Microelectronics Process Engineering at San Jose State University: A Manufacturing-Oriented Interdisciplinary Degree Program

San Jose State University\u27s new interdisciplinary curriculum in Microelectronics Process Engineering is described. This baccalaureate program emphasizes hands-on thin-film fabrication experience, manufacturing methods such as statistical process control, and fundamentals of materials science and semiconductor device physics. Each course of the core laboratory sequence integrates fabrication knowledge with process engineering and manufacturing methods. The curriculum development process relies on clearly defined and detailed program and course learning objectives. We also briefly discuss our strategy of making process engineering experiences accessible for all engineering students through both Lab Module and Statistics Module series

Saxony's capital Dresden: On the way to become Eastern Germany's first Innovative Milieu?

In this paper, the chances of Saxonys capital city Dresden to become Eastern Germanys first high-tech-region is discussed. A presentation of the theoretical background of innovative milieux is followed by an overview of the regions universities, R&D institutes and other facilities relevant for milieu formation. Afterwards, the establishment of high-tech enterprises in the Dresden area is analyzed. The paper concludes giving a view of the regions further development potential. --

Microelectronic engineering education for emerging frontiers

With the support provided by the National Science Foundation and RIT Provost’s vision for providing flexible curricula, the department of Microelectronic Engineering has instituted new and enhanced program initiatives – (1) offering a semiconductor processing minor for other science and engineering programs promoting access to state-of-the art semiconductor fabrication facilities to students from other programs; (2) crafting a five course elective sequence within the existing curriculum by eliminating legacy material and course consolidation; (3) developing a concentration program in nanotechnology and MEMS; (4) outreach programs for targeting larger and diverse participation in preparing workforce for the nation’s future high tech industry; (5) enhance student learning through co-op and service. The mission is to generate multi faceted work force for the future semiconductor technologies and emerging frontiers spinning off from microelectronics, while simultaneously promoting enrollment particularly from women and minority students

Rapid Advance: High Technology in China in the Global Electronic Age

This study examines how a critical high technology industry in China, the semiconductor industry, advanced from being an isolated, centrally planned industry in the mid 1980s to being an important participant in the competitive global semiconductor industry after 2000. The research examines the most important trends, projects, and enterprises in China, with attention to China's global partners and China's rapidly growing role in the world economy. In the 1990s, semiconductor enterprises in China proactively made key structural changes and global linkages that set the stage for the industry's growth after 2000. The study thus provides an industry level assessment of how reforms and technological upgrading occurred in contemporary China, including the degree and character of so-called state led development. This research also shows that the development of this high technology industry had direct and positive effects on China's larger business environment and trade policies. Finally, this study compares the development of the semiconductor industry in China with its development in Japan, South Korea, and Taiwan, identifying differences in national approaches and the effects of the global information revolution

Adaptation of the Higher Education in Engineering to the Advanced Manufacturing Technologies

The 21st century will be the era of the fourth industrial revolution with the progressive introduction of the digital society, with smart/connected objects, smart factories driven by robotics, the Internet of Things (IoT) and artificial intelligence. Manufacturing should be performed by the industry entitled 4.0. These are advanced technologies resulting from steady development of information technology associated with new objects and systems that can fulfil manufacturing tasks. The industry 4.0 concept relies largely on the ability to design and manufacture smart and connected devices that are based on microelectronics technology. This evolution requires highly-skilled technicians, engineers and PhDs well prepared for research, development and manufacturing. Their training, which combines knowledge and the associated compulsory know-how, is becoming the main challenge for the academic world. The curricula must therefore contain the basic knowledge and associated know-how training in all the specialties in the field. The software and hardware used in microelectronics and its applications are becoming so complex and expensive that the most realistic solution for practical training is to share facilities and human resources. This approach has been adopted by the French microelectronics education network, which includes twelve joint university centres and 2 industrial unions. It makes it possible to minimize training costs and to train future graduates on up-to-date tools similar to those used in companies. Thus, this paper deals with the strategy adopted by the French network in order to meet the needs of the future industry 4.0

Rapid Advance: High Technology in China in the Global Electronic Age

This study examines how a critical high technology industry in China, the semiconductor industry, advanced from being an isolated, centrally planned industry in the mid 1980s to being an important participant in the competitive global semiconductor industry after 2000. The research examines the most important trends, projects, and enterprises in China, with attention to China's global partners and China's rapidly growing role in the world economy. In the 1990s, semiconductor enterprises in China proactively made key structural changes and global linkages that set the stage for the industry's growth after 2000. The study thus provides an industry level assessment of how reforms and technological upgrading occurred in contemporary China, including the degree and character of so-called state led development. This research also shows that the development of this high technology industry had direct and positive effects on China's larger business environment and trade policies. Finally, this study compares the development of the semiconductor industry in China with its development in Japan, South Korea, and Taiwan, identifying differences in national approaches and the effects of the global information revolution

Development in Electronic Packaging – Moving to 3D System Configuration

The electronic industry is reducing package dimensions of components as well as complete electronics systems. Surface mount device passives and semiconductor chips have to be mounted together bringing a functional system that must realize the required function with necessary reliability and acceptable price. To make up a reliable and cost effective system, the size and weight is being reduced by employing lower voltages and higher speeds. For example, the typical size of SMD passives 30 years ago was 1206 when they were first introduced. Generally, all components including electrical joints are becoming miniaturized and smaller. The industry is moving toward a reduced size of 0201 and 01005 for passives, new fine pitch packages for actives, but the PCB now feature limits for further integration. System on Package (SOP) is one way to reach the three-dimensional package concept where components will be placed in three-dimensional configuration. A similar concepts are “Package on Package” (PoP) or ”Package in Package” (PiP)

Processor Problems: An Economic Analysis of the Ongoing Chip Shortage and International Policy Response

The ongoing microchip shortage was caused by several factors from an economic perspective, both supply-side and demand-side. These included COVID-induced factory shutdowns, differing inventory management strategies, recurring government stimulus checks, and volatile supply chains. I used the Aggregate Supply/Aggregate Demand model from macroeconomic theory in order to characterize the microchip industry and its many runoffs (transportation, personal electronics, etc.) as an aggregate in order to study their impacts on big-picture variables such as real GDP and inflation. Federal Reserve Economic Data shows some correlation between the Producer Price Index (PPI) for semiconductors and the Consumer Price Index for Urban Goods (a way of measuring relative, non-rural inflation over time). In addition, current monetary policy strategies for inflation that omit changes in the money supply and instead focus on interest rates. Therefore, inflation management strategies that increase interest rates would best be paired with domestic incentives such as subsidies to firms producing on U.S. soil

Framework for future technology relationships with Japanese businesses

Includes bibliographical references.Richard L. Thurston

Compact thermal models of semiconductor devices – a review

In the paper the problem of modelling thermal properties of semiconductor devices with the use of compact models is presented. This class of models is defined and their development over the past dozens of years is described. Possibilities of modelling thermal phenomena both in discrete semiconductor devices, monolithic integrated circuits, power modules and selected electronic circuits are presented. The problem of the usefulness range of compact thermal models in the analysis of electronic elements and circuits is discussed on the basis of investigations performed in Gdynia Maritime University