aquesta tesi s'han validat fent servir dades obtingudes d'aplicacions pràctiques, i en comparem els resultats amb els mètodes existents

CAD methodologies for low power and reliable 3D ICs

The main objective of this dissertation is to explore and develop computer-aided-design (CAD) methodologies and optimization techniques for reliability, timing performance, and power consumption of through-silicon-via(TSV)-based and monolithic 3D IC designs. The 3D IC technology is a promising answer to the device scaling and interconnect problems that industry faces today. Yet, since multiple dies are stacked vertically in 3D ICs, new problems arise such as thermal, power delivery, and so on. New physical design methodologies and optimization techniques should be developed to address the problems and exploit the design freedom in 3D ICs. Towards the objective, this dissertation includes four research projects. The first project is on the co-optimization of traditional design metrics and reliability metrics for 3D ICs. It is well known that heat removal and power delivery are two major reliability concerns in 3D ICs. To alleviate thermal problem, two possible solutions have been proposed: thermal-through-silicon-vias (T-TSVs) and micro-fluidic-channel (MFC) based cooling. For power delivery, a complex power distribution network is required to deliver currents reliably to all parts of the 3D IC while suppressing the power supply noise to an acceptable level. However, these thermal and power networks pose major challenges in signal routability and congestion. In this project, a co-optimization methodology for signal, power, and thermal interconnects in 3D ICs is presented. The goal of the proposed approach is to improve signal, thermal, and power noise metrics and to provide fast and accurate design space explorations for early design stages. The second project is a study on 3D IC partition. For a 3D IC, the target circuit needs to be partitioned into multiple parts then mapped onto the dies. The partition style impacts design quality such as footprint, wirelength, timing, and so on. In this project, the design methodologies of 3D ICs with different partition styles are demonstrated. For the LEON3 multi-core microprocessor, three partitioning styles are compared: core-level, block-level, and gate-level. The design methodologies for such partitioning styles and their implications on the physical layout are discussed. Then, to perform timing optimizations for 3D ICs, two timing constraint generation methods are demonstrated that lead to different design quality. The third project is on the buffer insertion for timing optimization of 3D ICs. For high performance 3D ICs, it is crucial to perform thorough timing optimizations. Among timing optimization techniques, buffer insertion is known to be the most effective way. The TSVs have a large parasitic capacitance that increases the signal slew and the delay on the downstream. In this project, a slew-aware buffer insertion algorithm is developed that handles full 3D nets and considers TSV parasitics and slew effects on delay. Compared with the well-known van Ginneken algorithm and a commercial tool, the proposed algorithm finds buffering solutions with lower delay values and acceptable runtime overhead. The last project is on the ultra-high-density logic designs for monolithic 3D ICs. The nano-scale 3D interconnects available in monolithic 3D IC technology enable ultra-high-density device integration at the individual transistor-level. The benefits and challenges of monolithic 3D integration technology for logic designs are investigated. First, a 3D standard cell library for transistor-level monolithic 3D ICs is built and their timing and power behavior are characterized. Then, various interconnect options for monolithic 3D ICs that improve design quality are explored. Next, timing-closed, full-chip GDSII layouts are built and iso-performance power comparisons with 2D IC designs are performed. Important design metrics such as area, wirelength, timing, and power consumption are compared among transistor-level monolithic 3D, gate-level monolithic 3D, TSV-based 3D, and traditional 2D designs.PhDCommittee Chair: Lim, Sung Kyu; Committee Member: Bakir, Muhannad; Committee Member: Kim, Hyesoon; Committee Member: Lee, Hsien-Hsin; Committee Member: Mukhopadhyay, Saiba

Design, Extraction, and Optimization Tool Flows and Methodologies for Homogeneous and Heterogeneous Multi-Chip 2.5D Systems

Chip and packaging industries are making significant progress in 2.5D design as a result of increasing popularity of their application. In advanced high-density 2.5D packages, package redistribution layers become similar to chip Back-End-of-Line routing layers, and the gap between them scales down with pin density improvement. Chiplet-package interactions become significant and severely affect system performance and reliability. Moreover, 2.5D integration offers opportunities to apply novel design techniques. The traditional die-by-die design approach neither carefully considers these interactions nor fully exploits the cross-boundary design opportunities. This thesis presents chiplet-package cross-boundary design, extraction, analysis, and optimization tool flows and methodologies for high-density 2.5D packaging technologies. A holistic flow is presented that can capture all parasitics from chiplets and the package and improve system performance through iterative optimizations. Several design techniques are demonstrated for agile development and quick turn-around time. To validate the flow in silicon, a chip was taped out and studied in TSMC 65nm technology. As the holistic flow cannot handle heterogeneous technologies, in-context flows are presented. Three different flavors of the in-context flow are presented, which offer trade-offs between scalability and accuracy in heterogeneous 2.5D system designs. Inductance is an inseparable part of a package design. A holistic flow is presented that takes package inductance into account in timing analysis and optimization steps. Custom CAD tools are developed to make these flows compatible with the industry standard tools and the foundry model. To prove the effectiveness of the flows several design cases of an ARM Cortex-M0 are implemented for comparitive study